Visit these sections more specific information.
This section provides substantial background information about this guide and how it can be used at you company.
2.0 Basic Procedures
This section covers handling, cleaning, coatings, legend, and use of epoxies.
3.0 Base Board Procedures
This section covers repair of delamination, warp, key slots, non plated holes, surface defects, and various defects to base board material.
4.0 Conductor Procedures
This section covers repair and rework of conductors including circuits, lands, gold contacts, surface mount pads, and BGA pads.
5.0 Plated Hole Procedures
This section covers various methods for plated hole repair.
6.0 Jumper Wires and Component Modification Procedures
This section includes excellent procedures for adding jumper wires and performing various component modifications.
7.0 Soldering Procedures
This section includes procedures for soldering a variety of component types including chip components, J lead components and gull wing components.
8.0 Rework Procedures
This section includes procedures for removing a variety of component types including chip components, J lead components, and gull wing components.
9.0 BGA Rework Procedures
This section includes procedures for removing and replacing BGA components.