Welcome to our comprehensive guidebook coveing circuit board and electronic component repair, rework, and modification.
List of procedures covering handling, cleaning, coatings, baking, legends, and epoxy mixing.
Procedure covers ESD, EOS, safe work areas and handling and storage methods.
Procedure outlines various cleaning methods for circuit board assemblies.
Procedure covers localized cleaning of circuit board assemblies.
Procedure covers aqueous batch cleaning of circuit board assemblies.
Procedure covers the techniques for identifying various circuit board coatings.
Procedure covers the methods for removal of coatings on circuit board assemblies using solvents.
Procedure covers the methods for removal of thick coatings on circuit board assemblies using a peeling method.
Procedure covers the methods for removal of coatings on circuit board assemblies using heat to overcure the coating.
Procedure covers the methods for removal of coatings on circuit boards assemblies using various grinding and scraping processes.
Procedure covers the methods for removal of coatings on circuit boards assemblies using a micro abrasive blasting system.
Procedure covers the methods for replacement of coatings and solder mask on circuit board assemblies.
Procedure covers the methods for replacement of conformal coatings on circuit board assemblies.
Procedure covers the methods for replacement of of solder mask on circuit board assemblies at BGA component locations.
Procedure covers baking and heating methods for circuit board assemblies.
Procedure covers the methods for repair and replacement of legend and markings on circuit boards assemblies.
Procedure covers the methods for repair and replacement of legend and markings on circuit board assemblies
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
Procedures covering method for epoxy mixing for use on circuit board assemblies.
Procedures covering bow and twist repair, repair of non-plated holes and slots and base board repair.
Procedure covers delamination and blister repair on circuit board assemblies.
This procedure covering bow and twist repair on circuit board assemblies.
This procedure covers minor repair of non-plated holes on circuit board assemblies.
This procedures covers major repair of damage to non-plated holes on circuit board assemblies.
This procedure covers minor repair of key slots on circuit board assemblies.
This procedure covers major repair of key slots on circuit board assemblies.
Procedure covers minor repair of damaged base board around edges on circuit board assemblies.
This procedure covers major repair of damaged base board within the inner area on circuit board assemblies.
This procedure covers major repair of damaged base board around edges on circuit board assemblies.
Procedures cover repair of conductors, lands, pads, edge contacts, surface and internal circuits.
Procedure to repair lifted conductors and circuits using liquid epoxy.
Procedure to repair lifted conductors and circuits using a dry film epoxy method.
Procedure covers repair of damaged conductors and circuits using liquid epoxy.
Procedure covers repair of damaged conductors and circuits using a dry film epoxy method.
Procedure covers repair of damaged conductors and circuits using a welding method.
Procedure covers repair of damaged conductors and circuits using a surface jumper wire.
Procedure covers repair of damaged conductors and circuits using a jumper wire feeding through the circuit board assembly.
Procedure covers repair damaged conductors and circuits on inner layers on circuit board assemblies.
Procedure covers repair of damage to surface ground planes on circuit board assemblies.
Procedure covers methods to cut surface conductors on circuit board assemblies.
Procedure covers method to cut inner layer conductors and circuits on circuit board assemblies.
Procedure covers method to delete connections at a plated through hole on circuit board assemblies.
Procedure covers the method to delete connections at a plated through hole by cutting the plated hole traces.
Procedure covers method to repair lifted lands on circuit board assemblies using liquid epoxy.
Procedure covers method to repair lifted lands on circuit board assemblies using dry film adhesive.
Procedure covers method to repair damaged lands on circuit board assemblies using liquid epoxy.
Procedure covers method to repair damaged lands on circuit board assemblies using dry film adhesive.
Procedure covers method to repair damaged edge contacts on circuit board assemblies using liquid epoxy.
Procedure covers method to repair damaged edge contacts on circuit board assemblies using dry film adhesive.
Procedure covers method to repair damaged to the plating of edge contacts on circuit board assemblies.
This procedure covers a method to repair damaged surface mount pads on circuit board assemblies using liquid epoxy.
Procedure covers method to repair damaged surface mount pads on circuit board assemblies using dry film adhesive.
Procedure covers method to repair damaged BGA pads on circuit board assemblies using dry film adhesive.
Procedure covers method to repair damaged BGA pads that have an integral via on circuit board assemblies.
Procedure covers method to repair damaged BGA pads that have an integral via on circuit board assemblies.
Procedure covers method to repair damaged surface mount pads on circuit board assemblies using dry film adhesive.
List of procedures to repair damaged plated holes on circuit board assemblies.
Procedure to repair damaged plated holes without inner layer connections on circuit board assemblies.
Procedure to repair damaged plated holes that have an inner inner layer connection on circuit board assemblies.
Procedure to repair damaged plated holes that have an inner inner layer connection on circuit board assemblies.
List of procedures covering jumper wires, modifications, and component lead cutting and lifting.
Procedure covers methods for using jumper wires on circuit board assemblies.
Procedure covers methods for using circuit tracks at BGA locations on circuit board assemblies.
Procedure covers methods for using jumper wires at BGA locations on circuit board assemblies.
Procedure covers various component modifications and additions on circuit board assemblies.
Procedure covers methods for cutting and lifting component leads on circuit board assemblies.
Procedure covers methods for triming and forming leads on electronic components.
Procedures including soldering basics, acceptance criteria, and soldering of through hole and surface mount components.
Procedure covers the basic concepts for high quality soldering on circuit board assemblies.
Procedure covers preparation prior to soldering and component removal on circuit board assemblies.
Page covers includes tables and illustrations covering solder joint acceptance criteria on circuit board assemblies.
Procedure covers soldering of through hole components using point to point hand soldering.
Procedure covers soldering of through hole components on circuit board assemblies using a solder fountain system.
Procedure covers soldering of surface mount chip components on circuit board assemblies using a point to point soldering method.
Procedure covers soldering of surface mount chip components on circuit board assemblies using a hot gas method.
Procedure covers soldering of surface mount J lead components on circuit board assemblies using a point to point soldering method.
The procedure covers the soldering of surface-mount J-lead components using a continuous-flow soldering method.
Procedure covers soldering of surface mount J lead components on circuit board assemblies using a hot gas method.
Procedure covers soldering of surface mount gull wing components on circuit board assemblies using a point to point soldering method.
Procedure covers soldering of surface mount gull wing components on circuit board assemblies using a continuous flow soldering method.
Procedure covers soldering of surface mount gull wing components on circuit board assemblies using a hot gas method.
List of procedures covering removal of through hole, chip and surface components.
Procedure covers removal of through hole components on assembled circuit boards using a point to point vacuum method.
Procedure covers removal of through hole components on circuit board assemblies using a solder fountain system.
Procedure covers removal of surface mount chip components on circuit board assemblies using a forked tip method.
Procedure covers removal of surface mount chip components on circuit board assemblies using a hot tweezer method.
Procedure covers removal of surface mount J lead components on circuit board assemblies using a conduction method.
Procedure covers removal of surface mount J lead components on circuit board assemblies using a hot gas method.
Procedure covers removal of surface mount gull wing components on circuit board assemblies using a conduction method.
Procedure covers removal of surface mount gull wing components on circuit board assemblies using a hot gas method.
List of procedures covering BGA component rework and reballing on circuit board assemblies.
Procedure reviews the component review process prior to reworking BGA components on circuit board assemblies.
Procedure covers guidelines for inspection of reworked BGA components on circuit board assemblies.
Procedure covers guidelines for inspection of reballed BGA components.
Procedure covers process steps to develop a BGA rework profile on circuit board assemblies.
Procedure covers process steps to develop a BGA rework profile on circuit board assemblies.
Procedure covers methods for BGA component rework on circuit board assemblies.
Procedure covers BGA component reballing using solder braid ball removal and mini-oven attachment.
Procedure covers BGA component reballing using solder braid ball removal and reflow oven attachment.
Procedure covers BGA component reballing using robotic ball removal and mini-oven attachment.
Procedure covers BGA component reballing using robotic ball removal and reflow oven attachment.
Procedure covers the process for removing a BGA component that was installed using non-reworkable underfill.
List of procedures covering reclaiming for various component types.
The guide covers the basic requirements for reclaiming components for reuse.
This procedure outlines the process for reclaiming chip components for reuse.
The guide covers the basic requirements for reclaiming electronic components for reuse.
The guide covers the basic requirements for reclaiming axial lead components for reuse.
This procedure outlines the process for reclaiming J-Lead components for reuse.
This procedure outlines the process for reclaiming gull wing components for reuse.
This procedure outlines the process for reclaiming leadless components for reuse.
This procedure outlines the process for reclaiming through-hole components for reuse.
This procedure outlines the process for reclaiming BGA components for reuse.
List of procedures covering tinning for various component types.
The guide covers the basic requirements for replacing the finish on various types of electronic component leads.
This procedure covers robotic tinning of chip and discrete components.
This procedure covers robotic tinning of radial lead components.
This procedure covers robotic tinning of axial lead components.
This procedure covers robotic tinning of J-Lead components.
This procedure covers robotic tinning of gull wing components, including QFP and PLCC components.
This procedure covers robotic tinning of leadless components, including QFN and DFN components.
This procedure covers robotic tinning of through-hole connectors.
Comprehensive list of tools and materials for high-reliability circuit board repair, rework, and modification.
