2.0 Basic Procedures
List of procedures covering handling, cleaning, coating removal, coating replacement, solder mask repair, baking, preheating, legend, marking, and epoxy mixing.
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2.1 Handling Electronic Assemblies
Procedure includes electrostatic discharge (ESD),
electrical overstress (EOS), ESD/EOS safe work areas, and handling and storage methods.
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2.2 Cleaning
Procedure covers local cleaning and cleaning using an aqueous batch process for circuit boards.
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2.2.1 Cleaning, Local
Procedure covers local cleaning for circuit boards.
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2.2.2 Cleaning, Aqueous Batch Process
Procedure covers cleaning using an aqueous batch process for circuit boards.
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2.3.1 Coating Removal, Identification of Coating
This procedure covers the techniques for identifying various coatings so that the appropriate coating removal method can be selected.
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2.3.2 Coating Removal, Solvent Method
Procedure covers the methods for removal of coatings on circuit boards.
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2.3.3 Coating Removal, Peeling Method
Procedure covers the methods for removal of coatings on circuit boards.
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2.3.4 Coating Removal, Thermal Method
Procedure covers the methods for removal of coatings on circuit boards.
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2.3.5 Coating Removal, Grinding/Scraping Method
Procedure covers the methods for removal of coatings on circuit boards.
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2.3.6 Coating Removal, Micro Blasting Method
Procedure covers the methods for removal of coatings on circuit boards.
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2.4.1 Coating Replacement, Solder Mask
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
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2.4.2 Coating Replacement, Conformal Coating, Encapsulant
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
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2.4.3 Coating Replacement, Solder Mask, BGA Locations
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
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2.5 Baking and Preheating
Procedure covers baking and heating of circuit boards.
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2.6.1 Legend/Marking, Stamping Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
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2.6.2 Legend Marking, Hand Lettering Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
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2.6.3 Legend Marking, Stencil Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
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2.7 Epoxy Mixing and Handling
Procedures covering methods for epoxy mixing for work on circuit boards.
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