9.5.1 BGA Component Removal, Machining Method

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Outline

This procedure is used to remove BGA devices that have been underfilled with non-reworkable epoxy underfill.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Tools, Materials and Supplies

Abrader
Mild abrasive for removing oxides and contaminants.

Cleaner
General purpose cleaner for removing contamination.

Desolder Braid
Woven copper wire designed to wick solder from surfaces and holes.

End Mills
Designed for end cutting and hole boring.

High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.

Microscope
Precision microscope with stand and lighting for work and inspection.

Milling Machine
Use for precision milling of circuit board materials.

Soldering Iron
Properly maintained soldering iron and properly sized soldering iron tips.

Procedure

Enclose the circuit board assembly in a static barrier bag. Cut an opening in the bag to expose the underfilled device to be removed, and seal the edges to the circuit board with high-temperature tape.
Secure the circuit board assembly with appropriate tooling and fixtures to the base of the milling machine. Set up a microscope to observe the milling operation.
Caution: Check to ensure the circuit board is rigidly secured in place and parallel to the milling machine base. Proper fixturing to hold and support the circuit board assembly is critical.
Install the appropriate end mill into the chuck of the milling machine and set the speed as required.
Set up a vacuum system close to the milling area to remove dust and debris during the milling operation.
Begin machining off the BGA device body, removing approximately .010 inches per pass. Repeat the milling process, removing .010" thick layers until the entire body of the device has been machined away and the underfill epoxy is exposed.
Begin machining off the underfill epoxy, removing .002" to .003" thick layers. Repeat the milling process, removing .002" to .003" per pass until there is approximately a .010" thick layer of underfill remaining on the circuit board surface. Vacuum all debris.
Remove the circuit board assembly from the milling machine.
Use Solder Braid and wick the remaining solder in each underfill pocket, exposing each of the pads on the circuit board surface.
Re-install the circuit board assembly to the base of the milling machine.
Continue machining the remaining underfill, removing .001" per pass until there is a .003" to .005" thick layer of underfill remaining.
Caution: Exercise care to avoid machining through the underfill, damaging the solder mask, pads, or surface traces.
Remove the board from the static bag and clean the area and circuit board as needed.

9.5.1 BGA Component Removal, Machining Method

Procedure covers the process for removing a BGA component that was installed using non-reworkable underfill. Minimum Skill Level: Expert Conformance Level: High

Procedure covers the process for removing a BGA component that was installed using non-reworkable underfill.

Minimum Skill Level: Expert
Conformance Level: High