Circuit Technology Center

6.2.2 Jumper Wires, BGA Components, Through Board Method

This method is used to add a jumper at a BGA site by running the jumper through a hole in the board. This method is normally used for engineering changes or modifications.

Note: This procedure requires precision milling equipment and highly trained technicians. This method is used when there is a buried via, and other methods of terminating to the opposite side are not an option.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-600 2.0 Externally Observable Characteristics
IPC-A-610 10.0 Discrete Wiring
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
2.7 Epoxy Mixing and Handling
6.1 Jumper Wires
9.0 BGA Rework Procedures
Kits and Systems
Precision Tool Set
Nine precision-crafted tools for detailed circuit board work.
Tools and Materials
Circuit Frames
Circuit Frames
Circuit Tracks
Copper conductors to repair circuit board damage including traces and conductors.
Circuit Bond Epoxy
Clear, superior strength epoxy in two-compartment plastic packages.
High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.
Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.
Scraper, Curved Tip
Hardened stainless steel tip for scraping solder mask and removing defects.
Additional Items and Supplies
General purpose cleaner for removing contamination.
End Mills
End Mills
Designed for end cutting and hole boring.
Precision microscope with stand and lighting for work and inspection.
Milling Machine
Milling Machine
Use for precision milling of circuit board materials.
General purpose oven for drying, baking and curing epoxies.
Precision Drill
Precision drill press for accuracy and controlled depth drilling.
Solderinmg Iron
Soldering Iron
Properly maintained soldering iron and properly sized soldering iron tips.
Hot Plate
Multiple sizes and tip configurations of tweezers for various small parts handling needs.
Nonabrasive, low-linting wipes for cleanup.
Circuit Bond Epoxy
Circuit Bond is a clear, low viscosity, superior strength epoxy precisely measured out into two-compartment plastic packages, so it's easy to use, and there's no measuring. For over a decade, this high-strength epoxy has been qualified and used by thousands of high-rel electronics manufacturers across the globe.
1. Circuit Bond has a working pot life of 30 minutes. It should not be mixed until ready to use.
2. To use Circuit Bond, remove the plastic clip separating the resin and hardener. Squeeze back and forth from one half of the package to the other to mix the contents.
3. Cut a corner off the package and squeeze all the contents into a Plastic Cup. Stir the contents to ensure it is thoroughly mixed.
4. Circuit Bond may contain bubbles from the mixing process. If needed, use a vacuum system to remove bubbles.
5. Color Agent can be mixed in with Circuit Bond to match surface colors if desired.
6. Apply using a Foam Swab, Micro Probe, or Mixing Stick as required.
7. Cure Circuit Bond for 24 hours at room temperature or 4 hours at 65°C (150°F).
Packaging2 gram pre-measured packages
Mix ratio4 parts resin to 1 part hardener
Mix Ratio by Weight (R/H)100/25
ColorClear, transparent
Pot life30 minutes
Cure cycle24 hours at room temp (25 °C) or 4 hours @ 65°C
Thixotropic Index1
Specific Gravity1.20
Percent Solids100%
Viscosity (after mixing)2000 cps
Operating temperature range-55°C to 135°C
Hardness88 Shore D
Lap Shear, Alum to Alum1100 psi
Glass Transition Temperature, Ultimate92°C
Coefficient of Expansion, cm/cm/°C6 E-05
Dielectric strength400 volts/mil
Dielectric Constant, 1KHz@25°C4
Shelf Life6 months minimum
Circuit Frames
Circuit Frames have a dry-film adhesive backing that is heat-cured in 30 seconds. Use Circuit Frames to repair and replace damaged surface mount pads, lands and conductors without the mess of liquid epoxy, with a bond strength equal to the original, in just a few minutes. The dry-film adhesive backing makes this delicate repair procedure easy, fast, and highly reliable. Circuit Frames are available with a bright tin, tin/lead and nickel/gold plating finishes. This reliable IPC recommended procedure meets the highest conformance level for this type of repair. For over 30 years Circuit Frames have been used by thousands of commercial, medical and military manufacturers around the globe. Below are examples for some Circuit Frame patterns.
Circuit Tracks
Circuit Tracks are rectangular-shaped conductors made of 99.9% pure CDA 11000 copper. These rectangular ribbons closely conform to the original conductor dimensions. The replacement Circuit Track is bonded in place using epoxy.
Part No. Size
115-5204 115-5204 Circuit Track, .002" x .004" (.051 mm x .102 mm)
115-5205 115-5205 Circuit Track, .002" x .005" (.051 mm x .127 mm)
115-5206 115-5206 Circuit Track, .002" x .006" (.051 mm x .152 mm)
115-5208 115-5208 Circuit Track, .002" x .008" (.051 mm x .203 mm)
115-5210 115-5210 Circuit Track, .002" x .010" (.051 mm x .254 mm)
115-5312 115-5312 Circuit Track, .003" x .012" (.076 mm x .305 mm)
115-5315 115-5315 Circuit Track, .003" x .015" (.076 mm x .381 mm)
115-5520 115-5520 Circuit Track, .005" x .020" (.127 mm x .508 mm)
115-5530 115-5530 Circuit Track, .005" x .030" (.127 mm x .762 mm)
Images and Figures
6.2.2 Jumper Wires, BGA Components, Through Board Method
Figure 1: Mill a hole through the board and insert a Teflon sleeve.
6.2.2 Jumper Wires, BGA Components, Through Board Method
Figure 2: Insert a copper Circuit Track into the plated hole and Teflon sleeve.
6.2.2 Jumper Wires, BGA Components, Through Board Method
Figure 3: Solder the Circuit Track to the plated hole connected to the BGA pad.

6.2.2 Jumper Wires, BGA Components, Through Board Method
Figure 4: Overcoat the new connection with epoxy.
  1. Clean the area.
  2. Remove the BGA component if installed, remove excess solder from the pads, and clean and inspect the site.
  3. Remove solder mask from the via pad terminating to the subject BGA pad. Do not remove any solder mask from the "dog bone" area.
  4. Mill a hole through the board at the precise coordinates using a Precision Drill System and End Mill of the appropriate size. (See Figure 1 and 5)
    Note: Although both power and ground planes may be cut, inner layer signal traces must be avoided.
  5. Carefully inspect the milled hole and clean the area.
  6. Insert an appropriately sized Teflon sleeve into the milled hole. This sleeve will insulate the new conductor and prevent shorting to the inner layers. (See Figure 1)
  7. Select a Circuit Track to match the width of the circuit to be installed. Cut a length approximately as needed. The overlap solder connection should be a minimum of 2 times the circuit width.
  8. Gently abrade the top and bottom of the new Circuit Track with the buffer to remove any oxidation and clean.
    Note: If needed, the ends of the Circuit Track may be tinned with solder prior to lap soldering in place.
  9. Insert one end of the Circuit Track into the plated hole connected to the BGA pad. Insert the opposite end through the Teflon sleeve. (See Figure 2)
  10. Apply a small amount of liquid flux and lap solder the Circuit Track to the plated hole connected to the BGA pad using solder and a soldering iron. Make sure the new circuit is properly aligned. (See Figure 3)
  11. Clean the area.
  12. Mix epoxy per procedure 2.7.
  13. Coat the top and sides of the new circuit with epoxy. The epoxy bonds the new circuit to the base board material and insulates the circuit. (See Figure 4)
    Note: Keep the epoxy height below the BGA pad level.
    Caution: Some components may be sensitive to high temperatures.
  14. Clean the board as required.
  15. Install new BGA per applicable procedures.
  16. Solder a jumper wire to the exposed Circuit Track on the opposite side of the circuit board. Route and terminate the jumper wire as needed.
  1. Visual examination for alignment and overlap of the new circuit.
  2. Visual examination of epoxy coating for texture and color match.
  3. Electrical tests as applicable.
Procedure for reference only.