Circuit Board Rework and Repair, Component Tinning, and Reballing

Circuit Technology Center is recognized as the world's most innovative and reliable specialist in circuit board repair, rework, and component-level modification services.

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rework
Trusted worldwide for precision board rework, with 40+ years of expertise and IPC-certified techs.
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repair
Globally recognized circuit board repair experts, backed by comprehensive online procedures.
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reclaim
Hot gas removal and robotic thinning ensures reclaimed components meet full compliance.
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Trusted Experts in Circuit Board Rework, Repair, and Component Reclamation
Decades of proven experience, unmatched quality, and a satisfaction guarantee trusted by top commercial and military manufacturers.
Experience

We are the world's largest and most experienced company specializing in repair and rework services for assembled circuit boards.

Quality

And our technicians are world-class experts. Their skills have been gained through decades of hands-on experience.

Reliability

Our skill and reputation have earned us the trust of hundreds of the most demanding commercial and military manufacturers.

Time

We know the importance of deadlines. We do everything we can to meet your strict delivery and time schedules.

Savings

We start by analyzing each project and then confirm to you the exact cost and schedule before we do any work.

Guarantee

Our work is unconditionally guaranteed. If you're not completely satisfied, we'll provide a complete refund.

The Economics of Electronic Component Salvage and Reuse
Keys to Component Lead Tinning Success
Essential Practices for Gold Mitigation of Electronic Components
The Essential Guide for High-Reliability BGA Component Re-balling
Avoiding the 6 Most Common Mistakes in BGA Rework
10 Essential Rules for Circuit Board Jumper Wires
Critical Considerations for Tin Whisker Mitigation
The Economics of Electronic Component Salvage and Reuse

This paper explores the economic and environmental benefits of reclaiming high-value components. It outlines key recovery steps and demonstrates how reuse reduces costs, conserves energy, and supports sustainability goals.

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Keys to Component Lead Tinning Success

This paper explores the challenges and best practices of component tinning, emphasizing temperature control, flux selection, and soldering techniques. It offers practical guidance to help professionals ensure reliable tinning and maintain component integrity.

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Essential Practices for Gold Mitigation of Electronic Components

This paper examines the critical issue of gold embrittlement, a significant reliability concern in electronics. The paper explores various essential practices to mitigate the use of gold using the robotic hot solder dipping (RHSD) process.

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The Essential Guide for High-Reliability BGA Component Re-balling

This paper outlines best practices and challenges in reballing Ball Grid Array (BGA) components. It covers techniques, alignment, solder ball selection, and thermal profiling to ensure reliable connections in BGA rework and reuse.

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Avoiding the 6 Most Common Mistakes in BGA Rework

This paper identifies six common mistakes in BGA rework and offers guidance to avoid them. By addressing these issues, technicians can improve yield, reduce rework cycles, and achieve more consistent, cost-effective results in assembly and repair.

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10 Essential Rules for Circuit Board Jumper Wires

This paper outlines ten essential rules for attaching and routing jumper wires in circuit board assemblies. It emphasizes best practices to ensure secure, organized, and reliable connections that meet industry standards for quality and performance.

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Critical Considerations for Tin Whisker Mitigation

This paper analyzes the risks posed by tin whiskers in electronics and outlines key mitigation strategies. It explores factors influencing whisker growth and reviews techniques like alloying, coatings, and reinforcement to prevent failures.

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