3.0 Base Board Procedures
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3.0 Base Board Procedures
List of procedures covering delamination and blister repair, bow and twist repair, repair of non-plated holes and slots, and base board repair on circuit boards.
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3.1 Delamination/Blister Repair, Injection Method
Procedure covers delamination and blister repair on circuit boards.
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3.2 Bow and Twist Repair
Procedure covers bow and twist repair on circuit boards.
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3.3.1 Hole Repair, Epoxy Method
Procedure covers the repair of non-plated holes on circuit boards.
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3.3.2 Hole Repair, Transplant Method
Procedure covers the repair of non-plated holes on circuit boards.
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3.4.1 Key and Slot Repair, Epoxy Method
Procedure covers the repair of slots on circuit boards.
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3.4.2 Key and Slot Repair, Transplant Method
Procedure covers the repair of slots on circuit boards.
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3.5.1 Base Material Repair, Epoxy Method
Procedure covers the repair of damaged base board on circuit boards.
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3.5.2 Base Material Repair, Area Transplant Method
Procedure covers the repair of damaged base board on circuit boards.
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3.5.3 Base Material Repair, Edge Transplant Method
Procedure covers the repair of damaged base board on circuit boards.
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Procedure for reference only.
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