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3.0 Base Board Procedures

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3.0 Base Board Procedures
List of procedures covering delamination and blister repair, bow and twist repair, repair of non-plated holes and slots and base board repair on circuit boards.
3.1 Delamination/Blister Repair, Injection Method
Procedures covering delamination and blister repair on circuit boards.
3.2 Bow and Twist Repair
Procedures covering bow and twist repair on circuit boards.
3.3.1 Hole Repair, Epoxy Method
Procedures covers repair of non-plated holes on circuit boards.
3.3.2 Hole Repair, Transplant Method
Procedures covers repair of non-plated holes on circuit boards.
3.4.1 Key and Slot Repair, Epoxy Method
Procedure covers repair of slots on circuit boards.
3.4.2 Key and Slot Repair, Transplant Method
Procedure covers repair of slots on circuit boards.
3.5.1 Base Material Repair, Epoxy Method
Procedure covers repair of damaged base board on circuit boards.
3.5.2 Base Material Repair, Area Transplant Method
Procedure covers repair of damaged base board on circuit boards.
3.5.3 Base Material Repair, Edge Transplant Method
Procedure covers repair of damaged base board on circuit boards.
Procedure for reference only.