3.0 Base Board Repair Procedures

The guides in this section detail multiple base board related repairs. It includes delamination/blister correction using injection, bow and twist straightening, and various surface material repairs using epoxy for minor damage repairs and transplants for major repairs. These procedures target structural integrity, dimensional accuracy, and functional reliability, whether correcting warpage, restoring hole integrity, repairing board edges, or replacing damaged material areas. Each method specifies when to use minor versus major repair approaches to ensure proper restoration and long-term durability.

3.1 Delamination/Blister Repair, Injection Method

Procedure covers delamination and blister repair on circuit board assemblies.

3.2 Bow and Twist Repair

This procedure covering bow and twist repair on circuit board assemblies.

3.3.1 Hole Repair, Epoxy Method

This procedure covers minor repair of non-plated holes on circuit board assemblies.

3.3.2 Hole Repair, Transplant Method

This procedures covers major repair of damage to non-plated holes on circuit board assemblies.

3.4.1 Key and Slot Repair, Epoxy Method

This procedure covers minor repair of key slots on circuit board assemblies.

3.4.2 Key and Slot Repair, Transplant Method

This procedure covers major repair of key slots on circuit board assemblies.

3.5.1 Base Material Repair, Epoxy Method

Procedure covers minor repair of damaged base board around edges on circuit board assemblies.

3.5.2 Base Material Repair, Area Transplant Method

This procedure covers major repair of damaged base board within the inner area on circuit board assemblies.

3.5.3 Base Material Repair, Edge Transplant Method

This procedure covers major repair of damaged base board around edges on circuit board assemblies.