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BGA Component Reballing

Our high-reliability BGA Reballing service can quickly rework BGA components that require reballing. Reballing is most often required when the alloy of the BGA component solder balls needs to be changed from lead-free to leaded. Every BGA Reballing project is completed to meet IPC and JEDEC specifications.

We use reliable, repeatable, and industry-wide proven processes to reball BGA components in compliance with the following.
  • J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
  • GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
  • IEC TS 62647-4 Process management for avionics - Aerospace and defense electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
We can perform ball-attach to LGA and QFN devices. BGA component reballing services are available for BGA components with 0.4 mm pitch and up.

Post reball verification and inspection services include shear testing, XRF alloy verification, visual inspection to confirm sphere condition, ball alignment, size and location, x-ray inspection for excessive voiding and component marking using thermally printed labels or laser marking.

In addition to BGA component reballing, we have 7 top-line Air-Vac BGA rework systems and a fully trained staff of engineers and operators to support your BGA component rework needs.

This combination of BGA component reballing services and BGA component rework services provides you with a single source to meet project demands and tight schedules while meeting the highest quality standards. We're recognized as an industry leader in BGA services and have been qualified by companies around the world.

Whether you have one board or one thousand boards for rework, we're the company to turn to for BGA rework and reballing services. All projects are completed in our modern, fully compliant facility.

In house post processing testing capabilities include:
  • Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
  • XRF for alloy composition and finish thickness per JESD 213
  • X-ray inspection for solder ball void analysis per J-STD-001
  • Solderability testing per J-STD-002
  • Visual inspection
Other available testing services include:
  • SAM (scanning acoustic microscopy) testing per J-STD-035
  • Ball shear testing per JESD22-B117
  • Destructive physical analysis (DPA) per MIL-STD-1580
  • Hermeticity testing (fine and gross leak) per MIL-STD-883
  • Temperature, humidity and bias testing
  • Parametric testing
Component Marking and Packaging Services include:
  • Laser marking
  • Ink dot marking
  • Component labeling
  • Tape and Reel service per EIA 481
  • Component dry baked per J-Std-033
  • Component packaging per J-Std-020
Learn About Our Component Tinning Services

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