Our BGA Reballing service offers fast and precise rework for Ball Grid Array (BGA) components that require solder ball replacement. Whether converting from lead-free to leaded solder or ensuring consistent performance, we follow proven processes that strictly comply with IPC and JEDEC standards. With advanced Air-Vac systems and expert technicians, we deliver high-reliability results for even the most demanding projects. From inspection to final verification, we ensure every component meets rigorous quality requirements, making us a trusted partner for industries that cannot compromise on reliability.
Key Highlights
- Strict adherence to IPC and JEDEC standards
- Proven, repeatable processes trusted worldwide
- Advanced Air-Vac BGA rework systems
- Multi-zone reflow ovens to meet industry specifications
- Precision custom tooling used, not adjustable, inaccurate tooling
- Comprehensive verification, including shear testing, XRF alloy checks, visual, and X-ray inspection
- Expertise across BGA, LGA, and QFN devices
- Skilled engineering and operator team ensuring precision and efficiency
- Trusted by global clients for critical rework needs
Technical Specifications
- Capable of reballing BGAs with 0.4 mm pitch and larger
- Ball-attach services available for LGA and QFN packages
- Conformance to J-STD-001, GEIA-STD-0006, IEC TS 62647-4, and IPC 7711/7721
- Post-reball verification and inspection options, including shear testing, XRF, alloy verification, visual Inspection, X-ray inspection, and component marking
- Reball fixtures are custom-machined, not adjustable to maintain tolerances
- Two inline Heller reflow ovens and 8 Martin Reball Mini-Ovens
Compliance / References
- 9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
- 9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
- 9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
- 9.4.4 BGA Component Reballing, Robotic Ball Removal, Reflow Oven Attachment Method
- 9.5.1 BGA Component Removal, Machining Method
- GEIA-STD-0006-Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
- IPC 7711/7721 Rework, Modification, and Repair of Electronic Assemblies
- IPC-JEDEC-J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
- IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
- IPC-J-STD-002 Solderability Tests for Component Leads, terminations, Lugs, Terminals and Wires
- IPC-J-STD-004-Requirement for Soldering Fluxes
- IPC J-STD-006-Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
- IPC-7095 – Design and Assembly Process Implementation for BGAs
- IPC-7525 – Stencil Design Guidelines (Solder Paste)
- IEC TS 62647-4 Process management for avionics - Aerospace and defense electronic systems containing lead-free solder
- J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
- JEDEC J-STD-020 – Moisture/Reflow Sensitivity Classification
- JESD625C.01_Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
- JESD22-B101-External Visual Standard
- MIL-STD-202 Test Method Standard Electronic and Electrical Component Parts
- MIL-STD-750 Department of Defense Test Method Standard Microcircuits
- MIL-STD-883 Department of Defense Test Method Standard Microcircuits
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