Outline
This method is used to repair mechanical or thermal blisters or delaminations in circuit board laminated base materials. The blister is sealed by injecting a low viscosity epoxy into the blister/delamination void.
Caution
This method can only be used when the laminate base material has separated sufficiently to allow the epoxy to flow throughout the void area.
Proprietary Information
This guide may contain proprietary or copyright-protected information for access by authorized persons only.
Minimum Skill Level - Advanced
Recommended for technicians with soldering and component rework skills and exposure to most repair/rework procedures, but lacking extensive experience.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
Circuit Bond Epoxy
Clear, superior strength epoxy in two-compartment plastic packages
Microscope
Precision microscope with stand and lighting for work and inspection.
Micro Drill System
Versatile power tool for milling, drilling, grinding, cutting and sanding circuit boards.
Mixing Picks
Unique mixing sticks have a paddle shape on one and sharp pick on the opposite end.
Oven
General purpose oven for drying, baking and curing epoxies.
Syringes
Polypropylene syringe barrels with stainless steel dispensing tips.
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
Figure 1: This method is used to repair mechanical or thermal blisters or delaminations in circuit board laminated base materials.
Figure 1: Drill into the delamination blister using a ball mill and a Micro-Drill.
Figure 2: Inject epoxy into the delamination blister.
Figure 3: Completed repair.
Figure 4: Micro-Drill System.
Procedure
Clean the area.
Drill into delamination blister with the Micro-Drill and ball mill. Drill in an area clear of circuitry or components. Drill at least two holes opposite each other around the perimeter of the delamination. (See Figure 1) Brush away all loose material.
Caution
Be careful not to drill too deep exposing internal circuits or planes.
Caution
Abrasion operations can generate electrostatic charges.
Bake the circuit board to remove any entrapped moisture. Do not allow the circuit board to cool prior to injecting the epoxy.
Caution Some components may be sensitive to high temperature.
Mix the epoxy. See manufacturers instructions on how to mix epoxy without bubbles.
Caution
Exercise care to prevent bubbles in the epoxy mixture.
Pour the epoxy into the epoxy cartridge.
Inject the epoxy into one of the holes in the delamination. (See Figure 2) The heat retained in the circuit board will improve the flow characteristics of the epoxy and will draw the epoxy into the void area filling it completely.
If the void does not fill completely, the following procedures may be used:
- Apply light local pressure on the board surface starting at the fill hole, slowly proceeding to the vent hole.
- Apply vacuum to the vent hole to draw the epoxy through the void.
Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling. Scrape away any excess epoxy using a knife or scraper.
Note
If needed, apply additional thin coating to seal any scrapped areas.
Evaluation
Visual examination for texture and color match.
Electrical tests to conductors around the repaired area as applicable.
