Outline
This method repairs mechanical or thermal blisters or delaminations in circuit board laminated base materials. The blister is sealed by injecting a low-viscosity epoxy into the blister/delamination void.
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Images and Figures![]()
Figure 1: This method is used to repair mechanical or thermal blisters or delaminations in circuit board laminated base materials.
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Figure 1: Drill into the delamination blister using a ball mill and a Micro-Drill.
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Figure 2: Inject epoxy into the delamination blister.
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Figure 3: Completed repair.
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Figure 4: Micro-Drill System.
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Procedure
Evaluation
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3.1 Delamination/Blister Repair, Injection Method
Procedure covers delamination and blister repair on circuit board assemblies.