Circuit Technology Center

9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method

This procedure covers reballing of BGA components.

Proprietary Information Proprietary
This guide may contain proprietary or copyright-protected information for access by authorized persons only.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-610 Acceptability of Electronic Assemblies  Proprietary
Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
IPC 7711/7721 5.7.3 BGA Reballing Procedure - Fixture Method
IPC J-STD-033 Joint Industry Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
Tools and Materials
General purpose cleaner for removing contamination.
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
Cleaninjg System
Cleaning System
Batch or inline cleaning system for removing fluxes and contamination.
Disposable, puncture-resistant gloves designed for handling mild chemicals.
High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.
Precision microscope with stand and lighting for work and inspection.
General purpose oven for drying, baking and curing epoxies.
Safety Glasses
Safety Glasses
Protect your eyes and your vision with proper safety glasses.
Solder Flux
Solder Flux   Proprietary
Used to prepare solder surfaces and to prevent formation of oxides during soldering.
Solder Paste
Solder Spheres    Proprietary
Solder balls or spheres for BGA component reballing and rework.
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
BGA component prior to reballing.
9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
Figure 1. Robotic deball system for controlled removal of solder balls.
9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
Figure 2. Apply tacky flux to flat BGA component pads using a brush.

9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
Figure 3. Place the BGA component(s) into a fixture and cover with the appropriate stencil.
9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
Figure 4. Mini reflow oven used for controlled reflow of solder balls.
Procedure - Touchless Ball Removal
  1. Ensure all BGA components to be processed meet the requirements for acceptable moisture level.

    For information on baking and moisture level control see 2.5 Baking and Preheating
  2. Place a matrix tray of the BGA components into the Robotic BGA Deball system. See Figure 1.

    Refer to component datasheet for guidelines regarding component peak temperatures specifications, etc.
  3. Run the BGA components through the de-ball cycle. This process dissolves and flushes away the existing solder balls. See video above.
    A. Fluxing of the components.
    B. Controlled pre-heating of components.
    C. Ball removal using a dynamic solder wave.
    D. Component rinse and blow off.
  4. As required, clean the BGA components with approved cleaning solution. Dry components as required.
Procedure - Mini-Oven Attachment Method
  1. Apply tacky flux to the flat BGA component pads using a Brush. Flux should be evenly applied across the entire BGA pad surface. Use minimal flux needed to fully cover the surface. Remove any excess flux. See Figure 2.
  2. Place a quantity of the appropriate size Solder Spheres into the fixture and use a clean Cleaning Brush to distribute the Solder Spheres so they fill all the open apertures in the BGA Component Stencil. Check to be sure all the apertures are filled with only one solder sphere. Tilt the fixture and pour the excess Solder Spheres into a collection container for reuse. See Figure 3.

    Avoid overloading the Solder Stencil with excess Solder Spheres as they may wedge under the stencil. This will make lifting the Stencil to remove any excess Solder Spheres difficult.
  3. Place the component and fixture into the Mini BGA Reflow Oven. See Figure 4.
  4. Turn the Mini BGA Reflow Oven on and select the proper profile.

    If a profile has not been defined a profile will need to be created.
  5. Close the cover of the Mini BGA Reflow Oven and press the start button. The oven will go through the required preheat, reflow and cooling cycles.
  6. When the temperature has cooled below 100 ° C, use gloves and remove the reball fixture from the Mini BGA Reball Oven once. Allow the fixture and components to cool for one minutes to ensure package thermal stability prior to removing the BGA component from the fixture.
  7. Visually inspect the BGA components balls for proper alignment and appearance.
  8. Clean the BGA components in approved cleaning solution.
  9. Inspect the body of the BGA component for abnormalities.
  10. Inspect the BGA component for cleanliness.
Procedure for reference only.