Standard jumper wires won't fit under BGAs - but our flat copper ribbon solution will. This IPC-recommended procedure, pioneered here, delivers precise, low-profile BGA site modifications trusted by engineers worldwide.
Circuit Technology Center restores damaged circuit boards with advanced baseboard repair techniques, including CNC material replacement and epoxy restoration. IPC-7711/7721-aligned processes deliver durable, cost-effective solutions for high-reliability electronics.
Circuit Technology Center restores damaged circuit traces and plated through holes using IPC-recommended PCB repair methods. Precision foil jumpers and eyelet installation replicate original manufacturing quality for high-reliability electronics.
Circuit Technology Center delivers precision coating removal and solder mask repair using IPC-compliant methods. We modify, reapply, and update board surfaces, supporting high-reliability aerospace, defense, and advanced electronics programs.
Circuit Technology Center restores damaged gold edge contacts using IPC-compliant brush plating with high-purity gold. Our controlled process ensures proper thickness, adhesion, and durability—returning contacts to like-new condition for reliable performance.
ircuit Technology Center performs SMT and BGA pad repair using IPC-recommended, dry-film adhesive methods. Precision-fabricated pads restore structural and electrical integrity, ensuring reliable, standards-compliant PCB performance.
Circuit Technology Center delivers precision X-ray inspection for BGA rework using the Dage Quadra 7 system. Sub-micron imaging reveals hidden solder defects, misalignment, and reflow issues, ensuring reliable performance for aerospace, defense, and advanced electronics.
