6.0 Jumper Wire and Component Modification Procedures

The guides in this section detail procedures for jumper wire installation, component modifications, and lead alterations on circuit board assemblies. It includes general jumper wire methods, specialized approaches for BGA components using circuit tracks, and guidelines for adding or modifying components, including cutting, lifting, trimming, and forming to meet design or repair needs. These methods support electrical rerouting, signal restoration, and mechanical adaptation while ensuring reliability and compliance with assembly requirements.

6.1 Jumper Wires

Procedure covers methods for using jumper wires on circuit board assemblies.

6.2.1 Jumper Wires, BGA Components, Circuit Track Method

Procedure covers methods for using circuit tracks at BGA locations on circuit board assemblies.

6.2.2 Jumper Wires, BGA Components, Through Board Method

Procedure covers methods for using jumper wires at BGA locations on circuit board assemblies.

6.3 Component Modifications and Additions

Procedure covers various component modifications and additions on circuit board assemblies.

6.4 Component Lead Cutting and Lifting

Procedure covers methods for cutting and lifting component leads on circuit board assemblies.

6.5 Component Trim and Form

Procedure covers methods for triming and forming leads on electronic components.