Outline
This method is used to change a circuit path at a BGA site for engineering changes or modifications.Note: This procedure requires precision milling equipment and highly trained technicians. Caution: This procedure is not applicable for "via in pad" applications.
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Images and Figures![]()
Figure 1: Cut the connection to the via using a Precision Drill System.
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Figure 2: Remove the BGA pad and mill a shallow channel into the solder mask surface.
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Figure 3: Bond a new BGA pad in place.
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Figure 4: Solder a copper circuit track to the tail extending from the new BGA pad
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Figure 5: Solder a wire to the Circuit Track and overcoat with epoxy.
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Procedure
Procedure
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6.2.1 Jumper Wires, BGA Components, Circuit Track Method
Procedure covers methods for using circuit tracks at BGA locations on circuit board assemblies.