7.1.3 Solder Joint Acceptance Criteria

Outline

This procedure includes figures and tables for solder joint acceptability criteria on a variety of component types.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.


Procedure References
1.0	Foreword
7.1.1	Soldering Basics
IPC-A-610	Acceptability of Electronic Assemblies
J-STD-001	Requirements for Soldered Electrical and Electronic Assemblies

Procedure

Figure 1: Dimensional Criteria for Through-Hole Components

Table 1: Acceptable Solder Criteria for Through-Hole Components

Feature	Dim	Class 1	Class 2	Class 3
Circular wetting of the solder of the lead and plated hole barrel on the component side.	1	Not Specified	180 deg	270 deg
Plated hole fill.	2	Not Specified	75%	75%
Circular fillet and wetting of the solder of the lead and plated hole barrel on the solder side.	1	270 deg	270 deg	330 deg
Percent of the land area covered with solder on the component side.	3	0	0	0
Percent of the land area covered with solder on the solder side.	4	75%	75%	75%

Figure 2: Dimensional Criteria for Chip Components

Table 2: Acceptable Solder Criteria for Chip Components

Feature	Dim	Class 1	Class 2	Class 3
Maximum Component Side Overhang	1	Less than 50% of the component termination width or 50% of the pad width, whichever is less.	Less than 50% of the component termination width or 50% of the pad width, whichever is less.	Less than 25% of the component termination width or 25% of the pad width, whichever is less.
Maximum Component End Overhang	2	Not permitted.	Not permitted.	Not permitted.
Minimum End Joint Width	3	50% of the component termination width or 50% of the pad width, whichever is less.	50% of the component termination width or 50% of the pad width, whichever is less.	75% of the component termination width or 75% of the pad width, whichever is less.
Minimum Side Joint Length	4	Evidence of proper wetting.	Evidence of proper wetting.	Evidence of proper wetting.
Maximum Fillet Height	5	Solder may overhang the pad but must not touch the non-soldered portion of the component package body.	Solder may overhang the pad but must not touch the non-soldered portion of the component package body.	Solder may overhang the pad but must not touch the non-soldered portion of the component package body.
Minimum Fillet Height	6	Evidence of proper wetting.	Evidence of proper wetting.	Equal to the solder thickness plus 25%, or equal to the solder thickness plus 0.50 mm (.020"), whichever is less.
Minimum Solder Thickness	7	Evidence of proper wetting.	Evidence of proper wetting.	Evidence of proper wetting.
Minimum End Overlap	8	Evidence of any overlap is required.	Evidence of any overlap is required.	Minimum 25% of the termination length.

Figure 3: Dimensional Criteria for J Lead Components

Table 3: Acceptable Solder Criteria for J Lead Components

Feature	Dim	Class 1	Class 2	Class 3
Maximum Lead Side Overhang	1	No more than 50% of the lead width.	No more than 50% of the lead width.	No more than 25% of the lead width.
Maximum Lead Toe Overhang	2	Not specified.	Not specified.	Not specified.
Minimum Lead End Joint Width	3	50% of the lead width.	50% of the lead width.	75% of the lead width.
Minimum Side Joint Length	4	Evidence of proper wetting.	Side joint length must exceed 150% of the lead width.	Side joint length must exceed 150% of the lead width.
Maximum Fillet Height	5	No maximum, but solder must not touch the component package body.	No maximum, but solder must not touch the component package body.	No maximum, but solder must not touch the component package body.
Minimum Heel Fillet Height	6	Equal to the solder thickness plus 50% of the lead thickness.	Equal to the solder thickness plus the lead thickness.	Equal to the solder thickness plus the lead thickness.
Minimum Solder Thickness	7	Evidence of proper wetting.	Evidence of proper wetting.	Evidence of proper wetting.

Figure 4: Dimensional Criteria for Gull Wing Components

Table 4: Acceptable Solder Criteria for Gull Wing Components

Feature	Dim	Class 1	Class 2	Class 3
Maximum Lead Side Overhang	1	No more than 50% of the lead width or 0.50 mm (.020"), whichever is less.	No more than 50% of the lead width or 0.50 mm (.020"), whichever is less.	No more than 25% of the lead width or 0.50 mm (.020"), whichever is less.
Maximum Toe Overhang	2	Does not violate minimum electrical clearance.	Not acceptable.	Not acceptable.
Minimum End Joint Width	3	50% of the lead width.	50% of the lead width.	75% of the lead width.
Minimum Side Joint Length: Lead thickness greater than 3X lead width	4	Equal to the lead width or 0.50 mm (.020"), whichever is less.	3 times the formed foot length or 75% of the formed foot length, whichever is longer.	3 times the formed foot length or 75% of the formed foot length, whichever is longer.
Minimum Side Joint Length: Lead thickness less than 3X lead width	4	Equal to the lead width or 0.50 mm (.020"), whichever is less.	Equal to 100% of the formed foot length.	Equal to 100% of the formed foot length.
Maximum Heel Fillet Height	5	No maximum, but solder must not touch the component package body.	No maximum, but solder must not touch the component package body.	No maximum, but solder must not touch the component package body.
Minimum Heel Fillet Height	6	Evidence of proper wetting.	Equal to the solder thickness plus 50% of lead thickness.	Equal to the solder thickness plus 100% of lead thickness.
Solder Thickness	7	Evidence of proper wetting.	Evidence of proper wetting.	Evidence of proper wetting.

Images and Figures

Solder Joint Acceptance Criteria

Figure 1. Dimensional Criteria for Through Hole Components

Figure 2. Dimensional Criteria for Chip Components

Figure 3. Dimensional Criteria for J Lead Components

Figure 4. Dimensional Criteria for Gull Wing Components

7.1.3 Solder Joint Acceptance Criteria

Page covers includes tables and illustrations covering solder joint acceptance criteria on circuit board assemblies. Minimum Skill Level: Intermediate Conformance Level: N/A

Page covers includes tables and illustrations covering solder joint acceptance criteria on circuit board assemblies.

Minimum Skill Level: Intermediate
Conformance Level: N/A