8.1.1 Component Removal, Through Hole Components, Vacuum Method

Procedure - Straight Leads, Standard Method

1. Inspect the size of the solder joints on the component to be removed. If the size of the solder joint fillets are minimal, it may be desirable to add additional solder to form an "excess solder" joint. This will improve the thermal linkage.
2. Apply a small amount of liquid flux to the solder joints of the component to be removed.
3. Align the desolder tip with a component lead end and lightly make contact with the solder joint. Keep the desolder tip off the pad by allowing it to slide around on a film of solder.
   Caution: Do not apply pressure with the solder extractor tip to the lands or other conductive patterns.
4. After the solder has melted, start a rotating or oscillating motion with the desolder tip. Continue the rotating motion until a change in the "feel" of the rotating motion occurs. At this instant, the solder in the solder joint is completely molten. Immediately activate the vacuum, extracting the solder from the solder joint. (See Figure 1)
5. Maintain rotation of the desolder tip while the continuous vacuum is being applied. This allows air to cool both the component lead and the plated-through hole preventing the component lead from resweating to the side of the hole.
6. After the solder has been extracted from the solder joint, remove the desolder tip from the component lead while maintaining a continuous vacuum.
7. Maintain continuous vacuum for a few seconds to clear the desolder tip.
8. Turn off the vacuum.
9. Desolder each of the remaining components leads individually using a skipping method to reduce thermal buildup at adjacent hole locations.
10. Probe each component lead to be sure that they are not soldered to the side of the plated hole and then remove the component.
    Note: If each lead is not completely free, resolder the joint and repeat steps 2 - 10.
11. Clean the area.

Procedure - Partial Clinch Leads, Standard Method

1. Inspect the size of the solder joints on the component to be removed. If the size of the solder joint fillets is minimal, it may be desirable to add additional solder to form an "excess solder" joint. This will improve the thermal linkage.
2. Apply a small amount of liquid flux to the solder joints of the partially clinched leads.
3. Align the desolder tip with the partially clinched lead. Lower the tip to melt the solder. Then gently straighten the lead to a vertical position. (See Figure 2) After each lead has been straightened, continue desoldering each lead as described beginning in step 3 above.

Procedure - Fully Clinch Leads, Standard Method

1. Apply a small amount of liquid flux to the solder joints of the fully clinched leads.
2. Align the desolder tip with the fully clinched lead. Lower the tip to melt the solder and activate the vacuum to remove the solder from the joint. (See Figure 3)
3. Use flat nose pliers to gently rotate the lead laterally and break any remaining solder sweat joints. (See Figure 4)
4. Probe each component lead to be sure that they are not soldered to the side of the plated hole and then remove the component.
   Note: If each lead is not completely free, resolder the joint and repeat steps 2 - 4.

Procedure - Straight Leads, Auxiliary Heat Method
Auxiliary heating may be required on solder joints with a large thermal mass. This is most common on multilayer circuit boards.

1. Inspect the size of the solder joints on the component to be removed. If the size of the solder joint fillets are minimal, it may be desirable to add additional solder to form an "excess solder" joint. This will improve the thermal linkage.
2. Apply a small amount of liquid flux to the solder joints of the component to be removed.
3. Place a soldering iron tip against the lead of the component side of the circuit board. (See Figure 5)
4. Align the desolder tip with a component lead end and lightly make contact with the solder joint. Keep the desolder tip off the pad by allowing it to slide around on a film of solder.
   Caution: Do not apply pressure with the solder extractor tip to the lands or other conductive patterns.
5. After the solder has melted, start a rotating or oscillating motion with the desolder tip. Continue the rotating motion until a change in the "feel" of the rotating motion occurs. At this instant, the solder in the solder joint is completely molten. Immediately activate the vacuum, extracting the solder from the solder joint.
6. Maintain rotation of the desolder tip while the continuous vacuum is being applied. This allows air to cool both the component lead and the plated-through hole preventing the component lead from resoldering to the side of the hole.
7. After the solder has been extracted from the solder joint, remove the desolder tip and the soldering iron tip from the component lead while maintaining a continuous vacuum on the desoldering tip.
8. Maintain continuous vacuum for a few seconds to clear the desolder tip.
9. Turn off the vacuum.
10. Desolder each of the remaining components leads individually using a skipping method to reduce thermal buildup at adjacent hole locations.
11. Probe each component lead to be sure that they are not soldered to the side of the plated hole and then remove the component.
    Note: If each lead is not completely free, resolder the joint and repeat steps 2 - 11.
12. Clean the area.

Evaluation

1. In-process QA Inspection should be conducted to ensure the component was removed without evidence of damage to circuit board assembly or plated through hole.