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12.1 Reclaimed Component Marking

This procedure covers laser and ink dot marking for reclaimed components.

Minimum Skill Level: Expert
Conformance Level: High


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slide 1
Reclaimed component laser marked with [RC] to indicate reclaimed component.
slide 2
Reclaimed component marked with an ink dot to indicate reclaimed component.
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Outline
Reclaimed components shall be identified to indicate their reclaimed status and controlled in accordance with documented procedures. The method of identification shall be determined based on the intended disposition of the component:

  1. Components intended for resale, transfer, or distribution outside the reclaiming organization shall be permanently laser-marked.
  2. Components reclaimed and retained exclusively within the same organization that controls the original assemblies may be identified by laser marking or an ink-dot marking.
Marking shall not degrade component reliability, package integrity, or performance. Physical marking shall not be relied upon as the sole means of traceability control. Supporting documentation shall be maintained as defined in section 12.2

Ink Dot Marking

  1. The component may be identified using a single ink dot applied to the package body. 
  2. The ink shall be non-conductive, compatible with package materials, and resistant to normal handling and assembly processes.
  3. The ink dot shall be placed in an open area of the package body, not obscuring the original manufacturer markings, and not contacting leads or terminations.
Laser Marking

  1. The reclaimed marking shall consist of the capital letters RC enclosed within a square outline. 
  2. The marking shall be distinct from original manufacturer markings. 
  3. The marking shall not alter, obscure, or overwrite the original part number, date code, lot code, or manufacturer identification.
  4. The marking shall be permanent and resistant to handling, cleaning, and normal assembly processes.
  5. The marking shall be clearly legible under normal lighting conditions when the package size permits.
  6. The marking shall be placed in an open area of the package body on the top surface of the package whenever available.
  7. The marking shall not obscure original manufacturer markings, interfere with mold cavities or package features, or extend onto lead surfaces or terminations.
  8. The marking may be applied to component sidewalls if space on the top surface is not available.
  9. Sufficient clearance shall be maintained from original markings to avoid visual confusion. 
  10. Placement shall prioritize clear visual differentiation from OEM markings, ease of inspection, and repeatable process control.
  11. The size of the reclaimed marking shall be proportional to the available surface area of the package.
  12. The marking shall be large enough to ensure legibility. 2. The marking shall be small enough to avoid encroachment on original markings or functional areas. 
  13. The marking process shall not distort the package surface or penetrate to a depth that compromises package integrity.
  14. Failed components shall be segregated in accordance with internal nonconforming material procedures.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Images and Figures
Reclaimed component laser marked with [RC] to indicate reclaimed component.
Reclaimed component laser marked with [RC] to indicate reclaimed component.
Reclaimed component marked with an ink dot to indicate reclaimed component.
Figure 1. Reclaimed component marked with an ink dot to indicate reclaimed component.