4.7.6 Surface Mount Pad Repair, Film Adhesive Method, Butt Joint Method

Procedure

1. Clean the area.
2. Remove the defective pad and a short length of the connecting circuit. (See Figure 1)
3. Use a knife and scrape off any epoxy residue, contamination, or burned material from the board surface.
4. Scrap any solder mask or coating from the connecting circuit. (See Figure 1)
5. Clean the area.
6. Apply a small amount of liquid flux to the connection area on the board surface and tin with solder. Clean the area. The length of the overlap solder connection should be a minimum of 2 times the circuit width.
7. The area for the new pad on the board surface must be smooth and flat. If internal fibers of the board are exposed, or if there are deep scratches on the surface, they should be repaired. Refer to the appropriate procedure.
8. Select a replacement surface mount pad that most closely matches the surface mount pad to be replaced. If a special size or shape is needed, they can be custom fabricated. (See Figure 2)
   Note: New surface mount pads are fabricated from copper foil. The foil is plated on the top with solder, and an adhesive bonding film is applied to the bottom.
9. Cut out and trim the new pad. Cut out from the plated side. Cut the length of the connecting circuit so it butts up to the connecting circuit on the circuit board surface.
   Note: A small copper Circuit Track jumper soldered to the traces will complete the electrical connection in a later step.
10. Place a piece of High-Temperature Tape over the top surface of the new pad. Place the new pad into position on the circuit board surface using the tape to help in alignment. (See Figure 4)
11. Select a bonding tip with a shape to match the shape of the new pad. See the bonding tip chart in the replacement parts section of the manual provided with the repair system or repair kit.
    Note: The tip used for bonding should be as small as possible but should completely cover the entire surface of the new pad.
12. Position the circuit board on a PCB holder so it is flat and stable. If a bonding system is used, align the tip. Gently place the hot bonding tip onto the High-Temperature Tape covering the new pad. Apply pressure as recommended in the manual of the repair system or repair kit for 5 seconds to tack the new pad in place. Carefully peel off the tape. (See Figure 5)
    Caution: Excessive bonding pressure may cause measling in the circuit board surface or may cause the new pad to slide out of position.
13. Gently place the bonding tip directly onto the new pad. Apply pressure as recommended in the manual of the repair system or repair kit for an additional 30 seconds to bond the pad fully. The new pad is fully cured. Carefully clean the area and inspect the new pad for proper alignment.
14. Place a short length of Circuit Track in position over the top of the connecting circuits. Hold in place on each side with high-temperature tape. (See figure 6.)
15. Apply a small amount of liquid flux to the overlap joint connection areas and solder the connections. Use minimal flux and solder to ensure a reliable connection.
16. Trim the excess Circuit Track.
    Caution: When trimming any excess Circuit Track, avoid damage to the circuit traces.
17. Mix epoxy and coat the lap solder joint connection. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.
    Note: Additional epoxy can be applied around the perimeter of the new pad to provide additional bond strength.
    Caution: Some components may be sensitive to high temperatures.
18. Apply surface coating to match prior coating as required.

Evaluation

1. Visual examination.
2. Measurement of new pad width and spacing.
3. Electrical continuity measurement.