News Releases

Explore our latest breakthroughs, projects, and company milestones.

February 18, 2026

White Paper Explores Cold Precision Milling for Underfilled BGA Removal

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October 2, 2025

Circuit Technology Center Expands Robotic Tinning Capacity with Two Additional Hentec/RPS Odyssey 1325 Machines

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September 13, 2024

Circuit Technology Center Announces Expanded Tinning Services Capacity

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November 9, 2023

Circuit Technology Center Announces New Component Trim and Form Service

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October 3, 2023

New Technical Paper Unveils Key Strategies for Successful BGA Rework

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August 17, 2023

New Paper Details Essential Rules for Circuit Board Jumper Wire Adds

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July 12, 2023

Whitepaper Discusses Critical Process Steps for High Reliability BGA Device Re-balling

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May 30, 2023

CircuitMedic Unveils the Ultimate Tool Set for Electronics Techs

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March 27, 2023

Circuit Technology Center Announces New Series of CircuitMedic Circuit Frames

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February 27, 2023

White Paper Discusses Key Considerations for Electronic Component Tin Whisker Mitigation

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January 17, 2023

Circuit Technology Center At IPC-APEX Expo Booth #2936

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November 1, 2022

New White Paper Examines Key Steps to Component Lead Tinning

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September 26, 2022

Circuit Technology Center Expands BGA Re-balling Capacity

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August 4, 2022

Technical Paper Details Essential Practices for Gold Mitigation of Electronic Components

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May 11, 2022

New Article Details Electronic Device Salvage Process Considerations

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