October 2, 2025
Haverhill, MA — Circuit Technology Center, Inc., a leader in circuit board rework, repair, and modification, is pleased to announce ...
|
September 13, 2024
Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder ...
|
November 9, 2023 Circuit Technology Center has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. Customers ...
|
October 3, 2023 Circuit Technology Center has released a new technical paper highlighting six common mistakes encountered during BGA rework operations.
This new ...
|
August 17, 2023 This new technical paper from Circuit Technology Center explores ten crucial guidelines for secure, organized, and industry-standard attachment and routing ...
|
July 12, 2023 The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due ...
|
May 30, 2023 CircuitMedic, a leading provider of innovative solutions for electronic circuit board repair and rework, has assembled the ultimate benchtop tool ...
|
March 27, 2023 Circuit Technology Center announces the release of a new series of CircuitMedic brand Circuit Frames. Circuit Frames contain replacement circuit ...
|
February 27, 2023 The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use ...
|
January 17, 2023 Visitors to this year’s IPC-APEX Expo, which will be held at the San Diego Convention Center from January 24-26th, 2023, ...
|
November 1, 2022 The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold ...
|
September 26, 2022
Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new ...
|
August 4, 2022 Gold plating removal from the solderable surfaces of electronic components is required for many electronic components due to gold embrittlement ...
|
May 11, 2022 The industry-wide electronic device shortage has created an increasing demand for the selective salvage and reclamation of valuable and difficult-to-source ...
|
February 15, 2022 A new section, 10.0 Component Tinning Procedures, includes thirteen newly published procedures added to the popular online guidebook developed and ...
|