News Releases

Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at IPC APEX EXPO, March 16 to 18. The working group, composed of industry experts spanning failure analysis, ...

Industry experts from across the electronics manufacturing sector will meet this week to continue formal development work on a new IPC standard titled IPC‑7712 Component Safe Removal for Failure Analysis and Reclamation. The effort brings together leading engineers, reliability specialists, ...

Circuit Technology Center, Inc., a leader in high-reliability circuit board rework and component-level modification, has released a technical white paper: Cold Precision Milling for Underfilled BGA Component Removal. Available at www.circuitrework.com the paper addresses a critical challenge in safely removing ...

Haverhill, MA — Circuit Technology Center, Inc., a leader in circuit board rework, repair, and modification, is pleased to announce the addition of two new Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machines to its production floor. ...

Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliability customer base that requires ...

Circuit Technology Center has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. Customers can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fabricated to meet custom package ...

Circuit Technology Center has released a new technical paper highlighting six common mistakes encountered during BGA rework operations. This new paper offers valuable insights and effective methods to help prevent their occurrence. See the full paper here: https://www.circuitrework.com/tech-papers/1093.html ...

This new technical paper from Circuit Technology Center explores ten crucial guidelines for secure, organized, and industry-standard attachment and routing of jumper wires on circuit board assemblies, ensuring reliability and optimal connections. See the full paper here: https://www.circuitrework.com/tech-papers/1092.html ...

The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key process steps of this highly specialized ...

CircuitMedic, a leading provider of innovative solutions for electronic circuit board repair and rework, has assembled the ultimate benchtop tool set for serious electronics technicians and professionals. This curated selection of nine finely-crafted tools will help electronics technician professionals tackle ...

Circuit Technology Center announces the release of a new series of CircuitMedic brand Circuit Frames. Circuit Frames contain replacement circuit patterns, lands, SMT pads, BGA pads, and gold edge contacts used for the repair of damaged printed circuit boards. The ...

The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium. In this white paper, Circuit Technology ...

Visitors to this year’s IPC-APEX Expo, which will be held at the San Diego Convention Center from January 24-26th, 2023, are invited to stop by booth #2936 to learn more about the industry-leading circuit board and component rework and modification ...

The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold embrittlement, tin whisker mitigation, or processing components for applications that require refinishing with lead-free solder for RoHS compliance. The ideal ...

Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new machine doubles the existing in-line reflow oven capacity to meet increasing customer demand for high-volume BGA component re-balling applications. The ...