Circuit Technology Center
SEARCH  

News Releases

March 22, 2021
Circuit Technology Center Expands Component Modification Services Capabilities
Circuit Technology Center announces that it has recently installed and commissioned a second robotic hot solder dip (RHSD) machine, expanding ...
February 24, 2021
Circuit Technology Center Defines New Procedure for Rework of BGA's Underfilled with Non-reworkable Underfill Epoxy
Circuit Technology Center is frequently tasked with the selective rework of BGA devices that have been underfilled with “non-reworkable” underfill ...
February 14, 2021
Circuit Technology Center Expands In-House Component Testing Services
Circuit Technology Center has recently purchased and commissioned an SCS Ionograph BTSP series ionic cleanliness test system to support cleanliness ...
August 19, 2020
Circuit Technology Center Details A Quick Process For Through Hole Connector Rework
For over 35 years Circuit Technology Center has been reworking through hole connectors. In this blog post the authors detail ...
July 7, 2020
Circuit Technology Center Defines a Method for Adding a Via Hole to an Assembled Circuit Board
Circuit Technology Center was tasked with a project to add missing vias on a batch of populated circuit boards. The ...