November 9, 2023
Circuit Technology Center Announces New Component Trim and Form Service
Circuit Technology Center has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. Customers ...
October 3, 2023
New Technical Paper Unveils Key Strategies for Successful BGA Rework
Circuit Technology Center has released a new technical paper highlighting six common mistakes encountered during BGA rework operations.
This new ...
August 17, 2023
New Paper Details Essential Rules for Circuit Board Jumper Wire Adds
This new technical paper from Circuit Technology Center explores ten crucial guidelines for secure, organized, and industry-standard attachment and routing ...
July 12, 2023
Whitepaper Discusses Critical Process Steps for High Reliability BGA Device Re-balling
The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due ...
May 30, 2023
CircuitMedic Unveils the Ultimate Tool Set for Electronics Techs
CircuitMedic, a leading provider of innovative solutions for electronic circuit board repair and rework, has assembled the ultimate benchtop tool ...
March 27, 2023
Circuit Technology Center Announces New Series of CircuitMedic Circuit Frames
Circuit Technology Center announces the release of a new series of CircuitMedic brand Circuit Frames. Circuit Frames contain replacement circuit ...
February 27, 2023
White Paper Discusses Key Considerations for Electronic Component Tin Whisker Mitigation
The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use ...
January 17, 2023
Circuit Technology Center At IPC-APEX Expo Booth #2936
Visitors to this year’s IPC-APEX Expo, which will be held at the San Diego Convention Center from January 24-26th, 2023, ...
November 1, 2022
New White Paper Examines Key Steps to Component Lead Tinning
The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold ...
September 26, 2022
Circuit Technology Center Expands BGA Re-balling Capacity
Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new ...
August 4, 2022
Technical Paper Details Essential Practices for Gold Mitigation of Electronic Components
Gold plating removal from the solderable surfaces of electronic components is required for many electronic components due to gold embrittlement ...
May 11, 2022
New Article Details Electronic Device Salvage Process Considerations
The industry-wide electronic device shortage has created an increasing demand for the selective salvage and reclamation of valuable and difficult-to-source ...
March 9, 2022
Circuit Technology Center Doubles Component-Level Tinning Services Capacity
Circuit Technology Center recently received and commissioned two additional Hentec Odyssey 1325 robotic hot solder dip (RHSD) machines. These new ...
February 15, 2022
Circuit Technology Center Releases Thirteen New Component Tinning Procedures
A new section, 10.0 Component Tinning Procedures, includes thirteen newly published procedures added to the popular online guidebook developed and ...
October 7, 2021
Circuit Technology Center Releases Updated Rework and Repair Guidebook
Several new procedures covering Ball Grid Array component re-balling and inspection have been added to the popular online guidebook developed ...