News Releases

Explore our latest breakthroughs, projects, and company milestones.

October 2, 2025
Haverhill, MA — Circuit Technology Center, Inc., a leader in circuit board rework, repair, and modification, is pleased to announce ...
September 13, 2024
Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder ...
November 9, 2023
Circuit Technology Center has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. Customers ...
October 3, 2023
Circuit Technology Center has released a new technical paper highlighting six common mistakes encountered during BGA rework operations. This new ...
August 17, 2023
This new technical paper from Circuit Technology Center explores ten crucial guidelines for secure, organized, and industry-standard attachment and routing ...
July 12, 2023
The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due ...
May 30, 2023
CircuitMedic, a leading provider of innovative solutions for electronic circuit board repair and rework, has assembled the ultimate benchtop tool ...
March 27, 2023
Circuit Technology Center announces the release of a new series of CircuitMedic brand Circuit Frames. Circuit Frames contain replacement circuit ...
February 27, 2023
The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use ...
January 17, 2023
Visitors to this year’s IPC-APEX Expo, which will be held at the San Diego Convention Center from January 24-26th, 2023, ...
November 1, 2022
The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold ...
September 26, 2022
Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new ...
August 4, 2022
Gold plating removal from the solderable surfaces of electronic components is required for many electronic components due to gold embrittlement ...
May 11, 2022
The industry-wide electronic device shortage has created an increasing demand for the selective salvage and reclamation of valuable and difficult-to-source ...
February 15, 2022
A new section, 10.0 Component Tinning Procedures, includes thirteen newly published procedures added to the popular online guidebook developed and ...
Contact Us/Quote Request


Send Documents *
No file chosen
No file chosen
No file chosen
No file chosen
No file chosen

Notes/Questions/Requests

Product Type
Assemblies Bare PCBs Other

Quantity

Delivery Schedule Request
3 Weeks 2 Weeks 1 Week
2-3 Days 1 Day

Security Check



* You may upload PDFs and other file types (max 4 MB each). For multiple files, zip them or send to info@circuitrework.com

Form Security
Our forms run on AWS with an industry-leading firewall. Data is encrypted at rest with AES-256 and in transit using TLS 1.2+.