5.0 Plated Hole Repair Procedures

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5.0 Plated Hole Repair Procedures

Plated hole repair procedures for restoring electrical continuity and structural integrity in double-sided and multilayer PCBs. Covers eyelet, double wall and inner layer connection methods for reliable plated-hole reconstruction.

5.1 Plated Hole Repair, No Inner Layer Connection

Repair damaged plated through-holes with no inner layer connection using an eyelet. Learn drilling, preparation and eyelet forming methods to restore mechanical strength and solderability.

5.2 Plated Hole Repair, Double Wall Method

Restore plated through-holes using the double wall method for enhanced durability. Covers controlled drilling, eyelet sleeve installation and flaring techniques to ensure strong electrical continuity.

5.3 Plated Hole Repair, Inner Layer Connection

Repair plated through-holes with inner layer connections using precision reconstruction methods. Includes layer access, conductor restoration and eyelet installation to maintain multilayer integrity.