3.3.2 Hole Repair, Transplant Method

Outline

This method is used to repair severe damage to a hole or to modify the size, shape, or location of an unsupported tooling or mounting hole. The hole may have component leads, wires, fasteners, pins, terminals, or other hardware run through it. This repair method uses a dowel of matching board material and high-strength epoxy to secure the dowel in place. A new hole can be drilled after the new material is bonded in place. This method can be used on single-sided, double-sided, or multilayer circuit boards and assemblies.

Caution: Damaged inner-layer connections may require surface wire adds.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-600 2.0	Externally Observable Characteristics
IPC-A-610 10.0	Laminate Conditions


Procedure References
1.0	Foreword
2.1	Handling Electronic Assemblies
2.2	Cleaning
2.5	Baking And Preheating
2.7	Epoxy Mixing and Handling
IPC7721 3.3.2	Hole Repair, Transplant Method

Tools, Materials and Supplies

Ball Mills, Abrasives, Cutting Tools
Ball mills, abrasives and cutting tools for working on circuit boards.

Circuit Bond Epoxy
Clear, superior strength epoxy in two-compartment plastic packages.

Flex-Rack PCB Holder
Sturdy rack for PCBs used for rework and positioning.

Cleaning Brushes
Disposable brushes for solvent cleaning and application of coatings.

Cleaner
General purpose cleaner for removing contamination.

End Mills
Designed for end cutting and hole boring.

File
High carbon steel needle file perfect for all kinds of detail work.

High Temp Tape Discs
High temperature polyimide tape discs, .50" diameter.

Knife with #16 Blades
A must-have tool for precise cutting, scraping and trimming.

Micro Drill System
Versatile power tool for milling, drilling, grinding, cutting and sanding.

Microscope
Precision microscope with stand and lighting for work and inspection.

Oven
General purpose oven for drying, baking and curing epoxies.

Precision Drill
Precision drill press for accuracy and controlled depth drilling.

Precision Tool Set
Nine precision-crafted tools for detailed circuit board work.

Scraper, Curved Tip
Hardened stainless steel tip for scraping solder mask and removing defects.

Wipes
Nonabrasive, low-linting wipes for cleanup.

Procedure

Clean the area.
Drill out the damaged or improperly sized hole using a carbide end mill or drill. Mill the hole using a precision drill press or milling machine for accuracy. The diameter of the cutting tool should be as small as possible, yet still encompass the entire damaged area. (See Figure 1)
Note: Abrasion operations can generate electrostatic charges.
Cut a piece of replacement base material rod. The base material rod is made from FR-4 dowel stock. Cut the length approximately 12.0 mm (0.50") longer than needed.
Clean the reworked area.
Use High-Temperature Tape to protect exposed parts of the circuit board bordering the rework area.
Mix the epoxy.
Coat both the dowel and the hole with epoxy and fit together. Apply additional epoxy around the perimeter of the new material. (See Figure 2) Remove excess epoxy.
Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.
Caution: Some components may be sensitive to high temperatures.
Remove the tape and cut off the excess material using the razor saw. Mill or file the dowel flush with the board surface. (See Figure 3)
Complete the procedure by redrilling holes and adding circuitry as required. (See Figure 3)
Note: Apply surface coating to match prior coating as required.
Clean the reworked area.

Evaluation

Visual and dimensional examination of the reworked area for conformance to drawings and specifications.

Images and Figures

Hole Repair, Transplant Method

Figure 1. A damaged non-plated hole.

Figure 2. New hole is milled to encompass entire damaged area.

Figure 3. Place replacement dowel in position and bond with epoxy.

Figure 4. Cut off excess material and re-drill holes as required.

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Product Type
Assemblies Bare PCBs Other

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3.3.2 Hole Repair, Transplant Method

This procedures covers major repair of damage to non-plated holes on circuit board assemblies. Minimum Skill Level: Expert Conformance Level: High

This procedures covers major repair of damage to non-plated holes on circuit board assemblies.

Minimum Skill Level: Expert
Conformance Level: High