7.3.1 Soldering Surface Mount Chip Components, Point To Point Method
Install surface mount chip components using controlled point-to-point soldering techniques. Covers pad preparation, alignment and heat management for reliable attachment.
Minimum Skill Level: Intermediate
Conformance Level: High
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Soldering Surface Mount Chip Components, Point To Point Method
Prefill one pad with solder.
See preheating recomendations for tantalum and ceramic capacitors.
Place the soldering iron tip at the junction between the prefilled pad and component lead.
Solder the other opposite side of the component.
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