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Jeff Ferry, President
Circuit Technology Center
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Sep 23, 2025 BGA Conductor Path Re-design This redesign project centered around a 676-ball BGA (Ball Grid Array) component. During evaluation, it was determined that 23 solder balls were not correctly connected. ... |
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Aug 13, 2025 Review of Hot Air Component Rework for SMT Components There are many hot air-based component rework tools and machines available today. Many are large, some small, but all have various means of delivering hot ... |
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Jul 16, 2025 Navigating the Challenges of Jumper Wire Work In the world of circuit board assembly, adding jumper wires is often unavoidable. Whether you're refining a prototype, modifying a finished design, or correcting a ... |
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Jun 19, 2025 Gold Plating 1000+ BGA Pads: A Behind-the-Scenes Look at a Precision Rework When engineers develop or refine electronic products, their work often centers around BGA (Ball Grid Array) components. These devices are common candidates for modification, and ... |
