8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas Method

Preparation
This method uses hot air nozzles that do not touch the component. Gas or air is heated, forced through a specially designed nozzle, and directed onto the component leads and surface pads.

Hot gas/air nozzles come in several sizes to accommodate many different components styles and sizes. Measure the overall length and width of the component to select the proper size tip. Check the nozzle for proper fit before processing the part. Some hot gas/air nozzle designs will heat only the component leads and pad area. (See Figure 1, Left Side) Some hot air nozzle designs heat the entire component, the leads, and the pad area. (See Figure 1, Right Side)

Hot gas/air can be used to remove many different styles of SMT components, but the heated gas/air must be directed onto the leads and pads and away from the top of the component and circuit board surface.

Hot gas/air nozzles may or may not include vacuum assistance to lift the component off the circuit board surface.

Procedure

1. Place the pre-heated circuit board on the Positioning Table. A heated positioning table is available to pre-heat the circuit board or to maintain the pre-heated temperature when many components need to be removed from one circuit board.
2. Apply a small amount of liquid flux to all component leads.
3. Place the nozzle directly over the top of the component and activate the airflow. When the solder has melted, actuate the vacuum assist or lift off the component with a vacuum pen. Lift the component straight up. (See Figure 2)
   
   Knowing precisely how long to dwell before safely removing the part is difficult. This is further complicated because parts subsequent to the first come off much faster when removing a bank of components. The smaller the part, the quicker it reflows. Small SMT components may reflow in a few seconds, and large SMT components may take more than a minute.
4. Clean the area.