Outline
This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface.
Caution
This method should not be used to rebond a circuit that has been stretched or damaged.
Proprietary Information
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Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
Figure 1: Apply a small amount of epoxy under the entire length of the lifted circuit.
Figure 2: Completed repair.
Procedure
Clean the area.
Remove any obstructions that prevent the lifted circuit from making contact with the base board surface.
Caution
Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor.
Clean the area.
Mix the epoxy.
Carefully apply a small amount of epoxy under the entire length of the lifted circuit. The tip of a knife may be used to apply the epoxy. (See Figure 1)
Press the lifted circuit down into the epoxy and into contact with the base board material.
Apply additional epoxy to the surface of the lifted circuit and to all sides as needed. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.
Caution
Some components may be sensitive to high temperature.
Apply surface coating to match prior coating as required.
Evaluation
Visual examination and tape test per IPC-TM-650 (ANSI/IPC-FC-250A) test method 2.4.1.
