4.1.1 Lifted Conductor Repair, Epoxy Method
This method is used to rebond a lifted circuit. Liquid epoxy is inserted under and around the circuit to bond it back down to the circuit board surface.
This method should not be used to rebond a circuit that has been stretched or damaged.
Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
Tools and Materials
General purpose cleaner for removing contamination.
Disposable brushes for use with solvents for cleaning and application of coatings.
Use to tint the color of epoxy used for solder mask repair or circuit base board repair.
Circuit Bond Epoxy
Clear, superior strength epoxy in two-compartment plastic packages. Shelf life 6 months, no refund or exchange.
Ideal for absorbing cleaning solvents, and applying color agents and epoxies.
Use to dispense a minute amount of adhesive and for micro-positioning of small objects.
General purpose oven for drying, baking and curing epoxies.
Sharp dental style probe for manipulating small objects and removal of small debris.
Hardened stainless steel tip for scraping solder mask and removing defects.
Polypropylene syringe barrels with stainless steel dispensing tips.
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
Figure 1: Apply a small amount of epoxy under the entire length of the lifted circuit.
Figure 2: Completed repair.
Clean the area.
Remove any obstructions that prevent the lifted circuit from making contact with the base board surface.
Be careful while cleaning and removing all obstructions, not to stretch or damage the lifted conductor. Clean the area.
Mix the epoxy.
Carefully apply a small amount of epoxy under the entire length of the lifted circuit. The tip of a knife may be used to apply the epoxy. (See Figure 1)
Press the lifted circuit down into the epoxy and into contact with the base board material.
Apply additional epoxy to the surface of the lifted circuit and to all sides as needed. Cure the epoxy per Procedure 2.7 Epoxy Mixing and Handling.
Some components may be sensitive to high temperature. Apply surface coating to match prior coating as required.
Visual examination and tape test per IPC-TM-650 (ANSI/IPC-FC-250A) test method 2.4.1.
Electrical tests as applicable.
Procedure for reference only.