7.2.1 Soldering Through Hole Components, Point To Point Method

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Outline

This procedure covers the general guidelines for soldering through hole components using a point-to-point soldering method. There is basically only one style of through-hole component. The soldering principles are the same whether there are a few leads or many or whether the component is large or small.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - Medium
This procedure may have some variance with the physical character of the original and most likely varies with some of the functional, environmental and serviceability factors.


Procedure References
1.0	Foreword
2.1	Handling Electronic Assemblies
2.2	Cleaning
2.5	Baking And Preheating
7.1.1	Soldering Basics
7.1.2	Preparation For Soldering And Component Removal
7.1.3	Solder Joint Acceptability Criteria
IPC7711 7.2.1	Soldering Through Hole Components, Point To Point Method

Procedure

Procedure

If needed, form the component and clean the area.
Insert the component into the plated hole. If needed, secure in place by bending leads or other mechanical means.
If needed, apply liquid flux to the plated holes and pads.
Place the soldering iron tip at the pad and component lead junction. Apply a small amount of solder at the junction of the soldering iron tip and lead to make a solder bridge. (See Figure 1)
Note: The size of the solder is important when soldering small components. If the solder is too large, it is easy to melt too much solder into the joint. If the solder is too small, it can take too long to melt the optimum amount into the joint.
Caution: Avoid exerting any pressure on the pad.
Immediately feed the solder into the joint from the side opposite of the soldering iron tip until the proper fillet is achieved. Remove the solder, then remove the iron. The iron may be swept over the end of the component lead to cover it with solder. (See Figure 2)
Note: Apply the solder to the side opposite of the soldering iron tip so that the work surfaces and not the iron will melt the solder.
On multiple lead components, solder the opposite corners first to stabilize the component. Followed by soldering the remaining leads in a random pattern to reduce excessive heat buildup in one area.
Clean the flux residue, if required, and inspect.

Images and Figures

Soldering Through Hole Components, Point To Point Method

Figure 1. Apply solder at the junction of soldering iron tip and lead to make a solder bridge.

Figure 2. Feed solder into the joint from the side opposite from the iron tip until the proper fillet is achieved.

7.2.1 Soldering Through Hole Components, Point To Point Method

Solder through-hole components using the point-to-point method for precise heat application. Covers lead preparation, solder flow and inspection practices for dependable connections. Minimum Skill Level: Intermediate Conformance Level: Medium

Solder through-hole components using the point-to-point method for precise heat application. Covers lead preparation, solder flow and inspection practices for dependable connections.

Minimum Skill Level: Intermediate
Conformance Level: Medium