Circuit Technology Center

Component Tinning Services

Our tinning or re-tinning services are used to change the metallic finish of component leads or pads, most commonly to change leads or pads with a lead-free solder finish to a leaded solder finish for tin whisker elimination. Tinning is also used for gold plating removal or mitigation.

We use fully programmable robotic hot solder dip machines (RHSD) to precisely control dip depth, dwell times and temperatures for processing of components in full compliance with GEIA-0006 standards. When required, 100% removal of tin finish is replaced with tin-lead (Sn63/Pb37) for tin whisker mitigation.

Gold removal/mitigation is completed in accordance with J-Std-001 specifications. We use batch wash systems for post process cleaning, provide tape and reel services, component MSL bake and packaging and pre/post process testing as needed.

In house post processing testing capabilities include:
  • Ionic cleanliness (ROSE) testing per IPC-TM-650-2.3.25
  • XRF for alloy composition and finish thickness per JESD 213
  • Solderability testing per J-STD-002
  • Visual inspection
Other available testing services include:
  • SAM (scanning acoustic microscopy) testing per J-STD-035
  • Destructive physical analysis (DPA) per MIL-STD-1580
  • Hermeticity testing (fine and gross leak) per MIL-STD-883
  • Temperature, humidity and bias testing
  • Parametric testing
Component Marking and Packaging Services include:
  • Tape and Reel service per EIA 481
  • Component dry baked per J-Std-033
  • Component packaging per J-Std-020
Learn About Our Component Reballing Services


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