Scrap and obsolete printed circuit boards can often contain valuable and difficult to source electronic components. The experts at Circuit Technology Center have over 35 years of experience, the equipment and process knowledge to safely and reliably remove and salvage all types of components from fully assembly printed circuit boards, including fine pitch QFP's, bottom terminated devices such as BGA's and LGA's and multi-pin through hole connectors.
Fully programmable, hot gas rework systems manufactured by Air-Vac Engineering are used to carefully and selectively remove QFP's, BGA's, LGA's and other bottom-terminated devices. Equipped with seven of these workhorse systems, Circuit Technology Center has the capacity to support high and low-volume projects, often on expedited turn times.
Hot gas system removing a BGA device from an assembled PCB.
BGA devices can be cleaned of residual solder after salvage and re-balled with either tin/lead solder or RoHS-compliant lead-free solder. High and low-volume BGA re-balling services are provided. Our Robotic Hot Solder Dip (RHSD) equipment can refinish and remove excess solder from the leads SMT and through-hole devices.
Vacuum de-soldering systems are used for small through-hole removal projects. We call upon our Electrovert Solder Fountain Systems for demanding multi-lead through-hole device removal and salvage.
Circuit board assemblies will be pre-baked prior to device salvage per J-STD-020 and the device manufacturer’s guidelines in dedicated MSL bake-out ovens.
Parts will be MSL packaged post-processing in a vacuum-sealed ESD barrier bag with a desiccant pack and a moisture sensitivity card, and the sealed package will be labeled per J-STD-033 protocols. The re-tape and reel of devices in accordance with EIA-481E standards are also supported.