8.0 Rework Procedures
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8.0 Component Rework Procedures
List of component removal and rework procedures, including removal of through-hole components, removal of chip components, removal of J lead components, and removal of gull-wing components.
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8.1.1 Component Removal, Through Hole Components, Vacuum Method
The procedure covers the removal of through-hole components on assembled circuit boards.
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8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
The procedure covers the removal of through-hole components on assembled circuit boards.
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8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
The procedure covers the removal of surface mount chip components on assembled circuit boards.
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8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
The procedure covers the removal of surface mount chip components on assembled circuit boards.
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8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
The procedure covers the removal of surface mount J lead components on assembled circuit boards.
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8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
The procedure covers the removal of surface mount J lead components on assembled circuit boards.
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8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
The procedure covers the removal of surface mount gull wing components on assembled circuit boards.
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8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
The procedure covers the removal of surface mount gull wing components on assembled circuit boards.
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Procedure for reference only.
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