9.1.2 BGA Component Rework Inspection

Introduction
Circuit Technology Center, Inc has prepared this document. The purpose is to ensure repeatable, high-quality rework of BGA components and to assure conformity to the highest industry standards and specifications.

Note: This document covers procedures and guidelines specific to BGA component rework conducted by the staff at Circuit Technology Center, Inc. Organizations using this information may need to make modifications or other changes to accommodate their own particular needs.

Visual Inspection

1. Check BGA alignment and confirm that the component is centered correctly over the pad array.
2. Examine the solder mask for any signs of chipping, delamination, or damage to the mask around the pad areas.
3. Inspect for residual flux or contamination and clean if necessary.
4. Look for solder bridges, splashes, or solder balls around the perimeter.
5. Confirm that there is no physical damage to the BGA component or nearby components during rework.

X-Ray Inspection

1. Inspect solder joints beneath the BGA for any of the following:
   A. Cold solder joints
   B. Voids or insufficient solder
   C. Bridging between balls
   D. Ball collapse consistency (indicating uniform reflow)

2. Check for head-in-pillow defects or missing balls.

3. All solder balls exhibit uniform shape and size with consistent collapse.

4. All solder balls do not have voids that exceed the quality threshold (typically <25% of ball volume).

5. The circuit board surface is clean, with no foreign debris or residue.