9.1.2 BGA Component Rework Inspection

QUICK QUESTION?

Have a general inquiry?
Send us a message below.

Submit a quote request using our quote form.

First Name *

Last Name *

Email *

Phone Number

Job Title

Company Name *

How Can We Help? *

File Upload

To upload multiple files, select them together using Ctrl-click on Windows or Command-click on Mac. Upload images, PDFs, Gerbers, data sheets, or other relevant files.

CAUTION
Do not submit Controlled Unclassified Information (CUI) through this form.

FORM SECURITY
Our forms are hosted with Amazon Web Services in the United States and use an industry-leading web application firewall. Data and uploads are encrypted at rest using AES-256 block-level storage encryption. We use a minimum of TLS 1.2 to encrypt network traffic between your web browser and our forms.

Outline

This procedure is designed to ensure the quality and reliability of a BGA component replacement by inspecting the circuit board and the newly installed component for proper soldering, alignment, and absence of defects.

Minimum Skill Level - Advanced

Recommended for technicians with soldering and component rework skills and exposure to most repair/rework procedures, but lacking extensive experience.

Conformance Level - High

This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Procedure References
1-0	1.0 Foreword
2-1	2.1 Handling Electronic Assemblies
2-2	2.2 Cleaning Procedures
2-5	2.5 Baking and Preheating

Tools and Materials

Microscope
Precision microscope with stand and lighting for work and inspection.

Procedure

Introduction
Circuit Technology Center, Inc has prepared this document. The purpose is to ensure repeatable, high-quality rework of BGA components and to assure conformity to the highest industry standards and specifications.

Note: This document covers procedures and guidelines specific to BGA component rework conducted by the staff at Circuit Technology Center, Inc. Organizations using this information may need to make modifications or other changes to accommodate their own particular needs.

Visual Inspection

Check BGA alignment and confirm that the component is centered correctly over the pad array.
Examine the solder mask for any signs of chipping, delamination, or damage to the mask around the pad areas.
Inspect for residual flux or contamination and clean if necessary.
Look for solder bridges, splashes, or solder balls around the perimeter.
Confirm that there is no physical damage to the BGA component or nearby components during rework.

X-Ray Inspection

Inspect solder joints beneath the BGA for any of the following:
A. Cold solder joints
B. Voids or insufficient solder
C. Bridging between balls
D. Ball collapse consistency (indicating uniform reflow)
Check for head-in-pillow defects or missing balls.
All solder balls exhibit uniform shape and size with consistent collapse.
All solder balls do not have voids that exceed the quality threshold (typically <25% of ball volume).
The circuit board surface is clean, with no foreign debris or residue.

Images

BGA Component Rework Inspection