The illustrations were created by Circuit Technology Center and are used by IPC under a license agreement.
Outline
Introduction to the comprehensive online guidebook written and produced by Circuit Technology Center.
1.1 Introduction
Circuit boards are more complex today than ever, but they can be repaired despite how severely damaged they may be. Indeed, the high value of many circuit boards demands that they be repaired. Even less expensive assemblies require repair because just-in-time manufacturing and tightly controlled production runs leave little room for shortages.
Today's circuit boards have fine-pitch components, ball grid arrays, and fine-line circuits, making them challenging to repair. Yet, we're driven by simple economics and must repair damaged circuit boards whenever possible. This manual is designed to help you reliably repair assembled circuit boards that might otherwise be consigned to scrap.
Because of its high demands, circuit board repair has been accurately compared to surgery. Whether repairing surface mount pads or repairing damaged internal circuitry, the technical knowledge and manual skills needed for high-reliability repair and rework are demanding. Since today's repair procedures are more sophisticated than ever before, you need a comprehensive guidebook.
Repair specialists worldwide have used this guidebook to repair thousands of circuit boards. Circuit Technology Center, the world's leading specialist in circuit board repair and rework services, has pioneered many of the procedures in this guidebook.
Damaged circuit boards may be compared to patients in a hospital. Some will need a stitch or two, while others will need open heart surgery. Each repair project must follow proven and well-established procedures to expect a reliable outcome. This guidebook covers repair, rework, and modification of circuit boards and assemblies. Also included are procedures for electronic component thinning, BGA component reballing, and electronic component reclamation. This guidebook will give you details for most procedures, explain why specific procedures are essential, and answer many questions.
1.2 Purpose
This guidebook includes procedures for modifying, reworking, and repairing printed boards and printed board assemblies. It complies with standards set by the IPC in Bannockburn, IL. The main IPC documents to refer to when using this guidebook include the following:
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
IPC-A-600 Acceptability of Printed Boards
IPC-A-610 Acceptability of Electronic Assemblies
IPC 7711 Rework of Electronic Assemblies
IPC 7721 Modification, Rework and Repair of Printed Boards and Electronic Assemblies
1.3 Classes of Product
Three Classes of Products are referred to in this guidebook.
Class 1 General Electronic Products
Includes consumer products, some computer products, computer peripherals, and hardware suitable for applications where the major requirement is the function of the completed assembly.
Class 2 Dedicated Service Electronic Products
Includes communications equipment, sophisticated business machines, and instruments where high performance and extended life are required and for which uninterrupted service is desired but not critical. Typically, the end-use environment would not cause failures.
Class 3 High-Performance Electronic Products
Includes equipment for commercial and military products where continued performance or performance-on-demand is critical. Equipment downtime cannot be tolerated, the end-use environment may be uncommonly harsh, and the equipment must function where required, such as life support and critical weapons systems.
1.4 Printed Board Types
Four Printed Board Types are referred to in this guidebook.
Rigid Printed Boards and Assemblies - R
A printed board or assembly using rigid base materials only. These may be single-sided, double-sided, or multilayered.
Flexible Printed Boards and Assemblies - F A printed board or assembly using flexible or a combination of rigid and flexible materials only. It may be partially provided with electrically nonfunctional stiffeners and/or a cover layer. These may be single-sided, double-sided, or multilayered.
Discrete Wiring Boards and Assemblies - W A printed board\assembly using a wire technique to obtain electrical interconnections.
Ceramic Boards and Assemblies - C
A printed board or assembly using ceramic as the base material with interconnections separated by dielectric.
1.5 Conformance Level
Conformance Level indicates how closely the repaired or reworked product will be to the original specifications. The Conformance Level listed for each procedure should only be used as a guide. Conformance Levels include the following:
High Most closely duplicates the physical characteristics of the original and most probably complies with all the functional, environmental, and serviceability factors.
Medium Some variance with the physical character of the original and most likely varies with some of the functional, environmental, and serviceability factors.
Low Significant variance with the physical character of the original and may vary with many of the electrical, functional, environmental, and serviceability factors.
Class 3 Products must use procedures rated High unless it can be demonstrated that a lower-level procedure will not adversely affect the product's functional characteristics.
Class 2 and 1 Products should use procedures rated High for assured safety and dependability, but Medium or Low-Level procedures can be used if they are suitable for the specific product's functional characteristics.
Procedures in this manual are given a "Conformance Level" rating described in the following table.
TABLE 1 - Conformance Level
Functional Consideration
High
Medium
Low
Electrical - Resistance
Yes
Verify
No
Electrical - Inductance
Yes
Verify
No
Electrical - Capacitance
Yes
Verify
No
Electrical - Cross Talk
Yes
Verify
No
Electrical - High Speed Frequency
Yes
Verify
No
Environmental - Shock
Yes
Verify
No
Environmental - Vibration
Yes
Verify
No
Environmental - Humidity
Verify
Verify
Verify
Environmental - Temperature
Yes
Yes
Yes
Environmental - Altitude
Verify
Verify
Verify
Environmental - Bacteria
Yes
Verify
Verify
Environmental - Fungus
Yes
Verify
Verify
Serviceability - Future Repair or Mod.
No
Yes
Yes
No - The procedure may not comply with functional considerations.
Verify - The procedure should comply with functional considerations but be tested for verification.
Yes - The procedure will normally comply with functional considerations.
1.6 Skill Level
Most processes are tightly controlled and one-directional in the circuit board manufacturing and assembly environment. The technicians who run these processes have specific defined characteristics and training. As you look deeper into the repair operation, the first thing that becomes apparent is that an entirely different set of skills is needed. Repair skills are more specific. They require more manual dexterity, patience, and a thorough understanding of the repair process. More steps are involved in any repair operation than the typical assembly technician would be confronted with. It becomes a personnel issue as well as a training one. You must have the proper training program and the right people.
Repair personnel can't be part-timers and repair circuit boards only one day a week or on a rotational basis with other duties. They should be dedicated to the repair operation and do nothing but repair. For challenging procedures to be done reliably, they must be done repeatedly. Furthermore, some repair skills are so specific that they should be limited to certain individuals who demonstrate an affinity for the job rather than attempting to train a general number of persons to do the same difficult task.
Considerable supervision is required during the basic phase of the training operation, with lots of individual help and attention. The key is not to attempt to move people too fast on the road to proficiency. It's a step-by-step approach. Regardless of who provides the training, personnel is the greatest cost and investment. Personnel is key to the success of the whole operation.
Three Skill Levels are referred to in this guidebook. The Skill Level recommended should be used as a guide only.
Intermediate - I Technician with basic soldering and component rework skills but inexperienced in general repair/rework procedures.
Advanced - A Technician with soldering and component rework skills and exposure to most repair/rework procedures but lacking extensive experience.
Expert - E Technician with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.
1.7 Key Tools and Materials Repair is and may always be a highly labor-intensive operation relying more on individual operator skills than automation. Despite the availability of very good tools for repair, many in-house repair operations are poorly equipped. Here are a few guidelines for the basic equipment needed in an up-to-date repair operation.
Ergonomic Workstation
Good repair work can't be done at an old workbench or makeshift setup. Performing circuit board repair requires a high degree of concentration and dexterity. Therefore, an ESD-grounded workstation with proper lighting, outlets, and comfort is essential. Commonly used systems can be bolted to the work surface to improve efficiency.
High Quality Stereo Microscope
Precision repair cannot be done without a microscope of this type, which is available for repair operation 100% of the time. Limited access will not do since it must be used constantly. Although video cameras and monitors may be fine for inspection or training, they should be avoided. They cannot provide the clarity that quality optics offer. Also, the microscope needs good light. Halogen or fiber optic lighting systems with flexible goose-necks to direct the light are the best for this application.
Soldering
Precision soldering is vital to modern repair operations. Repair technicians can't get by with the traditional soldering tools that were commonly used as recently as a few years ago. They need the best soldering irons that are highly controlled, ergonomically designed, and feature a wide assortment of small tips.
Component Removal Tools
Today's expanding variety of large and small components requires an array of special-use tools and methods for safe, efficient component removal. These tools generally use either conductive heating (by contact), convective heating (by hot gas), or infrared heating (by focused infrared lamps.) Each method has its advantages and disadvantages depending on the particular application.
Preheating Station
You should preheat the entire circuit board before removing SMT components when possible. Preheat minimizes thermal shock due to localized heating in the rework area and speeds up the rework process. Most facilities have a curing/drying oven, but a preheating station for maintaining heat in addition to the oven is often necessary. A hotplate-style preheater or infrared heater will maintain the board's temperature after it is removed from the oven or heat it from ambient temperature.
Note: Some manufacturers of ceramic chip capacitors recommend that the Preheat Ramp Rate not exceed 2-4 C/Sec.
Micro Drilling and Grinding Tool
Bulky, hand-held drilling and grinding tools with both the motor and power supply within the handpiece are difficult to manipulate for the detailed work necessary in repair. The type needed is preferably a lightweight, high-quality, dental-style drilling tool.
Precision Drill System Repair and rework projects often require making precise holes, slots, grooves, etc. Precision, accurate depth control, and high speed are a must. The ideal system should have a base plate to pin circuit boards in place and an optional microscope attachment.
Replacement Circuits and Pads Circuits and surface mount pads can be replaced using liquid epoxy, but liquid epoxy can be messy and unreliable when replacing fine pitch pads. Pads are available with a dry film adhesive on the back. These replacement pads and circuits are heat-bonded to the board surface and available in any pattern you may need.
Gold Contact Plating Plating gold edge contacts or any metal surface is a serious business. The chemicals used are hazardous and must be handled properly. The power applied to the plating surfaces must be controlled accurately to expect reliable results.
Base Board Repair Kits and Coloring Agents For many repair operations you need high strength, high-temperature epoxies. You should select a two-part epoxy because it offers high strength, thermal resistance, and durability that one-part and quick-setting epoxies do not have. It is also important to have masks or coloring agents to restore the board's cosmetic appearance. It is best to cure the epoxies in an oven if possible.
Eyelets and Eyelet Press Solder plated copper eyelets and an eyelet press to repair damaged plated through holes is generally required.
1.8 How To Set Up An In-House Circuit Board Repair Department It's a fact that far more printed circuit assemblies are damaged during the manufacturing process than they are in the field. And even though circuit boards are more complex today than ever, they are still repairable. Ten years ago, boards were much simpler, and repairs were easy, but the assemblies also cost much less. Today's printed circuit manufacturers and assemblers are driven by simple economics. They must repair damaged circuit boards. The primary question is whether to develop and maintain an in-house full repair department or contract the repair. Which choice makes the most sense?
Note: IPC defines Rework and Repair as follows. Rework - The act of reprocessing non-complying articles through the use of original or equivalent processing in a manner that assures full compliance of the article with applicable drawings or specifications. Repair - The act of restoring the functional capability of a defective article in a manner that precludes compliance or the article with applicable drawings or specifications.
Repair encompasses much more than rework, i.e., removing/reattaching components. You must be prepared to commit to several critical areas if you plan to complete repair work in-house. If not, you are better off contracting the work out to a reputable repair facility. More damage can be done to a board from a botched repair than from most other causes. Aside from soldering and desoldering, other aspects of repair can include replacing damaged circuits, gold contacts, and SMT pads; re-plating solder-contaminated gold contacts; repairing burns or physical damage to the laminate; repairing through-holes; and more. Both contract manufacturers and OEMs will benefit from establishing a good in-house repair operation.
Five Keys to Reliability There are five basic requirements needed for the successful implementation of a high-quality circuit board repair department:
Documented Standards The key starting point, of course, is a good set of documented standards. Standards will establish which types of defects are accepted as is and which are not. Although most major manufacturers have their own set of accepted standards, small manufacturers can obtain commercially available guidelines, particularly from the IPC. Specific documents include IPC A-600 and IPC-A-610. Good working knowledge of these standards can prevent unnecessary repairs.
Documented Procedures Every repair operation, whether replacing a pad or re-plating a gold contact, requires specific procedures. This book aims to provide you with a detailed explanation of each procedure. If you need more information, an excellent additional reference source is the IPC's publications IPC-7711 Rework of Electronic Assemblies and IPC-7721 Repair and Modification of Printed Boards and Electronic Assemblies. These IPC publications, along with this Guidebook, should be an integral part of your repair department and can serve as a tool for training repair personnel. To obtain copies of these publications, contact the IPC. Copies can also be obtained from Circuit Technology Center, Inc.
Once you know what can be repaired and have the necessary guidance, the next step is completing the repair, which requires qualified personnel. Of course, even the most highly skilled technicians require training to perform their best. Operators and technicians must be properly trained for your Rework and Repair Program to obtain successful results.
Comprehensive Training Repair personnel can't be part-timers and repair only one day a week or on a rotational basis with other duties. They should be dedicated exclusively to the repair operation. This is to develop a high skill level and maintain it through repetition. For many challenging aspects of repair to be done reliably, they must be done repeatedly, such as replacing fine-pitch surface mount pads. Furthermore, some repair skills are so specific that they should be limited to certain individuals who demonstrate an affinity for the job rather than attempting to train a general number of persons to do the same difficult task.
Considerable supervision is required during the basic phase of the training operation, with lots of individual help and attention. The key is not to attempt to move people too fast on the road to proficiency. It's a step-by-step approach. Other companies may do it differently, but this is our method. Regardless of who provides the training, you will find that personnel is the greatest cost and investment. Personnel is key to the success of the whole operation. Equipment costs are quite low in comparison.
Modern, Up-To-Date Equipment Repair is and may always be a highly labor-intensive operation relying more on individual operator skills than automation. Despite the availability of excellent tools for repair, many in-house repair operations are poorly equipped.
Highly Skilled Technicians In the circuit board manufacturing and assembly environment, most processes are tightly controlled and one-directional. The technicians who run these processes have certain defined characteristics and training. As you look deeper into the repair operation, the first thing that becomes apparent is that repair personnel need an entirely different set of skills from assembly personnel. Repair skills are more specific. They require more manual dexterity, patience, and a thorough understanding of the repair process. More steps are involved in any repair operation than the typical assembly technician would be confronted with. It becomes a personnel issue as well as a training one. You must have the proper training program and the right people.
1.9 Tools and Materials
The following is a more extensive list of tools, machines, systems, and materials used during circuit board and component rework, repair, and modification.
Abrader
Mild abrasive for removing oxides and contaminants.
Abrasive Pads
Light duty abrasive scrubbing pads to remove contamination and blend surfaces.
Aerospace Repair Kit
Kit to replace damaged lands and pads where out-gassing of epoxy may be an issue.
