10.9 Component Reclaim, BGA/CSP Components

1. Ensure the components meet the acceptable Moisture Sensitivity Level (MSL) for processing. 
   Note: For details on baking and moisture control, refer to Procedure 2.5 Baking and Preheating..
2. Remove conformal coating from the component if present. See Section 2 for conformal coating removal guidelines.
3. If needed, clean the rework area to remove contamination, oxides, or residues. 
4. Secure the circuit board in a board holder (See Figure 2) or on the base of the rework tool or system (See Figures 3 and 4). A hot plate may be used to provide added bottom-side heating. 
5. Install the appropriate size nozzle based on the component type. Set system controls to the required settings to minimize thermal stress and prevent overheating.
6. Apply flux to the solder joints. (See Figure 5)
7. Align the component under the nozzle. (See Figure 6)
8. Lower the nozzle, check the alignment, and adjust as needed. 
9. If a vacuum lift is available, lower the vacuum pickup until it contacts the component.
10. Initiate the hot gas reflow cycle, observing the solder melt on all solder ball joints. Then activate the system vacuum and raise the nozzle and component a minimum of 25mm above the circuit board. (See Figure 6)
11. Turn off the heated air flow while maintaining the vacuum to retain the component.
12. Allow the component to cool for at least 10 seconds before removal.
13. Clean the component as required. Visually inspect for cleanliness and physical condition.
14. This removal process will damage the solder balls on the component. The solder ball will require replacement before the component can be reused. See Section 9 BGA Component Rework and Reballing Procedures. 

Evaluation

1. Visual examination
2. Tests or other inspection criteria as specified.