4.0 Conductor Procedures

4.1.1 Lifted Conductor Repair, Epoxy Method Procedure to repair lifted conductors and circuits using liquid epoxy. 4.1.2 Lifted Conductor Repair, Film Adhesive Method Procedure to repair lifted conductors and circuits using a dry film epoxy method. 4.2.1 Conductor Repair, Foil Jumper, Epoxy Method Procedure covers repair of damaged conductors and circuits using liquid epoxy. 4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method Procedure covers repair of damaged conductors and circuits using a dry film epoxy method. 4.2.3 Conductor Repair, Welding Method Procedure covers repair of damaged conductors and circuits using a welding method. 4.2.4 Conductor Repair, Surface Wire Method Procedure covers repair of damaged conductors and circuits using a surface jumper wire. 4.2.5 Conductor Repair, Through Board Wire Method Procedure covers repair of damaged conductors and circuits using a jumper wire feeding through the circuit board assembly. 4.2.6 Conductor Repair, Inner Layer Method Procedure covers repair damaged conductors and circuits on inner layers on circuit board assemblies. 4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method Procedure covers repair of damage to surface ground planes on circuit board assemblies. 4.3.1 Circuit Cut, Surface Circuits Procedure covers methods to cut surface conductors on circuit board assemblies. 4.3.2 Circuit Cut, Inner Layer Circuits Procedure covers method to cut inner layer conductors and circuits on circuit board assemblies. 4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method Procedure covers method to delete connections at a plated through hole on circuit board assemblies. 4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method Procedure covers method to delete connections at a plated through hole on circuit board assemblies by cutting the plated hole traces. 4.4.1 Lifted Land Repair, Epoxy Seal Method Procedure covers method to repair lifted lands on circuit board assemblies using liquid epoxy. 4.4.2 Lifted Land Repair, Film Adhesive Method Procedure covers method to repair lifted lands on circuit board assemblies using dry film adhesive. 4.5.1 Land Repair, Epoxy Method Procedure covers method to repair damaged lands on circuit board assemblies using liquid epoxy. 4.5.2 Land Repair, Film Adhesive Method Procedure covers method to repair damaged lands on circuit board assemblies using dry film adhesive. 4.6.1 Edge Contact Repair, Epoxy Method Procedure covers method to repair damaged edge contacts on circuit board assemblies using liquid epoxy. 4.6.2 Edge Contact Repair, Film Adhesive Method Procedure covers method to repair damaged edge contacts on circuit board assemblies using dry film adhesive. 4.6.3 Edge Contact Repair/Rework, Plating Method Procedure covers method to repair damaged to the plating of edge contacts on circuit board assemblies. 4.7.1 Surface Mount Pad Repair, Epoxy Method This procedure covers a method to repair damaged surface mount pads on circuit board assemblies using liquid epoxy. 4.7.2 Surface Mount Pad Repair, Film Adhesive Method Procedure covers method to repair damaged surface mount pads on circuit board assemblies using dry film adhesive. 4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method Procedure covers method to repair damaged BGA pads on circuit board assemblies using dry film adhesive. 4.7.4 Surface Mount, BGA Pad with Integral Via Repair Procedure covers method to repair damaged BGA pads that have an integral via on circuit board assemblies. 4.7.5 Surface Mount, BGA Pad, Integral Via, Circuit Extension Method Procedure covers method to repair damaged BGA pads that have an integral via on circuit board assemblies. 4.7.6 Surface Mount Pad Repair, Film Adhesive Method, Butt Joint Method Procedure covers method to repair damaged surface mount pads on circuit board assemblies using dry film adhesive.