Outline
This procedure outlines the inspection method and pass/fail criteria to be used during the final inspection of BGA Component Deballing and Reballing to ensure compliance with Work Order requirements.
Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
Kits and Systems
Part No. / Item / Description
Price
Order
Precision Tool Set Nine precision-crafted tools for detailed circuit board work.
Cleaning Brushes Disposable brushes for solvent cleaning and application of coatings.
$12.00 Pkg/5
Additional Items and Supplies
Cleaner General purpose cleaner for removing contamination.
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Cleaning System Batch or inline cleaning system for removing fluxes and contamination.
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Gloves Disposable, puncture-resistant gloves designed for handling mild chemicals.
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Microscope Precision microscope with stand and lighting for work and inspection.
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Wipes Nonabrasive, low-linting wipes for cleanup.
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Images and Figures
Missing solder spheres. Reject.
Grazed or nicked spheres. Reject - violates sphere dimensional tolerances.
Crushed solder spheres. Reject.
Foreign object debris and flux residue. Reject.
Sphere off-center or sheared. Reject.
Irregular shaped sphere. Reject if violates sphere dimensional tolerances.
Excessive flux and oxidation. Reject.
Substrate damage. Reject.
Moisture Sensitive Device Control
Before processing, review the requirements for moisture sensitivity.
BGA Inspection Objective
Visual inspection confirms sphere condition, ball alignment, size, and location to ensure the reballing process complies with IPC and JEDEC specifications.
Deballing Inspection Procedure
Components shall be examined for:
Pad Defects (scratches, etc.)
Solder Mask Damage
Residue of the previous alloy
Flux Residue
FOD (Foreign Objects and Debris)
Reballing Inspection Procedure
Components shall be examined for:
Cracks
Missing Spheres
Sphere Shape
Chipouts
Grazed/Nicked Spheres
Sphere Placement
Flux
Oxidation
FOD (Foreign Objects and Debris)
Dimensions per Mechanical Data Sheets
Disposition of Rejected Components
The Material Review Process shall address failed components due to internal or external standards.
