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9.1.3 BGA Component Reball Inspection

Outline
This process outlines the inspection method and pass/fail criteria to be used during the final inspection of BGA Component Deballing and Reballing to ensure compliance with Work Order requirements.

Proprietary Information Proprietary
This guide may contain proprietary or copyright-protected information for access by authorized persons only.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
9.4.4 BGA Component Reballing, Robotic Ball Removal, Reflow Oven Attachment Method
CTC - DOC18 Moisture Sensitive Device Control
IPC J-STD-033 Joint Industry Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
IPC 7095 Design and Assembly Process Implementation for BGAs
PC A-610 Acceptability of Electronic Assemblies
MIL STD 883 Methods, Controls, and Procedures for Testing Microelectronic Devices
Tools and Materials
Cleaner
Cleaner
General purpose cleaner for removing contamination.
235-2106-5
Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
Cleaninjg System
Cleaning System
Batch or inline cleaning system for removing fluxes and contamination.
Gloves
Gloves
Disposable, puncture-resistant gloves designed for handling mild chemicals.
Microscope
Microscope
Precision microscope with stand and lighting for work and inspection.
Wipes
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
9.1.3 BGA Component Reball Inspection
Missing solder spheres. Reject.
9.1.3 BGA Component Reball Inspection
Grazed or nicked spheres. Reject - violates sphere dimensional tolerances.
9.1.3 BGA Component Reball Inspection
Crushed solder spheres. Reject.

9.1.3 BGA Component Reball Inspection
Foreign object debris and flux residue. Reject.
9.1.3 BGA Component Reball Inspection
Sphere off-center or sheared. Reject.
9.1.3 BGA Component Reball Inspection
Irregular shaped sphere. Reject if violates sphere dimensional tolerances.

9.1.3 BGA Component Reball Inspection
Excessive flux and oxidation. Reject.
9.1.3 BGA Component Reball Inspection
Substrate damage. Reject.
Moisture Sensitive Device Control
Prior to processing review requirements for moisture sensitivity. http://www.circuitrework.com/secure/DOC18_full.html fiew BGA Inspection Objective
Visual inspection is used to confirm sphere condition, ball alignment, size and location to ensure that the reballing process performed is in compliance with IPC and JEDEC specifications.

Deballing Inspection Procedure

Components shall be examined for:
  1. Pad Defects (scratches, etc.)
  2. Solder Mask Damage
  3. Residue of the previous alloy
  4. Flux Residue
  5. FOD (Foreign Objects and Debris)
Reballing Inspection Procedure

Components shall be examined for:
  1. Cracks
  2. Missing Spheres
  3. Sphere Shape
  4. Chipouts
  5. Grazed/Nicked Spheres
  6. Sphere Placement
  7. Flux
  8. Oxidation
  9. FOD (Foreign Objects and Debris)
  10. Dimensions per Mechanical Data Sheets
Disposition of Rejected Components
Failed components due to internal or external standards shall be addressed by the Material Review Process.
Procedure for reference only.