9.1.3 BGA Component Reball Inspection

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Outline

This procedure outlines the inspection method and pass/fail criteria to be used during the final inspection of BGA Component Deballing and Reballing to ensure compliance with Work Order requirements.

Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.


Procedure References
1.0	Foreword
2.1	Handling Electronic Assemblies
2.2	Cleaning
2.5	Baking And Preheating
9.4.1	BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
9.4.2	BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
9.4.3	BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
9.4.4	BGA Component Reballing, Robotic Ball Removal, Reflow Oven Attachment Method
CTC - DOC18	Moisture Sensitive Device Control
IPC J-STD-033	Joint Industry Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device
J-STD-001	Requirements for Soldered Electrical and Electronic Assemblies
GEIA-STD-0006	Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
IPC 7095	Design and Assembly Process Implementation for BGAs
PC A-610	Acceptability of Electronic Assemblies
MIL STD 883	Methods, Controls, and Procedures for Testing Microelectronic Devices

Tools, Materials and Supplies

BGA Component Reball Fixtures
BGA reball fixtures precision-built for a specific BGA component.

Cleaning Brushes
Disposable brushes for solvent cleaning and application of coatings.

Cleaner
General purpose cleaner for removing contamination.

Cleaning System
Batch or inline cleaning system for removing fluxes and contamination.

Gloves
Disposable, puncture-resistant gloves designed for handling mild chemicals.

Microscope
Precision microscope with stand and lighting for work and inspection.

Precision Tool Set
Nine precision-crafted tools for detailed circuit board work.

Wipes
Nonabrasive, low-linting wipes for cleanup.

Procedure

Moisture Sensitive Device Control
Before processing, review the requirements for moisture sensitivity.

BGA Inspection Objective
Visual inspection confirms sphere condition, ball alignment, size, and location to ensure the reballing process complies with IPC and JEDEC specifications.

Deballing Inspection Procedure

Components shall be examined for:

Pad Defects (scratches, etc.)
Solder Mask Damage
Residue of the previous alloy
Flux Residue
FOD (Foreign Objects and Debris)

Reballing Inspection Procedure

Components shall be examined for:

Cracks
Missing Spheres
Sphere Shape
Chipouts
Grazed/Nicked Spheres
Sphere Placement
Flux
Oxidation
FOD (Foreign Objects and Debris)
Dimensions per Mechanical Data Sheets

Disposition of Rejected Components
The Material Review Process shall address failed components due to internal or external standards.

Images and Figures

BGA Component Reball Inspection

Figure 1. Crushed solder spheres. This is a reject condition.

Figure 2. Excessive flux and oxidation. This is a reject condition.

Figure 3. Substrate damage. This is a reject condition.

Figure 4. Missing solder spheres. This is a reject condition.

9.1.3 BGA Component Reball Inspection

BGA reball inspection procedures to verify solder sphere alignment, size consistency and attachment integrity. Includes visual and measurement checks to ensure readiness for reinstallation. Minimum Skill Level: Expert Conformance Level: High

BGA reball inspection procedures to verify solder sphere alignment, size consistency and attachment integrity. Includes visual and measurement checks to ensure readiness for reinstallation.

Minimum Skill Level: Expert
Conformance Level: High