9.1.3 BGA Component Reball Inspection

Procedure covers guidelines for inspection of reballed BGA components.
Outline
This procedure outlines the inspection method and pass/fail criteria to be used during the final inspection of BGA Component Deballing and Reballing to ensure compliance with Work Order requirements.
Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Procedure References
1.0 Foreword
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.5 Baking And Preheating
9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
9.4.4 BGA Component Reballing, Robotic Ball Removal, Reflow Oven Attachment Method
CTC - DOC18 Moisture Sensitive Device Control
IPC J-STD-033 Joint Industry Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device
J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
GEIA-STD-0006 Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
IPC 7095 Design and Assembly Process Implementation for BGAs
PC A-610 Acceptability of Electronic Assemblies
MIL STD 883 Methods, Controls, and Procedures for Testing Microelectronic Devices
Kits and Systems

Tools and Materials

Additional Items and Supplies

Images and Figures
9.1.3 BGA Component Reball Inspection
Missing solder spheres. Reject.
9.1.3 BGA Component Reball Inspection
Grazed or nicked spheres. Reject - violates sphere dimensional tolerances.
9.1.3 BGA Component Reball Inspection
Crushed solder spheres. Reject.

9.1.3 BGA Component Reball Inspection
Foreign object debris and flux residue. Reject.
9.1.3 BGA Component Reball Inspection
Sphere off-center or sheared. Reject.
9.1.3 BGA Component Reball Inspection
Irregular shaped sphere. Reject if violates sphere dimensional tolerances.

9.1.3 BGA Component Reball Inspection
Excessive flux and oxidation. Reject.
9.1.3 BGA Component Reball Inspection
Substrate damage. Reject.
Procedure
Moisture Sensitive Device Control
Before processing, review the requirements for moisture sensitivity.

BGA Inspection Objective
Visual inspection confirms sphere condition, ball alignment, size, and location to ensure the reballing process complies with IPC and JEDEC specifications.

Deballing Inspection Procedure

Components shall be examined for:
  1. Pad Defects (scratches, etc.)
  2. Solder Mask Damage
  3. Residue of the previous alloy
  4. Flux Residue
  5. FOD (Foreign Objects and Debris)
Reballing Inspection Procedure

Components shall be examined for:
  1. Cracks
  2. Missing Spheres
  3. Sphere Shape
  4. Chipouts
  5. Grazed/Nicked Spheres
  6. Sphere Placement
  7. Flux
  8. Oxidation
  9. FOD (Foreign Objects and Debris)
  10. Dimensions per Mechanical Data Sheets
Disposition of Rejected Components
The Material Review Process shall address failed components due to internal or external standards.
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