9.1.3 BGA Component Reball Inspection

Outline

This procedure outlines the inspection method and pass/fail criteria to be used during the final inspection of BGA Component Deballing and Reballing to ensure compliance with Work Order requirements.

Minimum Skill Level - Expert

Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.

Conformance Level - High

This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Procedure References
1-0	1.0 Foreword
2-1	2.1 Handling Electronic Assemblies
2-2	2.2 Cleaning Procedures
2-5	2.5 Baking and Preheating
9-4-1	9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
9-4-2	9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
9-4-3	9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
9-4-4	9.4.4 BGA Component Reballing, Robotic Ball Removal Reflow, Reflow Oven Attachment Method

Tools and Materials

Cleaner
General purpose cleaner for removing contamination.

Cleaning Brushes
Disposable brushes for solvent cleaning and application of coatings.

Cleaning System
Batch or inline cleaning system for removing fluxes and contamination.

Gloves
Disposable, puncture-resistant gloves designed for handling mild chemicals.

Microscope
Precision microscope with stand and lighting for work and inspection.

Precision Tool Set
Nine precision-crafted tools for detailed circuit board work.

Wipes
Nonabrasive, low-linting wipes for cleanup.

Procedure

Moisture Sensitive Device Control
Before processing, review the requirements for moisture sensitivity.

BGA Inspection Objective
Visual inspection confirms sphere condition, ball alignment, size, and location to ensure the reballing process complies with IPC and JEDEC specifications.

Deballing Inspection Procedure

Components shall be examined for:

Pad Defects (scratches, etc.)
Solder Mask Damage
Residue of the previous alloy
Flux Residue
FOD (Foreign Objects and Debris)

Reballing Inspection Procedure

Components shall be examined for:

Cracks
Missing Spheres
Sphere Shape
Chipouts
Grazed/Nicked Spheres
Sphere Placement
Flux
Oxidation
FOD (Foreign Objects and Debris)
Dimensions per Mechanical Data Sheets

Disposition of Rejected Components
The Material Review Process shall address failed components due to internal or external standards.

Images

BGA Component Reball Inspection

Crushed solder spheres. This is a reject condition.

Excessive flux and oxidation. This is a reject condition.

Substrate damage. This is a reject condition.

Missing solder spheres. This is a reject condition.

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