Outline
This procedure outlines the inspection method and pass/fail criteria to be used during the final inspection of BGA Component Deballing and Reballing to ensure compliance with Work Order requirements.
Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
Kits and Systems
Precision Tool Set
Nine precision-crafted tools for detailed circuit board work.
Tools and Materials
Cleaning Brushes
Disposable brushes for solvent cleaning and application of coatings.
Gloves
Disposable, puncture-resistant gloves designed for handling mild chemicals.
Additional Items and Supplies
Cleaner
General purpose cleaner for removing contamination.
Cleaning System
Batch or inline cleaning system for removing fluxes and contamination.
Microscope
Precision microscope with stand and lighting for work and inspection.
Wipes
Nonabrasive, low-linting wipes for cleanup.
Images and Figures
Missing solder spheres. Reject.
Grazed or nicked spheres. Reject - violates sphere dimensional tolerances.
Crushed solder spheres. Reject.
Foreign object debris and flux residue. Reject.
Sphere off-center or sheared. Reject.
Irregular shaped sphere. Reject if violates sphere dimensional tolerances.
Excessive flux and oxidation. Reject.
Substrate damage. Reject.
Moisture Sensitive Device Control
Prior to processing, review requirements for moisture sensitivity.
BGA Inspection Objective
Visual inspection is used to confirm sphere condition, ball alignment, size, and location to ensure that the reballing process performed is in compliance with IPC and JEDEC specifications.
Deballing Inspection Procedure
Components shall be examined for:
Pad Defects (scratches, etc.)
Solder Mask Damage
Residue of the previous alloy
Flux Residue
FOD (Foreign Objects and Debris)
Reballing Inspection Procedure
Components shall be examined for:
Cracks
Missing Spheres
Sphere Shape
Chipouts
Grazed/Nicked Spheres
Sphere Placement
Flux
Oxidation
FOD (Foreign Objects and Debris)
Dimensions per Mechanical Data Sheets
Disposition of Rejected Components
Failed components due to internal or external standards shall be addressed by the Material Review Process.
