Outline
This procedure outlines the inspection method and pass/fail criteria to be used during the final inspection of BGA Component Deballing and Reballing to ensure compliance with Work Order requirements.
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Images and Figures![]()
Missing solder spheres. Reject.
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Grazed or nicked spheres. Reject - violates sphere dimensional tolerances.
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Crushed solder spheres. Reject.
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Foreign object debris and flux residue. Reject.
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Sphere off-center or sheared. Reject.
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Irregular shaped sphere. Reject if violates sphere dimensional tolerances.
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Excessive flux and oxidation. Reject.
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Substrate damage. Reject.
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Procedure
Moisture Sensitive Device ControlBefore processing, review the requirements for moisture sensitivity. BGA Inspection Objective Visual inspection confirms sphere condition, ball alignment, size, and location to ensure the reballing process complies with IPC and JEDEC specifications. Deballing Inspection Procedure Components shall be examined for:
Components shall be examined for:
The Material Review Process shall address failed components due to internal or external standards. |
9.1.3 BGA Component Reball Inspection
Procedure covers guidelines for inspection of reballed BGA components.