9.1.3 BGA Component Reball Inspection
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Outline
This process outlines the inspection method and pass/fail criteria to be used during the final inspection of BGA Component Deballing and Reballing to ensure compliance with Work Order requirements.
Proprietary Information 
This guide may contain proprietary or copyright-protected information for access by authorized persons only.
Minimum Skill Level - Expert
Recommended for technicians with advanced soldering and component rework skills and extensive experience in most repair/rework procedures.
Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.
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| Procedure References
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| 1.0 |
Foreword |
| 2.1 |
Handling Electronic Assemblies |
| 2.2 |
Cleaning |
| 2.5 |
Baking And Preheating |
| 9.4.1 |
BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method |
| 9.4.2 |
BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method |
| 9.4.3 |
BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method |
| 9.4.4 |
BGA Component Reballing, Robotic Ball Removal, Reflow Oven Attachment Method |
| CTC - DOC18 |
Moisture Sensitive Device Control
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| IPC J-STD-033 |
Joint Industry Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Device
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| J-STD-001 |
Requirements for Soldered Electrical and Electronic Assemblies
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| GEIA-STD-0006 |
Requirements for Using Solder Dip to Replace the Finish on Electronic Piece Parts
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| IPC 7095 |
Design and Assembly Process Implementation for BGAs
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| PC A-610 |
Acceptability of Electronic Assemblies
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| MIL STD 883 |
Methods, Controls, and Procedures for Testing Microelectronic Devices
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| Tools and Materials
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Cleaner
General purpose cleaner for removing contamination.
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Cleaning Brushes
Disposable brushes for use with solvents for cleaning and application of coatings.
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Cleaning System
Batch or inline cleaning system for removing fluxes and contamination.
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Gloves
Disposable, puncture-resistant gloves designed for handling mild chemicals.
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Microscope
Precision microscope with stand and lighting for work and inspection.
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Wipes
Nonabrasive, low-linting wipes for cleanup.
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Images and Figures
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| Missing solder spheres. Reject. |
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| Grazed or nicked spheres. Reject - violates sphere dimensional tolerances. |
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| Crushed solder spheres. Reject. |
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| Foreign object debris and flux residue. Reject. |
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| Sphere off-center or sheared. Reject. |
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| Irregular shaped sphere. Reject if violates sphere dimensional tolerances. |
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| Excessive flux and oxidation. Reject. |
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| Substrate damage. Reject. |
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Moisture Sensitive Device Control
Prior to processing review requirements for moisture sensitivity.
http://www.circuitrework.com/secure/DOC18_full.html
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BGA Inspection Objective
Visual inspection is used to confirm sphere condition, ball alignment, size and location to ensure that the reballing process performed is in compliance with IPC and JEDEC specifications.
Deballing Inspection Procedure
Components shall be examined for:
- Pad Defects (scratches, etc.)
- Solder Mask Damage
- Residue of the previous alloy
- Flux Residue
- FOD (Foreign Objects and Debris)
Reballing Inspection Procedure
Components shall be examined for:
- Cracks
- Missing Spheres
- Sphere Shape
- Chipouts
- Grazed/Nicked Spheres
- Sphere Placement
- Flux
- Oxidation
- FOD (Foreign Objects and Debris)
- Dimensions per Mechanical Data Sheets
Disposition of Rejected Components
Failed components due to internal or external standards shall be addressed by the Material Review Process.
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Procedure for reference only.
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