2.3.3 Coating Removal, Peeling Method

This peeling removal method for coatings can be used only under special circumstances. It is commonly used to remove RTV silicone or other thick, rubbery-like coating materials. The coating material is removed using a dull knife or other dull blade to slit it and peel it off the printed board or printed board assembly. The coating must first be identified to determine the appropriate coating removal procedure. Refer to procedure number 2.3.1. 

Note: This method is limited to rubbery coatings, as it allows the coating material to be slit into small sections and peeled off the printed board assembly.

Minimum Skill Level - Advanced Recommended for technicians with soldering and component rework skills and exposure to most repair/rework procedures, but lacking extensive experience. Conformance Level - High This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References IPC-A-600 2.0 Externally Observable Characteristics IPC-A-610 10.0 Laminate Conditions

Procedure References 1.0 Foreword 2.1 Handling Electronic Assemblies 2.2 Cleaning 2.3.1 Coating Removal, Identification Of Coatings 2.4.1 Coating Replacement, Solder Mask 2.4.2 Coating Replacement, Conformal Coatings/Encapsulants IPC 7721 3.3 Coating Removal, Peeling Method

Tools, Materials and Supplies Knife with #16 Blades A must-have tool for precise cutting, scraping and trimming. Mixing Picks Disposable mixing sticks for mixing and applying adhesives. Precision Tool Set Nine precision-crafted tools for detailed circuit board work. Scraper, Curved Tip Hardened stainless steel tip for scraping solder mask and removing defects. Thermal Parting Tool Thermal removal tool using controlled heat through specially shaped tips.