|
Outline
The guides in this section outline procedures for component lead tinning and conditioning, focusing on replacing finishes to meet performance and reliability requirements. It begins with an introduction to key considerations, followed by details of robotic tinning processes for various component types, including chip/discrete, radial lead, axial lead, J-lead, and gull wing packages such as QFP and PLCC. Methods also cover leadless components like QFN and DFN, as well as through-hole connectors. Each procedure specifies preparation, tinning parameters, and quality criteria to ensure consistent solderability, corrosion resistance, and compliance with industry standards, supporting both manufacturing and high-reliability refurbishment applications. |
|||
The guide covers the basic requirements for replacing the finish on various types of electronic component leads.
This procedure covers robotic tinning of chip and discrete components.
This procedure covers robotic tinning of radial lead components.
This procedure covers robotic tinning of axial lead components.
This procedure covers robotic tinning of J-Lead components.
This procedure covers robotic tinning of gull wing components, including QFP and PLCC components.
This procedure covers robotic tinning of leadless components, including QFN and DFN components.
This procedure covers robotic tinning of through-hole connectors.
|
11.0 Component Lead, Pin, Pad, and Termination Conditioning and Tinning
List of procedures covering tinning for various component types.
Minimum Skill Level: N/A
Conformance Level: N/A
REQUEST FOR QUOTE GUIDES INDEX
