10.0 Component Reclaim Procedures

The guides in this section focus on procedures for reclaiming electronic components for reuse, prioritizing component preservation over circuit board integrity. These include updated conformance level definitions based on original specifications, technician skill, equipment capabilities, and industry experience. The guides cover hot air rework systems, nozzle selection, preheaters, and the operation of solder fountain systems. The guides also cover component removal tools, manual desoldering equipment, and best practices for aligning, heating, and extracting components. These procedures aim to maximize the quality of reclaimed components while maintaining process efficiency and aligning with industry standards for high-reliability applications.

10.1 Introduction To Component Reclaim

The guide covers the basic requirements for reclaiming components for reuse.

10.2 Component Reclaim, Chip/Discrete Components

This procedure outlines the process for reclaiming chip components for reuse.

10.3 Component Reclaim, Radial Lead Components Components

The guide covers the basic requirements for reclaiming electronic components for reuse.

10.4 Component Reclaim, Axial Lead Components

The guide covers the basic requirements for reclaiming axial lead components for reuse.

10.5 Component Reclaim, J-Lead Components

This procedure outlines the process for reclaiming J-Lead components for reuse.

10.6 Component Reclaim, Gull Wing Components

This procedure outlines the process for reclaiming gull wing components for reuse.

10.7 Component Reclaim, Leadless Components

This procedure outlines the process for reclaiming leadless components for reuse.

10.8 Component Reclaim, Connectors and Pin Grid Arrays

This procedure outlines the process for reclaiming through-hole components for reuse.

10.9 Component Reclaim, BGA/CSP Components

This procedure outlines the process for reclaiming BGA components for reuse.