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Outline
The guides in this section focus on procedures for reclaiming electronic components for reuse, prioritizing component preservation over circuit board integrity. These include updated conformance level definitions based on original specifications, technician skill, equipment capabilities, and industry experience. The guides cover hot air rework systems, nozzle selection, preheaters, and the operation of solder fountain systems. The guides also cover component removal tools, manual desoldering equipment, and best practices for aligning, heating, and extracting components. These procedures aim to maximize the quality of reclaimed components while maintaining process efficiency and aligning with industry standards for high-reliability applications. |
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The guide covers the basic requirements for reclaiming components for reuse.
This procedure outlines the process for reclaiming chip components for reuse.
The guide covers the basic requirements for reclaiming electronic components for reuse.
The guide covers the basic requirements for reclaiming axial lead components for reuse.
This procedure outlines the process for reclaiming J-Lead components for reuse.
This procedure outlines the process for reclaiming gull wing components for reuse.
This procedure outlines the process for reclaiming leadless components for reuse.
This procedure outlines the process for reclaiming through-hole components for reuse.
This procedure outlines the process for reclaiming BGA components for reuse.
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10.0 Component Reclaim Procedures
List of procedures covering reclaiming for various component types.
Minimum Skill Level: N/A
Conformance Level: N/A
REQUEST FOR QUOTE GUIDES INDEX
