10.0 Component Tinning Procedures
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10.0 Component Tinning Procedures
List of procedures covering tinning for various component types.
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10.1.1 Component Tinning Basics
The guides covers the basic requirements for replacing the finish on various types of electronic component leads.
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10.2.1 Tinning, Chip/Discrete Components, Manual
This procedure covers manual tinning of chip and discrete components.
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10.2.2 Tinning, Chip/Discrete Components, Robotic
This procedure covers robotic tinning of tinning of chip and discrete components.
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10.3.1 Tinning, Radial Lead Components, Manual
This procedure covers manual tinning of radial lead components.
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10.3.2 Tinning, Radial Lead Components, Robotic
This procedure covers robotic tinning of radial lead components.
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10.4.1 Tinning, Axial Lead Components, Manual
This procedure covers manual tinning of axial lead components.
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10.4.2 Tinning, Axial Lead Components, Robotic
This procedure covers robotic tinning of axial lead components.
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10.5.1 Tinning, TSOP/SOIC Components, Manual
This procedure covers manual tinning of TSOP, TSSOP, SSOP and SOIC components.
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10.5.2 Tinning, TSOP/SOIC Components, Robotic
This procedure covers robotic tinning of TSOP, TSSOP, SSOP and SOIC components.
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10.6.1 Tinning, QFP/PLCC Components, Manual
This procedure covers manual tinning of QFP and PLCC components.
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10.6.2 Tinning, QFP/PLCC Components, Robotic
This procedure covers robotic tinning of QFP and PLCC components.
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10.7.1 Tinning, QFN/DFN Components, Manual
This procedure covers manual tinning of QFN and DFN components.
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10.7.2 Tinning, QFN/DFN Components, Robotic
This procedure covers robotic tinning of QFN and DFN components.
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10.8.1 Tinning, Connectors, Through-Hole, Manual
This procedure covers manual tinning of through-hole connectors.
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10.8.2 Tinning, Connectors, Through-Hole, Robotic
This procedure covers robotic tinning of through-hole connectors.
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Procedure for reference only.
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