Outline
This procedure covers the reballing of BGA components.
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Images and Figures![]()
BGA component prior to reballing.
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Figure 1. Remove existing solder spheres on BGA components using desolder braid.
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Figure 2. Apply tacky flux to flat BGA component pads using a brush.
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Figure 3. Place the BGA component(s) into a fixture and cover with the appropriate stencil.
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Figure 4. Reflow oven used for controlled reflow of solder balls.
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Procedure
Procedure - Braid Ball Removal
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