Circuit Technology Center delivers precision trimming and forming services to prepare electronic components for assembly. Whether working from customer drawings or developing detailed lead-form specifications in-house, we ensure every part is processed to exacting standards. Our capabilities encompass both low- and high-volume requirements for most types of surface-mount, axial, and radial lead components. With calibrated optical comparators verifying dimensional accuracy, we guarantee consistent results. Moisture-sensitive devices are handled with MSL bake-out and dry-packing, while post-processing with robotic hot solder dip (RHSD) ensures optimal solderability and reliable performance in demanding applications.
Key Highlights
- Precision trimming and forming tailored to customer specifications
- Custom trim and lead-form drawings developed when none are available
- Dedicated tooling fabricated for unique requirements
- Calibrated optical comparator verification for accuracy
- Support for both low- and high-volume processing
- Moisture-sensitive device handling with MSL bake-out and dry-pack
- Integration with RHSD tinning for oxidation prevention and solderability
- Trusted partner with decades of component preparation expertise
Technical Specifications
- Trimming and forming for SMT flat-packs, axial, and radial components
- Custom tooling for specialized lead-form requirements
- Dimensional accuracy verified with optical comparator
- JEDEC tray, tape-and-reel, waffle pack, and custom tray packaging
- MSL bake-out and dry-packing per J-STD-020 and J-STD-033
- RHSD process for lead tinning, oxidation removal, and gold plating removal
- Compliance with industry standards for solderability and reliability
Compliance / References
- 6.5 Component Trim and Form
- IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
- IPC-A-610 Acceptability of Electronic Assemblies
- IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
- IPC-JEDEC-J-STD-033 Handling, Packing, Shipping, and Use of Moisture, Reflow, and Process Sensitive Devices
- JESD22-B101 External Visual Standard
- JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
- MIL-STD-883 Test Method Standard for Microcircuits
- MIL-STD-1835 Electronic Component Case Outlines
- MIL-STD-2000 Standard Requirements for Soldered Electrical and Electronic Assemblies
- MIL-STD-38510 General Specification For Microcircuits
- NASA-STD-FB-51-3414 Standard for Models and Simulations
- NASA-STD-8739.2 Workmanship Standards for Surface Mount Technology
