7.4.1 Soldering Surface Mount J Lead Components, Point To Point Method

Outline

This procedure covers the general guidelines for soldering surface mount J lead components. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

Minimum Skill Level - Intermediate
Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Acceptability References
IPC-A-610 12.0	Surface Mount Assemblies


Procedure References
1.0	Foreword
2.1	Handling Electronic Assemblies
2.2	Cleaning
2.5	Baking And Preheating
7.1.1	Soldering Basics
7.1.2	Preparation For Soldering And Component Removal
7.1.3	Solder Joint Acceptability Criteria
IPC7711 5.6.2	Point-To-Point-Method

Procedure

Procedure

Add liquid flux to the corner pads.
Place the component in position and hold it steady. The leads must be aligned with the pads. On large components this is best done by aligning the leads on opposite corners. (See Figure 1)
Place the soldering iron tip at the junction between the pad and component lead at one of the corners. Apply additional solder as needed. (See Figure 2)
Remove the tip. Wait a moment for the solder to solidify before soldering the opposite corner.
After the opposite corner is soldered, solder the remaining leads.
Clean, if required, and inspect.

Images and Figures

Soldering Surface Mount J Lead Components, Point To Point Method

Figure 1. Place component and check alignment.

Figure 2. Place the soldering iron tip at the junction between the pad and component lead.

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7.4.1 Soldering Surface Mount J Lead Components, Point To Point Method

Procedure covers soldering of surface mount J lead components on circuit board assemblies using a point to point soldering method. Minimum Skill Level: Intermediate Conformance Level: High

Procedure covers soldering of surface mount J lead components on circuit board assemblies using a point to point soldering method.

Minimum Skill Level: Intermediate
Conformance Level: High