9.0 BGA Component Rework and Reballing Procedures
|
|
|
|
|
9.0 BGA Component Rework Procedures
List of procedures covering BGA component rework on assembled circuit boards.
|
9.1.1 BGA Component Rework Process Flow
The procedure covers BGA component rework process flow instructions.
|
9.1.2 BGA Component Rework Inspection
The procedure covers BGA component rework inspection instructions.
|
9.1.3 BGA Component Reball Inspection
The procedure outlines the inspection method and pass/fail criteria for inspection of BGA component deballing and reballing.
|
9.2.1 BGA Component Rework Profile Development, Standard Method
The procedure covers steps involved in BGA component rework on assembled circuit boards.
|
9.2.2 BGA Component Rework Profile Development, Smart Track Method
The procedure covers steps involved in BGA component rework on assembled circuit boards.
|
9.3.1 BGA Component Rework
The procedure covers steps involved in BGA component rework on assembled circuit boards.
|
9.4.1 BGA Component Reballing, Fixture Method
The procedure covers BGA component reballing.
|
9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
The procedure covers BGA component reballing.
|
9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
The procedure covers BGA component reballing.
|
9.4.4 BGA Component Reballing, Robotic Ball Removal Reflow, Reflow Oven Attachment Method
The procedure covers BGA component reballing.
|
9.5.1 BGA Component Removal, Machining Method
The procedure covers the process of removing a BGA component that was installed using a non-reworkable underfill.
|
|
|
Procedure for reference only.
|
|
