9.0 BGA Component Rework and Reballing Procedures
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9.0 BGA Component Rework Procedures
List of procedures covering BGA component rework on assembled circuit boards.
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9.1.1 BGA Component Rework Process Flow
The procedure covers BGA component rework process flow instructions.
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9.1.2 BGA Component Rework Inspection
The procedure covers BGA component rework inspection instructions.
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9.1.3 BGA Component Reball Inspection
The procedure outlines the inspection method and pass/fail criteria for inspection of BGA component deballing and reballing.
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9.2.1 BGA Component Rework Profile Development, Standard Method
The procedure covers steps involved in BGA component rework on assembled circuit boards.
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9.2.2 BGA Component Rework Profile Development, Smart Track Method
The procedure covers steps involved in BGA component rework on assembled circuit boards.
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9.3.1 BGA Component Rework
The procedure covers steps involved in BGA component rework on assembled circuit boards.
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9.4.1 BGA Component Reballing, Fixture Method
The procedure covers BGA component reballing.
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9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
The procedure covers BGA component reballing.
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9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
The procedure covers BGA component reballing.
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9.4.4 BGA Component Reballing, Robotic Ball Removal Reflow, Reflow Oven Attachment Method
The procedure covers BGA component reballing.
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9.5.1 BGA Component Removal, Machining Method
The procedure covers the process of removing a BGA component that was installed using a non-reworkable underfill.
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Procedure for reference only.
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