7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method

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Outline

This procedure covers the general guidelines for soldering surface mount J lead components. There is basically only one style of J lead component. Whether leads are on two sides or four sides, or whether the component is large or small, the soldering principles are the same.

Minimum Skill Level - Intermediate

Recommended for technicians with skills in basic soldering and component rework, but may be inexperienced in general repair/rework procedures.

Conformance Level - High

This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

Procedure References
1-0	1.0 Foreword
2-1	2.1 Handling Electronic Assemblies
2-2	2.2 Cleaning Procedures
2-5	2.5 Baking and Preheating
7-1-1	7.1.1 Soldering Basics
7-1-2	7.1.2 Preparation For Soldering And Component Removal
7-1-3	7.1.3 Solder Joint Acceptance Criteria

Tools and Materials

Cleaner
General purpose cleaner for removing contamination.

Flex-Rack PCB Holder
Sturdy rack for PCBs used for rework and positioning.

Microscope
Precision microscope with stand and lighting for work and inspection.

Precision Tool Set
Nine precision-crafted tools for detailed circuit board work.

Soldering Iron
Properly maintained soldering iron and properly sized soldering iron tips.

Soldering Skills Practice Kit
Training kit to practice circuit board soldering skills prior to testing for certification.

Wipes
Nonabrasive, low-linting wipes for cleanup.

Procedure

Add liquid flux to the corner pads.
Place the component in position and hold it steady. The leads must be aligned with the pads. On large components, this is best done by aligning the leads on opposite corners. (See Figure 1)
Place the soldering iron tip at the junction between the pad and component lead at one of the corners. Apply additional solder as needed.
Remove the tip. Wait a moment for the solder to solidify before soldering the opposite corner.
Apply solder to the continuous flow solder tip to create a convex bead of molten solder on the tip. (See Figure 2)
Position the solder tip so that the solder bead contacts the vertical portion of the J leads. Slowly move the tip over the row of leads to form proper solder fillets at each joint. (See Figure 3)
Repeat steps 5 and 6 for the remaining sides.
Clean, if required, and inspect.

Images

Soldering Surface Mount J Lead Components, Continuous Flow Method

Place component and check alignment.

Apply solder to the continuous flow solder tip to create a convex bead of molten solder.

Slowly move the tip over the row of leads to form proper solder fillets at each joint.