Removing BGA components with underfill requires precision to overcome the mechanical bond without damaging the circuit board. Using specialized CNC milling systems, Circuit Technology Center ensures clean, controlled, damage-free removal.
Our BGA reballing service restores components with precision and full IPC/JEDEC compliance. Using advanced Air-Vac systems, custom fixtures, and rigorous inspection, we deliver high-reliability rework for critical electronic assemblies.
Trusted worldwide, we deliver expert BGA rework and repair services - from component removal to BGA pad repair and x-ray inspection - using IPC-approved methods and advanced equipment for unmatched precision and quality.
Standard jumper wires won't fit under BGAs - but our flat copper ribbon solution will. This IPC-recommended procedure, pioneered here, delivers precise, low-profile BGA site modifications trusted by engineers worldwide.
Circuit Technology Center delivers precise, IPC-compliant ECO services, including BGA rework, jumper wire installation, and micron-level trace isolation. With 40+ years of expertise, our team ensures reliable engineering changes on complex PCB assemblies.
Advanced circuit board rework and component salvage demand precision. With 100+ specialized systems, Circuit Technology Center restores surface-mount and through-hole assemblies to IPC-compliant standards, ensuring structural and electrical integrity.
Circuit Technology Center restores damaged gold edge contacts using IPC-compliant brush plating with high-purity gold. Our controlled process ensures proper thickness, adhesion, and durability—returning contacts to like-new condition for reliable performance.
Circuit Technology Center partners with Keysight to deliver a turn-key BGA testing solution for direct DIMM validation. Using W2630A DDR2 probes, we ensure high-fidelity signal capture, precise installation, and reliable memory validation in development and production.
Circuit Technology Center offers fast, EIA-481-compliant tape and reel services for SMT, through-hole, and custom components. Includes MSL dry bake and moisture barrier packaging per J-STD-033 and J-STD-020 standards.
Circuit Technology Center delivers precision component tinning using programmable Robotic Hot Solder Dip systems for controlled, repeatable finish replacement. Our processes mitigate tin whiskers, remove gold plating, and meet GEIA-STD-0006 and J-STD-001 for reliable, industry-compliant results.
Circuit Technology Center provides precision trimming and forming for SMT, axial, and radial components, ensuring dimensional accuracy and solderability. Services integrate optical verification, MSL control, and robotic hot solder dip for reliable component trim and form performance.
Circuit Technology Center delivers precision X-ray inspection for BGA rework using the Dage Quadra 7 system. Sub-micron imaging reveals hidden solder defects, misalignment, and reflow issues, ensuring reliable performance for aerospace, defense, and advanced electronics.
