Removal and replacement of surface mount and through-hole components are one of the most common rework processes performed on assembled circuit boards. Although commonplace and sometimes routine, today's component packages and board features present an array of difficult component rework challenges.
We have over 100 pieces of equipment from Pace, Metcal and OK Industries, Air-Vac, and Electrovert to meet most any surface mount, BGA, and through-hole component rework need. Our trained and qualified technicians are ready to tackle your toughest rework projects.
Quad Flat Pack (QFP) removal by hot gas rework system.
Surface Mount Component Rework
We use a mix of convection and conduction techniques for surface mount component removal. Many factors are considered, but conduction methods are normally used to remove smaller components.
Convection techniques are commonly used to remove larger, more sensitive components. Point-to-point soldering methods are normally used to replace surface mount components.
Through Hole Component Rework
We use vacuum desoldering systems for small through-hole removal projects. We call upon our Electrovert Solder Fountain Systems for demanding multi-lead rework projects. These systems take great skill and experience to operate, but for high pin count through hole component rework, these workhorses can't be beaten for reliability and efficiency.
We can salvage most components for reuse.