Circuit Board Rework and Repair Guides

Foreword to the circuit board repair and rework guides outlining scope, intent and industry alignment. Introduces standardized procedures designed to support reliable electronic assembly restoration.

1.2 Tools and Materials

Essential tools and equipment used in circuit board repair and rework. Covers soldering systems, precision tooling and inspection equipment required for controlled, professional results.

2.0 Basic Procedures

Overview of basic circuit board repair procedures including handling, cleaning, coating removal and material preparation. Establishes foundational practices for safe, controlled rework operations.

2.1 Handling Electronic Assemblies

Properly handle circuit board assemblies to minimize ESD/EOS damage. Learn grounding, static-safe work areas, board/component edge handling, storage and contamination avoidance for reliable electronic assembly care.

2.2 Cleaning Procedures

Learn essential cleaning procedures for circuit boards and assemblies, covering both localized and aqueous batch methods to remove flux and contaminants that can impair soldering, performance, and reliability.

2.2.1 Cleaning, Local

Guide to localized cleaning of circuit boards and assemblies using solvent and brush techniques to remove surface contaminants that affect soldering and electrical performance in repair/rework operations.

2.2.2 Cleaning, Aqueous Batch Process

Aqueous batch cleaning procedure for circuit board assemblies, detailing water-based cleaning cycles, pressures, and rinse considerations to remove flux and contaminants while protecting sensitive components.

2.3.1 Coating Removal, Identification of Coating

Identify conformal coatings before removal to prevent substrate damage. Learn how to distinguish acrylic, urethane, silicone, epoxy and parylene coatings using visual inspection, solvent testing and practical field methods.

2.3.2 Coating Removal, Solvent Method

Remove conformal coatings using controlled solvent techniques that protect circuitry and base materials. Covers material compatibility, dwell time, application methods and safe removal practices for repair and rework.

2.3.3 Coating Removal, Peeling Method

Peel removable conformal coatings without damaging conductors or laminate. Step-by-step guidance for edge lifting, controlled removal and surface preparation to support reliable rework operations.

2.3.4 Coating Removal, Thermal Method

Use controlled heat to soften and remove conformal coatings in targeted repair areas. Learn proper temperature control, tooling selection and risk mitigation to prevent substrate damage during rework.

2.3.5 Coating Removal, Grinding/Scraping Method

Mechanically remove conformal coatings using precision grinding or scraping techniques. Includes tool selection, depth control and surface protection methods to avoid damage to traces and laminate.

2.3.6 Coating Removal, Micro Blasting Method

Micro blasting removes conformal coatings in precise areas using controlled abrasive media. Learn equipment setup, masking techniques and surface protection methods for accurate coating removal.

2.4.1 Coating Replacement, Solder Mask

Restore solder mask to protect circuitry and maintain electrical isolation. Covers surface preparation, mask application, curing and inspection practices for durable, professional repair results.

2.4.2 Coating Replacement, Conformal Coating, Encapsulant

Reapply conformal coating or encapsulant to protect repaired assemblies from moisture, contamination and electrical stress. Learn material selection, masking and controlled application methods.

2.4.3 Coating Replacement, Solder Mask, BGA Locations

Restore solder mask in BGA locations while maintaining pad geometry and spacing. Detailed procedures ensure insulation integrity and reliable component reinstallation in high-density areas.

2.5 Baking and Preheating

Use controlled baking and preheating to remove moisture and stabilize circuit boards before soldering or rework. Learn temperature guidelines and handling practices that reduce delamination and damage.

2.6.1 Legend/Marking Repair, Stamping Method

Restore board legends and identification markings using precision stamping techniques. Covers ink selection, alignment and curing practices to maintain traceability and professional appearance.

2.6.2 Legend/Marking Repair, Hand Lettering Method

Repair missing or damaged board markings using controlled hand lettering techniques. Includes surface preparation, ink selection and curing methods for durable, compliant identification.

2.6.3 Legend/Marking Repair, Stencil Method

Recreate board legends using stencil methods for consistent, repeatable marking repair. Learn stencil alignment, ink application and curing practices to maintain documentation integrity.

2.7 Epoxy Mixing and Handling

Properly mix and handle epoxy materials used in circuit board repair. Covers ratio control, pot life management, contamination prevention and curing practices to ensure structural reliability.

3.0 Base Board Repair Procedures

Base board repair procedures for restoring damaged laminate and structural integrity in printed circuit boards. Covers evaluation, material removal, epoxy restoration and transplant techniques for reliable PCB repair.

3.1 Delamination/Blister Repair, Injection Method

Repair PCB delamination and blisters using controlled epoxy injection methods. Learn preparation, resin flow control and curing practices that restore laminate bonding and structural stability.

3.2 Bow and Twist Repair

Correct bow and twist conditions in printed circuit boards using controlled heat and mechanical stabilization. Includes measurement guidelines and flattening techniques to restore dimensional stability.

3.3.1 Hole Repair, Epoxy Method

Restore non-functional holes in circuit boards using epoxy fill techniques. Covers preparation, material selection and curing methods to rebuild structural integrity while maintaining board reliability.

3.3.2 Hole Repair, Transplant Method

Repair damaged or oversized holes using precision laminate transplant techniques. Learn controlled material removal, insert bonding and finishing practices for durable structural restoration.

3.4.1 Key and Slot Repair, Epoxy Method

Rebuild damaged keys and slots in circuit boards using structural epoxy methods. Includes surface preparation, material placement and finishing techniques to restore mechanical function and fit.

3.4.2 Key and Slot Repair, Transplant Method

Restore keys and slots using laminate transplant procedures for severe damage. Covers controlled material removal, insert fabrication and bonding to ensure mechanical strength and alignment.

3.5.1 Base Material Repair, Epoxy Method

Repair minor laminate damage using epoxy reconstruction methods. Learn surface preparation, material build-up and curing practices to restore board strength and surface integrity.

3.5.2 Base Material Repair, Area Transplant Method

Replace damaged laminate sections using area transplant techniques. Includes precision material removal, insert bonding and finishing steps to restore structural and dimensional integrity.

3.5.3 Base Material Repair, Edge Transplant Method

Restore damaged PCB edges using edge transplant procedures. Covers controlled removal, laminate replacement and finishing methods to maintain board strength and dimensional stability.

4.0 Conductor Repair Procedures

Comprehensive conductor repair procedures for restoring damaged PCB traces, lands and planes. Covers epoxy, film adhesive, jumper and wire methods aligned with industry-accepted rework practices.

4.1.1 Lifted Conductor Repair, Epoxy Method

Repair lifted or separated conductors using controlled epoxy bonding techniques. Learn surface preparation, alignment and curing practices to restore adhesion and electrical integrity.

4.1.2 Lifted Conductor Repair, Film Adhesive Method

Rebond lifted conductors using film adhesive methods for precise, uniform adhesion. Includes surface preparation, heat control and pressure application for reliable trace restoration.

4.2.1 Conductor Repair, Foil Jumper, Epoxy Method

Restore damaged PCB traces using foil jumper and epoxy techniques. Covers pattern matching, bonding and finishing steps to maintain conductor width and current capacity.

4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method

Repair open or damaged traces using precision foil jumpers bonded with film adhesive. Learn alignment, lamination and finishing methods for consistent conductor restoration.

4.2.3 Conductor Repair, Welding Method

Reconnect damaged conductors using micro welding techniques. Covers equipment control, alignment and inspection practices for permanent electrical restoration.

4.2.4 Conductor Repair, Surface Wire Method

Repair open circuits using surface wire techniques for reliable electrical continuity. Includes routing, attachment and strain relief practices to protect long-term performance.

4.2.5 Conductor Repair, Through Board Wire Method

Restore through-board connections using wire repair methods when plated vias are missing or damaged. Covers drilling, wire insertion and termination techniques for dependable conductivity.

4.2.6 Conductor Repair, Inner Layer Method

Repair damaged inner layer conductors using precision access and reconstruction techniques. Includes material removal, conductor replacement and laminate restoration practices.

4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method

Rebuild damaged surface planes using copper bonded with film adhesive. Learn controlled lamination and finishing techniques to maintain shielding and current capacity.

4.3.1 Circuit Cut, Surface Circuits

Perform controlled surface circuit cuts to isolate or modify PCB traces. Covers precision cutting techniques and inspection methods to prevent unintended damage.

4.3.2 Circuit Cut, Inner Layer Circuits

Isolate inner layer connections using controlled access and cutting techniques. Includes laminate entry, trace interruption and restoration procedures.

4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through Method

Remove unwanted inner layer connections at plated holes using precision drill-through methods. Covers alignment, depth control and inspection practices.

4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method

Delete inner layer connections at plated holes using spoke-cut techniques. Learn controlled cutting methods to isolate connections without damaging surrounding circuitry.

4.4.1 Lifted Land Repair, Epoxy Seal Method

Restore lifted lands using epoxy sealing techniques to secure and protect the pad. Includes preparation, bonding and curing methods to maintain solderability.

4.4.2 Lifted Land Repair, Film Adhesive Method

Repair lifted lands using film adhesive bonding for uniform adhesion and durability. Covers alignment, lamination and finishing steps for reliable pad restoration.

4.5.1 Land Repair, Epoxy Method

Reconstruct damaged or missing lands using epoxy and replacement copper patterns. Learn bonding and finishing techniques to restore solderable pad geometry.

4.5.2 Land Repair, Film Adhesive Method

Restore edge contacts using replacement patterns bonded with film adhesive. Learn alignment and finishing practices to maintain reliable edge connector performance.

4.6.1 Edge Contact Repair, Epoxy Method

Repair worn or damaged edge contacts using epoxy bonding and contact replacement techniques. Covers preparation and finishing to restore electrical interface integrity.

4.6.2 Edge Contact Repair, Film Adhesive Method

Procedure covers method to repair damaged edge contacts on circuit board assemblies using dry film adhesive.

4.6.3 Edge Contact Repair/Rework, Plating Method

Rework edge contacts using selective plating methods to rebuild contact surfaces. Covers preparation, masking and plating control for durable electrical performance.

4.7.1 Surface Mount Pad Repair, Epoxy Method

Repair damaged surface mount pads using epoxy-bonded replacement patterns. Includes pad alignment, bonding and finishing practices to restore solderable surfaces.

4.7.2 Surface Mount Pad Repair, Film Adhesive Method

Replace surface mount pads using film adhesive bonding for precise placement and durability. Covers lamination and trimming techniques for consistent results.

4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method

Restore damaged BGA pads using film adhesive bonding and precision replacement patterns. Learn alignment and finishing methods to maintain pad spacing and reliability.

4.7.4 Surface Mount, BGA Pad Repair with Integral Via

Repair BGA pads with integral vias using controlled reconstruction techniques. Covers via integrity, pad geometry and finishing practices for dependable repairs.

4.7.5 Surface Mount, BGA Pad Repair, Integral Via, Circuit Extension Method

Rebuild BGA pads with integral vias using circuit extension techniques. Includes via restoration, trace reconstruction and pad alignment for high-density assemblies.

4.7.6 Surface Mount Pad Repair, Film Adhesive Method, Butt Joint Method

Repair surface mount pads using film adhesive and butt joint techniques for precise conductor integration. Covers alignment and bonding for reliable electrical continuity.

5.0 Plated Hole Repair Procedures

Plated hole repair procedures for restoring electrical continuity and structural integrity in double-sided and multilayer PCBs. Covers eyelet, double wall and inner layer connection methods for reliable plated-hole reconstruction.

5.1 Plated Hole Repair, No Inner Layer Connection

Repair damaged plated through-holes with no inner layer connection using an eyelet. Learn drilling, preparation and eyelet forming methods to restore mechanical strength and solderability.

5.2 Plated Hole Repair, Double Wall Method

Restore plated through-holes using the double wall method for enhanced durability. Covers controlled drilling, eyelet sleeve installation and flaring techniques to ensure strong electrical continuity.

5.3 Plated Hole Repair, Inner Layer Connection

Repair plated through-holes with inner layer connections using precision reconstruction methods. Includes layer access, conductor restoration and eyelet installation to maintain multilayer integrity.

6.0 Jumper Wire and Component Modification Procedures

Jumper wire and component modification procedures for implementing design changes and engineering changes. Covers routing, attachment and documentation practices to maintain electrical integrity and reliability.

6.1 Jumper Wires

Guidelines for selecting, attaching and routing jumper wires on printed circuit boards. Includes strain relief, insulation, soldering and inspection practices to ensure dependable electrical connections.

6.2.1 Jumper Wires, BGA Components, Circuit Track Method

Install jumper wires at BGA locations using circuit track methods for precise signal routing. Covers pad access, trace attachment and protection techniques for high-density assemblies.

6.2.2 Jumper Wires, BGA Components, Through Board Method

Route jumper wires at BGA sites using through-board techniques to restore connectivity. Includes drilling, wire insertion and termination methods for secure, reliable repairs.

6.3 Component Modifications and Additions

Implement component modifications and additions to support engineering changes. Covers secure attachment, routing and inspection practices to maintain performance and documentation integrity.

6.4 Component Lead Cutting and Lifting

Perform controlled component lead cutting and lifting to isolate or modify circuits. Includes tool selection and handling practices to prevent pad or conductor damage.

6.5 Component Trim and Form

Trim and form component leads to meet mechanical and electrical requirements. Covers lead shaping, length control and stress reduction techniques to ensure proper fit and long-term reliability.

7.0 Soldering Procedures

Comprehensive soldering procedures for through-hole and surface mount components. Covers preparation, process control and inspection practices to ensure reliable solder joints in rework and repair operations.

7.1.1 Soldering Basics

Fundamentals of soldering for printed circuit boards, including heat control, flux use and wetting principles. Learn core techniques that support strong, reliable solder joint formation.

7.1.2 Preparation For Soldering And Component Removal

Prepare circuit boards for soldering or component removal using proper cleaning, preheating and protection techniques. Covers risk mitigation to prevent pad lifting and laminate damage.

7.1.3 Solder Joint Acceptance Criteria

Understand solder joint acceptance criteria based on industry-recognized standards. Learn visual indicators of proper wetting, fillet formation and defect identification for quality assurance.

7.2.1 Soldering Through Hole Components, Point To Point Method

Solder through-hole components using the point-to-point method for precise heat application. Covers lead preparation, solder flow and inspection practices for dependable connections.

7.2.2 Soldering Through Hole Components, Solder Fountain Method

Use the solder fountain method to efficiently solder through-hole components. Includes equipment setup, temperature control and process monitoring for consistent results.

7.3.1 Soldering Surface Mount Chip Components, Point To Point Method

Install surface mount chip components using controlled point-to-point soldering techniques. Covers pad preparation, alignment and heat management for reliable attachment.

7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method Method

Solder surface mount chip components using hot gas reflow methods. Learn temperature profiling, airflow control and component alignment for consistent solder joint formation.

7.4.1 Soldering Surface Mount J Lead Components, Point To Point Method

Solder J-lead surface mount components using precise point-to-point techniques. Includes lead alignment, heat control and inspection practices to ensure durable connections.

7.4.2 Soldering Surface Mount J Lead Components, Continuous Flow Method

Install J-lead components using the continuous flow soldering method. Covers controlled solder application and thermal management for uniform fillet formation.

7.4.3 Soldering Surface Mount J Lead Components, Hot Gas Method

Solder J-lead components using hot gas reflow techniques. Includes airflow control, temperature management and alignment practices for reliable surface mount attachment.

7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method

Solder gull wing surface mount components using point-to-point techniques. Covers lead wetting, alignment and inspection methods for strong, compliant solder joints.

7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method

Install gull wing components using continuous flow soldering methods. Learn process control techniques that promote consistent solder fillets and electrical integrity.

7.5.3 Soldering Surface Mount Gull Wing Components, Hot Gas Method

Solder gull wing components using hot gas reflow methods. Covers temperature profiling, airflow management and inspection practices for high-quality surface mount results.

8.0 Rework Procedures

Comprehensive rework procedures for safe component removal and replacement on printed circuit boards. Covers controlled heating methods, tooling selection and inspection practices to protect pads, traces and laminate.

8.1.1 Component Removal, Through Hole Components, Vacuum Method

Remove through-hole components using vacuum desoldering methods. Includes heat control, solder extraction and clearing techniques to prevent plated hole damage.

8.1.2 Component Removal, Through Hole Components, Solder Fountain Method

Use the solder fountain method to efficiently remove through-hole components. Covers equipment setup, dwell time control and handling practices to protect multilayer connections.

8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method

Remove surface mount chip components using forked tip soldering tools. Learn balanced heating and lifting techniques to avoid pad lifting or laminate damage.

8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method

Extract surface mount chip components using hot tweezer methods for controlled, simultaneous lead heating. Covers alignment and timing to protect surrounding circuitry.

8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method

Remove J-lead components using conduction heating techniques. Includes controlled heat transfer and lifting practices to preserve pad integrity and board reliability.

8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas Method

Use hot gas reflow methods to remove J-lead surface mount components. Covers airflow control and temperature management for safe, repeatable removal.

8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method

Remove gull wing surface mount components using conduction heating methods. Includes tip selection and heat balancing techniques to minimize pad damage.

8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas Method

Extract gull wing components using hot gas reflow techniques. Learn temperature profiling and airflow control to ensure safe removal without compromising adjacent parts.

9.0 BGA Component Rework and Reballing Procedures

Comprehensive BGA rework and reballing procedures for high-density assemblies. Covers profile development, removal, inspection and solder ball replacement techniques for reliable restoration.

9.1.1 BGA Component Rework Process Flow

Step-by-step BGA rework process flow outlining removal, site preparation, inspection, reinstallation and verification. Designed to ensure controlled, repeatable results in critical applications.

9.1.2 BGA Component Rework Inspection

Inspection guidelines for BGA rework including site condition, pad integrity and alignment verification. Covers visual, X-ray and process checks to confirm quality restoration.

9.1.3 BGA Component Reball Inspection

BGA reball inspection procedures to verify solder sphere alignment, size consistency and attachment integrity. Includes visual and measurement checks to ensure readiness for reinstallation.

9.2.1 BGA Component Rework Profile Development, Standard Method

Develop thermal profiles for BGA rework using standard thermocouple placement and ramp control methods. Covers preheat, soak and reflow parameters for safe component removal and attachment.

9.2.2 BGA Component Rework Profile Development, Smart Track Method

Create optimized BGA rework profiles using Smart Track techniques for improved thermal accuracy. Includes real-time temperature tracking and process refinement for repeatable results.

9.3.1 BGA Component Rework

Perform controlled BGA component rework including removal, site redress and reattachment. Covers alignment, flux application and thermal control for reliable solder joint formation.

9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method

Reball BGA components using solder braid for ball removal and mini-oven attachment. Covers site preparation, sphere placement and controlled reflow for consistent results.

9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method

Restore BGA solder spheres using braid removal and reflow oven attachment methods. Includes stencil alignment and thermal control for uniform ball formation.

9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method

Reball BGAs using robotic ball removal and mini-oven attachment techniques. Covers automated sphere removal and controlled reflow for precision restoration.

9.4.4 BGA Component Reballing, Robotic Ball Removal Reflow, Reflow Oven Attachment Method

Advanced BGA reballing using robotic ball removal and reflow oven attachment. Designed for high-repeatability solder sphere replacement in demanding assemblies.

9.5.1 BGA Component Removal, Machining Method

Remove BGA components using precision machining techniques when thermal methods are unsuitable. Covers controlled material removal to protect underlying circuitry.

10.0 Component Reclaim Procedures

Component reclaim procedures for safely removing, reconditioning and preparing electronic parts for reuse. Covers cleaning, lead refinishing and inspection practices to support reliability and traceability.

10.1 Introduction To Component Reclaim

Introduction to component reclaim outlining benefits, risk considerations and process controls. Learn how proper removal, evaluation and refinishing extend component lifecycle.

10.2 Component Reclaim, Chip/Discrete Components

Reclaim chip and discrete components using controlled removal and lead refinishing techniques. Includes cleaning, solder removal and inspection practices to ensure readiness for reuse.

10.3 Component Reclaim, Radial Lead Components Components

Reclaim radial lead components through careful desoldering and lead restoration. Covers solder removal, straightening and inspection to maintain mechanical and electrical integrity.

10.4 Component Reclaim, Axial Lead Components

Recover axial lead components using controlled removal and lead conditioning methods. Includes cleaning, trimming and forming practices to prepare parts for reliable reinstallation.

10.5 Component Reclaim, J-Lead Components

Reclaim J-lead components using precision removal and lead refinishing techniques. Covers solder removal, reshaping and inspection to preserve solderability and alignment.

10.6 Component Reclaim, Gull Wing Components

Restore gull wing components through careful desoldering and lead reconditioning. Includes cleaning, straightening and inspection steps to ensure consistent reattachment performance.

10.7 Component Reclaim, Leadless Components

Reclaim leadless components using controlled removal and termination refinishing methods. Covers pad cleaning and solder surface preparation for reliable reuse.

10.8 Component Reclaim, Connectors and Pin Grid Arrays

Reclaim connectors and pin grid arrays using precision removal and pin restoration techniques. Includes straightening, cleaning and inspection practices to maintain functionality.

10.9 Component Reclaim, BGA/CSP Components

Reclaim BGA and CSP components through controlled removal, reballing and inspection. Covers solder sphere restoration and evaluation methods to support high-value component reuse.

11.0 Component Lead, Pin, Pad, and Termination Conditioning and Tinning

Component lead, pin, pad and termination conditioning procedures for restoring solderability. Covers cleaning, oxide removal and controlled tinning methods to prepare reclaimed parts for reliable assembly.

11.1 Introduction to Component Lead, Pin, Pad, and Termination Conditioning and Tinning

Overview of conditioning and tinning processes used to restore component terminations. Learn key preparation, inspection and process control practices that ensure consistent solderability.

11.2 Component Termination Conditioning and Tinning, Chip/Discrete Components

Condition and tin chip and discrete component terminations using controlled solder application methods. Includes oxide removal and inspection steps to verify proper wetting and coverage.

11.3 Component Lead Conditioning and Tinning, Radial Lead Components

Restore solderability of radial leads through cleaning and precision tinning techniques. Covers lead preparation, solder application and inspection for consistent coating thickness.

11.4 Component Lead Conditioning and Tinning, Axial Lead Components

Condition and tin axial leads using controlled solder processes to remove oxidation and contamination. Includes straightening, fluxing and inspection practices for dependable reuse.

11.5 Component Lead Conditioning and Tinning, J-Lead Components

Recondition and tin J-leads using precise solder application methods. Covers solder removal, oxide treatment and coating control to maintain geometry and solderability.

11.6 Component Lead Conditioning and Tinning, Gull Wing Components

Restore gull wing leads through cleaning and uniform tinning processes. Learn techniques that preserve lead shape while ensuring proper solder coverage.

11.7 Component Pad Conditioning and Tinning, Leadless Components

Condition and tin leadless component pads using controlled solder techniques. Covers surface preparation and inspection to verify uniform solderability for reliable attachment.

11.8 Component Pin Conditioning and Tinning, Connectors, Through-Hole

Recondition and tin connector pins and through-hole terminations using controlled solder processes. Includes cleaning, straightening and inspection for dependable mechanical and electrical performance.

12.0 Reclaimed Component Marking and Traceability

Marking and traceability procedures for reclaimed electronic components. Covers identification methods, documentation practices and record controls to ensure accountability, compliance and lifecycle tracking.

12.1 Reclaimed Component Marking

Guidelines for marking reclaimed components to clearly identify prior use and processing. Includes durable marking methods that maintain part integrity while supporting traceability requirements.

12.2 Reclaimed Component Traceability

Establish traceability for reclaimed components through documented source, processing and inspection records. Covers labeling, record retention and process linkage to ensure full lifecycle accountability.

Circuit Board Rework and Repair, Component Tinning, and Reballing

The information within these guides should be helpful to anyone who works with bare circuit boards and circuit board assemblies. These guides are packed with illustrations and videos and follow popular IPC standards.