Salvaging hard-to-source or obsolete electronic components demands precision, expertise, and advanced technology. At Circuit Technology Center, we bring over 40 years of experience to the safe removal and reclamation of valuable components from assembled circuit boards. Our facility features fully programmable hot-gas rework systems, robotic solder-dip technology, and advanced inspection processes to ensure quality at every stage of production. Whether handling high-volume salvage projects or urgent low-volume requirements, our team provides scalable solutions that preserve component integrity and comply with the industry's most rigorous standards.
Key Highlights
- Over 40 years of component salvage and reclamation expertise
- Trusted across aerospace, defense, and electronics manufacturing sectors
- Seven fully programmable Air-Vac hot gas rework systems
- Scalable services for high- and low-volume projects
- Six Robotic Hot Solder Dip (RHSD) systems for refinishing leads
- Rigorous moisture control with MSL bake-out ovens
- Comprehensive packaging per J-STD-033 and EIA-481E
- Proven, standards-compliant processes from start to finish
Technical Specifications
- Salvage of fine-pitch QFPs, BGAs, LGAs, and high-pin-count connectors
- Precision removal using hot gas rework systems
- BGA cleaning and reballing (tin-lead or RoHS lead-free)
- RHSD technology for surface-mount and through-hole components
- Vacuum desoldering for small through-hole devices
- Solder fountain systems for multi-lead through-hole components
- Pre-bake moisture control per J-STD-020
- Vacuum-sealed ESD packaging with desiccant and MSL cards
- Re-tape and reel services per EIA-481E
Compliance / References
- 10.0 Component Reclaim Procedures
- 10.1 Introduction to Component Reclaim
- 10.5 Component Reclaim, J-Lead Components
- 10.6 Component Reclaim, Gull Wing Components
- 10.9 Component Reclaim, BGA/CSP Components
- IPC-7711/7721 Rework, Modification, and Repair of Electronic Assemblies
- IPC-A-610 Acceptability of Electronic Assemblies
- IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
- IPC-J-STD-004 Requirement for Soldering Fluxes
- IPC-J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
- IPC-JEDEC-J-STD-002 Solderability Tests for Component Leads, terminations, Lugs, Terminals and Wires
- IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
- IPC-JEDEC-J-STD-033 Handling, Packing, Shipping, and Use of Moisture, Reflow, and Process Sensitive Devices
- IEC TS 62647-4 Process management for avionics – Aerospace and defense electronic systems containing lead-free solder
- GEIA-STD-0006 Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
- JESD22-B101 External Visual Standard
- JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
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