BGA Component Reballing

Our BGA Reballing service offers fast and precise rework for Ball Grid Array (BGA) components that require solder ball replacement. Whether converting from lead-free to leaded solder or ensuring consistent performance, we follow proven processes that strictly comply with IPC and JEDEC standards. With advanced Air-Vac systems and expert technicians, we deliver high-reliability results for even the most demanding projects. From inspection to final verification, we ensure every component meets rigorous quality requirements, making us a trusted partner for industries that cannot compromise on reliability.

Key Highlights

• Strict adherence to IPC and JEDEC standards
• Proven, repeatable processes trusted worldwide
• Advanced Air-Vac BGA rework systems
• Multi-zone reflow ovens to meet industry specifications   
• Precision custom tooling used, not adjustable, inaccurate tooling
• Comprehensive verification, including shear testing, XRF alloy checks, visual, and X-ray inspection
• Expertise across BGA, LGA, and QFN devices
• Skilled engineering and operator team ensuring precision and efficiency
• Trusted by global clients for critical rework needs

Technical Specifications

• Capable of reballing BGAs with 0.4 mm pitch and larger
• Ball-attach services available for LGA and QFN packages
• Conformance to J-STD-001, GEIA-STD-0006, IEC TS 62647-4, and IPC 7711/7721
• Post-reball verification and inspection options, including shear testing, XRF, alloy verification, visual Inspection, X-ray inspection, and component marking
• Reball fixtures are custom-machined, not adjustable to maintain tolerances
• Two inline Heller reflow ovens and 8 Martin Reball Mini-Ovens

Compliance / References

• 9.4.1 BGA Component Reballing, Braid Ball Removal, Mini-Oven Attachment Method
• 9.4.2 BGA Component Reballing, Braid Ball Removal, Reflow Oven Attachment Method
• 9.4.3 BGA Component Reballing, Robotic Ball Removal, Mini-Oven Attachment Method
• 9.4.4 BGA Component Reballing, Robotic Ball Removal, Reflow Oven Attachment Method
• 9.5.1 BGA Component Removal, Machining Method
• GEIA-STD-0006 Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
• IPC 7711/7721 Rework, Modification, and Repair of Electronic Assemblies
• IPC-JEDEC-J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
• IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
• IPC-J-STD-002 Solderability Tests for Component Leads, terminations, Lugs, Terminals and Wires
• IPC-J-STD-004 Requirement for Soldering Fluxes
• IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
• IPC-7095 Design and Assembly Process Implementation for BGAs
• IPC-7525 Stencil Design Guidelines (Solder Paste)
• IEC TS 62647-4 Process management for avionics - Aerospace and defense electronic systems containing lead-free solder
• J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
• JEDEC J-STD-020 Moisture/Reflow Sensitivity Classification
• JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
• JESD22-B101 External Visual Standard
• MIL-STD-202 Test Method Standard Electronic and Electrical Component Parts
• MIL-STD-750 Department of Defense Test Method Standard Microcircuits
• MIL-STD-883 Department of Defense Test Method Standard Microcircuits

Images

Figure 1. BGA components come in all sizes, and newer AI BGA chips can be very large.

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