In electronics manufacturing, engineering changes and product upgrades are unavoidable. At Circuit Technology Center, our IPC-certified specialists provide precise and repeatable ECO services to ensure that critical modifications are executed with accuracy and precision. From surface-mount and BGA rework to jumper wire additions and circuit isolation, our team combines specialized equipment with decades of expertise to deliver exceptional results. Using advanced milling and drilling systems, we execute micron-level circuit trace cuts and modifications, even in densely populated areas. With over 40 years of experience, we are trusted to deliver reliable, standards-based solutions for the most complex ECO requirements.
Key Highlights
- IPC-certified rework specialists with extensive training
- Over four decades of industry experience
- Proven expertise in surface-mount and BGA rework
- Advanced milling and drilling systems for circuit modification
- Precision control for internal and external trace isolation
- Documented and illustrated jumper wire standards
- Trusted by leading manufacturers for high-reliability results
Technical Specifications
- Surface-mount and BGA rework for engineering changes
- Jumper wire installation with precision routing, anchoring, and termination
- Circuit pattern isolation and trace cuts with micron-level control
- Precision milling and drilling for surface and internal circuitry
- Ability to modify densely populated PCB areas with accuracy
- Compliance with IPC standards for ECO procedures
Compliance / References
- 6.1 Jumper Wires
- 6.2.1 Jumper Wires, BGA Components, Circuit Track Method
- 6.2.2 Jumper Wires, BGA Components, Through-Board Method
- 6.3 Component Modifications and Additions
- IPC-7711/7721 Rework, Modification, and Repair of Electronic Assemblies
- IPC-A-600 Acceptability of Printed Boards
- IPC-A-610 Acceptability of Electronic Assemblies
- IPC-A-620 Requirements and Acceptance for Cable and Wire Harness Assemblies
- IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
- IPC-J-STD-004 Requirement for Soldering Fluxes
- IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed
- IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
- IPC-JEDEC-J-STD-033 Handling, Packing, Shipping, and Use of Moisture, Reflow, and Process Sensitive Devices
- JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
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