Services Index

With six fully programmable robotic hot solder dip systems, Circuit Technology Center provides precision component tinning for tin whisker mitigation, gold removal, and solderability enhancement to GEIA-STD-0006 and J-STD-001 standards.

BGA Component Reballing

Our BGA reballing service restores components with precision and full IPC/JEDEC compliance. Using advanced Air-Vac systems, custom fixtures, and rigorous inspection, we deliver high-reliability rework for critical electronic assemblies.

BGA Component Rework

Trusted worldwide, we deliver expert BGA rework and repair services - from component removal to BGA pad repair and x-ray inspection - using IPC-approved methods and advanced equipment for unmatched precision and quality.

Component Salvage and Reclaim

Circuit Technology Center delivers precision component salvage and reclamation for obsolete or hard-to-source parts. Using advanced hot-gas rework and robotic solder dip systems, we restore components to standards-compliant condition with full traceability and quality control.

Circuit Board Modification

Circuit Technology Center delivers precise, IPC-compliant ECO services, including BGA rework, jumper wire installation, and micron-level trace isolation. With 40+ years of expertise, our team ensures reliable engineering changes on complex PCB assemblies.

BGA Site Modification

Standard jumper wires won't fit under BGAs - but our flat copper ribbon solution will. This IPC-recommended procedure, pioneered here, delivers precise, low-profile BGA site modifications trusted by engineers worldwide.

Component Rework

Advanced circuit board rework and component salvage demand precision. With 100+ specialized systems, Circuit Technology Center restores surface-mount and through-hole assemblies to IPC-compliant standards, ensuring structural and electrical integrity.

BGA Component Milling

Removing BGA components with underfill requires precision to overcome the mechanical bond without damaging the circuit board. Using specialized CNC milling systems, Circuit Technology Center ensures clean, controlled, damage-free removal.

X-ray Inspection Services

Circuit Technology Center delivers precision X-ray inspection for BGA rework using the Dage Quadra 7 system. Sub-micron imaging reveals hidden solder defects, misalignment, and reflow issues, ensuring reliable performance for aerospace, defense, and advanced electronics.

Base Board Repair

Our expert technicians repair damaged circuit boards using proven IPC-based methods to restore reliability. Every project is carefully evaluated, quoted in advance, and completed to the highest quality standards for commercial and military applications.

Circuitry/Plated Hole Repair

Circuit Technology Center restores damaged circuit traces and plated through holes using IPC-recommended PCB repair methods. Precision foil jumpers and eyelet installation replicate original manufacturing quality for high-reliability electronics.

SMT/BGA Pad Repair

ircuit Technology Center performs SMT and BGA pad repair using IPC-recommended, dry-film adhesive methods. Precision-fabricated pads restore structural and electrical integrity, ensuring reliable, standards-compliant PCB performance.

Coating/Marking Rework

Circuit Technology Center delivers precision coating removal and solder mask repair using IPC-compliant methods. We modify, reapply, and update board surfaces, supporting high-reliability aerospace, defense, and advanced electronics programs.

Gold Contact Plating

Circuit Technology Center restores damaged gold edge contacts using IPC-compliant brush plating with high-purity gold. Our controlled process ensures proper thickness, adhesion, and durability—returning contacts to like-new condition for reliable performance.

Keysight Adapter Rework

Circuit Technology Center partners with Keysight to deliver a turn-key BGA testing solution for direct DIMM validation. Using W2630A DDR2 probes, we ensure high-fidelity signal capture, precise installation, and reliable memory validation in development and production.

Tape and Reel Service

Circuit Technology Center offers fast, EIA-481-compliant tape and reel services for SMT, through-hole, and custom components. Includes MSL dry bake and moisture barrier packaging per J-STD-033 and J-STD-020 standards.

Trim and Form

Circuit Technology Center provides precision trimming and forming for SMT, axial, and radial components, ensuring dimensional accuracy and solderability. Services integrate optical verification, MSL control, and robotic hot solder dip for reliable component trim and form performance.

Circuit Board Rework and Repair, Component Tinning, and Reballing

Circuit Technology Center is recognized as the world's most innovative and reliable specialist in circuit board repair, rework, and component-level modification services.