The removal and replacement of surface-mount and through-hole components are fundamental to circuit board rework; however, modern package designs and high-density assemblies require advanced expertise. Circuit Technology Center is equipped with over 100 specialized rework systems from leading manufacturers, enabling us to support virtually any rework requirement with precision and repeatability. From convection and conduction-based methods for surface mount devices to solder fountain systems for high-pin-count through-hole components, our team delivers reliable results. With decades of experience, we provide trusted rework and salvage services that meet the industry's highest standards.
Key Highlights
- Over 100 specialized rework systems from industry leaders
- Expertise in both surface mount and through-hole rework
- Convection and conduction methods tailored to component needs
- Advanced solder fountain systems for high-pin-count devices
- Skilled technicians ensuring safe, reliable rework
- Proven capability across complex and high-density assemblies
- Component salvage and preparation for reuse
- Trusted track record with aerospace, defense, and electronics clients
Technical Specifications
- Surface mount rework: conduction for small parts, convection for larger or heat-sensitive packages
- Controlled point-to-point soldering for precise replacement
- Through-hole rework: vacuum desoldering for simple extractions
- Solder fountain systems for complex, multi-lead components
- Salvage processes to recover and prepare components for redeployment
- Structural and electrical integrity are maintained throughout the process
- Industry-compliant processes ensuring repeatable results
Compliance / References
- 8.0 Rework Procedures
- 9.0 BGA Component Rework and Reballing Procedures
- IPC-7711/7721 Rework, Modification, and Repair of Electronic Assemblies
- IPC-A-610 Acceptability of Electronic Assemblies
- IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
- IPC-J-STD-004 Requirement for Soldering Fluxes
- IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
- JESD22-B101 External Visual Standard
- IPC-7525 Stencil Design Guidelines (Solder Paste)
- IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
- IPC-JEDEC-J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
- JESD625C.01_Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
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