Tinning Services

Circuit Technology Center offers advanced component tinning services using fully programmable Robotic Hot Solder Dip (RHSD) systems for precise and repeatable results. Whether mitigating tin whiskers by converting from lead-free to tin-lead or removing gold plating to ensure solder joint reliability, our processes are tightly controlled for depth, angle, dwell time, and temperature. All services are performed to GEIA-STD-0006 and J-STD-001 standards, ensuring 100% finish replacement and consistent solderability. With segregated lead-free equipment, comprehensive inspection, and flexible packaging options, we deliver industry-compliant solutions tailored to your requirements.

• Six fully programmable Robotic Hot Solder Dip systems with precise process control
• Complete compliance with GEIA-STD-0006 and J-STD-001 standards
• Guaranteed 100% finish replacement, including gold removal
• Segregated equipment for RoHS-compliant tinning
• Pre- and post-process inspections with batch cleaning and MSL baking
• Flexible packaging in JEDEC trays, waffle packs, or tape and reel
• In-house testing capabilities for solderability, alloy composition, and cleanliness
• Over four decades of expertise in high-reliability component services

• Lead-free to tin-lead (Sn63/Pb37) conversion for tin whisker mitigation
• Gold and oxidation removal with full finish replacement
• Batch cleaning and MSL bake-out per J-STD-033
• Testing capabilities:
  * Ionic cleanliness (ROSE) per IPC-TM-650-2.3.25
  * XRF alloy composition and thickness per JESD 213
  * Solderability per J-STD-002
  * Visual inspection
  * SAM testing per J-STD-035
  * Destructive physical analysis (DPA) per MIL-STD-1580
  * Hermeticity testing per MIL-STD-883
  * Temperature, humidity, and bias testing
  * Parametric testing
• Component reballing and tinning for BGAs, LGAs, QFPs, PLCCs, SOICs, SOT-23s, through-hole connectors, and discrete SMT devices
• Packaging and marking services:
  * Tape and reel per EIA-481
  * MSL dry bake per J-STD-033
  * MSL packaging per J-STD-020

• 11.0 Component Lead, Pin, Pad, and Termination Conditioning and Tinning
• 11.2 Component Termination Conditioning and Tinning, Chip/Discrete Components
• 11.3 Component Lead Conditioning and Tinning, Radial Lead Components
• 11.4 Component Lead Conditioning and Tinning, Axial Lead Components
• 11.5 Component Lead Conditioning and Tinning, J-Lead Components
• 11.6 Component Lead Conditioning and Tinning, Gull Wing Components
• 11.7 Component Pad Conditioning and Tinning, Leadless Components
• 11.8 Component Pin Conditioning and Tinning, Connectors, Through-Hole
• GEIA-STD-0006 Requirements for Using Robotic Hot Solder Dip to Replace the Finish on Electronic Piece Parts
• IPC-J-STD-001 Requirements for Soldered Electrical and Electronic Assemblies
• IPC-J-STD-004 Requirement for Soldering Fluxes
• IPC J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
• IPC-JEDEC-J-STD-020 Moisture/Reflow Sensitivity Classification for Nonhermetic Surface Mount Devices
• IPC-JEDEC-J-STD-033 Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
• JESD22-B101 External Visual Standard
• JESD625C.01 Requirements for Handling Electrostatic-Discharge-Sensitive (ESDS) Devices
• MIL-PRF-38535 Performance Specification Circuits (Microcircuits) Manufacturing, General Specification
• MIL-STD-202 Test Method Standard Electronic and Electrical Component Parts
• MIL-STD-883 Department of Defense Test Method Standard Microcircuits