Our component tinning service utilizes fully programmable and automated robotic hot solder dip (RHSD) equipment to change the metallic finish of component leads or pads. Whether you need to convert components from a lead-free solder finish to a leaded solder (Sn63/Pb37) finish for tin whisker mitigation or require gold plating removal from component leads, our component tinning service will ensure precise control over the entire process. The removal of oxidation from component leads can also be completed by hot solder dip.
Our state-of-the-art robotic hot solder dip (RHSD) equipment precisely controls dip depth, angles, dwell times, and temperatures for the processing of components in full compliance with GEIA-0006 standards. This highly automated, tightly controlled process ensures that 100% of the tin finish is removed and replaced with tin-lead (Sn63/Pb37).
Gold removal is completed in strict accordance with J-STD-001 specifications.
Additionally, we offer dedicated lead-free equipment for lead-free, RoHS-compliant component tinning applications.
We use batch wash systems for post-process cleaning, component MSL bake and packaging, and pre/post-process testing as needed. Components can be repackaged in either JEDEC trays, waffle packs or tape and reel.
Additional Component Modification Services and More Information