News Release Index

May 28, 2026

Circuit Technology Center, Inc. Expands High-Volume BGA Reballing Capacity with Investment in Additional Reflow Oven

Circuit Technology Center, Inc. announced the purchase of an additional reflow oven to support the company’s growing high-volume BGA reballing operations. The investment reinforces the company’s commitment to delivering fast turnaround times, consist...

April 8, 2026

IPC-7712 Development Advances at IPC APEX EXPO: Committee Aligns on Scope, Structure, and Industry Priorities

Significant progress was made in developing the proposed standard IPC-7712, Component Safe Removal for Failure Analysis and Reclamation, during in-person meetings held at IPC APEX EXPO, March 16 to 18. The working group, composed of industry experts ...

March 16, 2026

IPC Committee Launches Development of New Standard: IPC-7712 Component Safe Removal for Failure Analysis and Reclamation

Industry experts from across the electronics manufacturing sector will meet this week to continue formal development work on a new IPC standard titled IPC‑7712 Component Safe Removal for Failure Analysis and Reclamation. The effort brings together le...

February 18, 2026

White Paper Explores Cold Precision Milling for Underfilled BGA Removal

Circuit Technology Center, Inc., a leader in high-reliability circuit board rework and component-level modification, has released a technical white paper: Cold Precision Milling for Underfilled BGA Component Removal. Available at www.circuitrework.co...

October 2, 2025

Circuit Technology Center Expands Robotic Tinning Capacity with Two Additional Hentec/RPS Odyssey 1325 Machines

Haverhill, MA — Circuit Technology Center, Inc., a leader in circuit board rework, repair, and modification, is pleased to announce the addition of two new Hentec/RPS Odyssey 1325 robotic hot solder dip component lead tinning machines to its pr...

September 13, 2024

Circuit Technology Center Announces Expanded Tinning Services Capacity

Circuit Technology Center announces it has expanded its electronic component tinning services capacity. Four (4) Hentec-Odyssey 1325 robotic hot solder dip machines are in full operation to meet the increasing demand from the defense and high-reliabi...

November 9, 2023

Circuit Technology Center Announces New Component Trim and Form Service

Circuit Technology Center has added the capability to trim and form electronic component packages to customers' exact pre-assembly specifications. Customers can also propose a trim and lead-form drawing if needed. Dedicated, custom tooling can be fab...

October 3, 2023

New Technical Paper Unveils Key Strategies for Successful BGA Rework

Circuit Technology Center has released a new technical paper highlighting six common mistakes encountered during BGA rework operations. This new paper offers valuable insights and effective methods to help prevent their occurrence. See the full paper...

August 17, 2023

New Paper Details Essential Rules for Circuit Board Jumper Wire Adds

This new technical paper from Circuit Technology Center explores ten crucial guidelines for secure, organized, and industry-standard attachment and routing of jumper wires on circuit board assemblies, ensuring reliability and optimal connections. See...

July 12, 2023

Whitepaper Discusses Critical Process Steps for High Reliability BGA Device Re-balling

The re-balling of BGA components from lead-free to tin-lead solder is a critical requirement by some high-reliability customer applications due to tin-whisker mitigation concerns. This technical paper by Circuit Technology Center discusses the key pr...

May 30, 2023

CircuitMedic Unveils the Ultimate Tool Set for Electronics Techs

CircuitMedic, a leading provider of innovative solutions for electronic circuit board repair and rework, has assembled the ultimate benchtop tool set for serious electronics technicians and professionals. This curated selection of nine finely-crafted...

March 27, 2023

Circuit Technology Center Announces New Series of CircuitMedic Circuit Frames

Circuit Technology Center announces the release of a new series of CircuitMedic brand Circuit Frames. Circuit Frames contain replacement circuit patterns, lands, SMT pads, BGA pads, and gold edge contacts used for the repair of damaged printed circui...

February 27, 2023

White Paper Discusses Key Considerations for Electronic Component Tin Whisker Mitigation

The phenomenon of tin whiskers in printed circuit board assembly is a failure mechanism associated with electronic devices that use lead-free solder alloys containing low melting point elements such as tin, cadmium, or indium. In this white paper, Ci...

January 17, 2023

Circuit Technology Center At IPC-APEX Expo Booth #2936

Visitors to this year’s IPC-APEX Expo, which will be held at the San Diego Convention Center from January 24-26th, 2023, are invited to stop by booth #2936 to learn more about the industry-leading circuit board and component rework and modification s...

November 1, 2022

New White Paper Examines Key Steps to Component Lead Tinning

The motivation behind component lead tinning is to facilitate the removal of gold plating to eliminate the risk of gold embrittlement, tin whisker mitigation, or processing components for applications that require refinishing with lead-free solder fo...

September 26, 2022

Circuit Technology Center Expands BGA Re-balling Capacity

Circuit Technology Center announced it recently received and commissioned a second Heller 1707-MK III in-line solder reflow oven. This new machine doubles the existing in-line reflow oven capacity to meet increasing customer demand for high-volume BG...

August 4, 2022

Technical Paper Details Essential Practices for Gold Mitigation of Electronic Components

Gold plating removal from the solderable surfaces of electronic components is required for many electronic components due to gold embrittlement concerns. The ideal method to facilitate the removal of gold plating from SMT and through-hole components ...

May 11, 2022

New Article Details Electronic Device Salvage Process Considerations

The industry-wide electronic device shortage has created an increasing demand for the selective salvage and reclamation of valuable and difficult-to-source electronic devices from obsolete or unneeded assembled printed circuit boards. In a new articl...

February 15, 2022

Circuit Technology Center Releases Thirteen New Component Tinning Procedures

A new section, 10.0 Component Tinning Procedures, includes thirteen newly published procedures added to the popular online guidebook developed and written by Circuit Technology Center. This free online guidebook now contains 115 step-by-step procedur...

October 7, 2021

Circuit Technology Center Releases Updated Rework and Repair Guidebook

Several new procedures covering Ball Grid Array component re-balling and inspection have been added to the popular online guidebook developed and written by Circuit Technology Center. This free online guidebook contains 92 step-by-step procedures, is...

September 16, 2021

Circuit Technology Center Enhances Robotic Hot Solder Dip Capability

Circuit Technology Center announces it has enhanced its component-level modification services capability with the addition of a robotic hot solder dip (RHSD) machine dedicated to the lead-free processing of components for applications that require re...

August 18, 2021

Circuit Technology Center Announces Facility Expansion

Circuit Technology Center announces that it has expanded its Haverhill, Massachusetts facility by over 10,000 square feet. This facility expansion will allow more manufacturing floor space to accommodate additional equipment and personnel supporting ...

August 3, 2021

Circuit Technology Center Commissions New XRF X-ray System

Circuit Technology Center announces that it has recently purchased and commissioned an Oxford 980 X-Strata series XRF (x-ray fluorescence) system to support the testing of electronic components for restricted substances such as lead or tin above spec...

June 22, 2021

Circuit Technology Center Doubles Component-Level Modification Services Capacity

Circuit Technology Center has purchased two additional robotic hot solder dip (RHSD) machines from Hentec. The Odyssey 1325 systems are MIL-spec complaint, high-volume, high-mix component lead tinning machines equipped with auto load/unload and is ca...

May 12, 2021

Circuit Technology Center Details Component Salvage and Harvest Capabilities

For over 35 years, Circuit Technology Center has been dedicated to the repair and rework of printed circuit boards. Due to the industry-wide component chip shortage, the company reports that demand for requests to salvage and harvest valuable compone...

March 22, 2021

Circuit Technology Center Expands Component Modification Services Capabilities

Circuit Technology Center announces that it has recently installed and commissioned a second robotic hot solder dip (RHSD) machine, expanding its component modification and alteration service department. Applications for RHSD services include tin mit...

February 24, 2021

Circuit Technology Center Defines New Procedure for Rework of BGA's Underfilled with Non-reworkable Underfill Epoxy

Circuit Technology Center is frequently tasked with the selective rework of BGA devices that have been underfilled with “non-reworkable” underfill epoxy. Traditional, established rework methods of using either hot gas or IR reflow technology cannot b...

February 14, 2021

Circuit Technology Center Expands In-House Component Testing Services

Circuit Technology Center has recently purchased and commissioned an SCS Ionograph BTSP series ionic cleanliness test system to support cleanliness testing of electronic components. Cleanliness testing of components is often required by defense base ...

August 19, 2020

Circuit Technology Center Details A Quick Process For Through Hole Connector Rework

For over 35 years Circuit Technology Center has been reworking through hole connectors. In this blog post the authors detail a removal and replacement process that reflows all the solder joints at once using a solder fountain system in two quick oper...

July 7, 2020

Circuit Technology Center Defines a Method for Adding a Via Hole to an Assembled Circuit Board

Circuit Technology Center was tasked with a project to add missing vias on a batch of populated circuit boards. The vias were supposed to connect from surface circuitry, to an internal ground layer. Every other element of the design was intact, excep...

June 4, 2020

Circuit Technology Center Provides Review for Hot Air Component Rework of SMT Components

The techs at Circuit Technology Center have been reworking through-hole and surface mount components since 1983. That's millions of individual removal and replacement cycles. You learn much is nearly 4 decades and Circuit Technology Center has put to...

June 3, 2020

Circuit Technology Center, Inc. Recognized by Raytheon’s Integrated Defense Systems Business with 3-Star Honor.

Raytheon’s Integrated Defense Systems business instituted the annual Supplier Excellence Awards program to recognize suppliers who have provided outstanding service and partnership in exceeding customer requirements. Award candidates are judged on ce...

May 19, 2020

Circuit Technology Center Outlines Tips for Rework of Large Scale BGA Devices

For well over a decade Circuit Technology Center has been providing services to rework BGA devices. Their team has put together several tips to help manage this challenging activity and has written an article on the topic. This blog post details step...

May 19, 2020

Circuit Technology Center Details Steps for Repair of Burned Circuit Boards

Every business day Circuit Technology Center receives damaged circuit board assemblies from customers around the globe. Projects may include component rework, pad repair, edge contact plating, installing jumper wires, and more. These are activities ...

May 10, 2020

Circuit Technology Center Develops Challenging Broken Pin Fix

While working with an extremely expensive pin grid array style component, a Circuit Technology Center customer reported that they broke off a pin at the base near the component body. Any repair would have to endure the mechanical stress of insertion,...

May 7, 2020

Circuit Technology Center Announces New Robotic Hot Solder Dip Capabilities

Circuit Technology center is proud to announce its newest machine, the Robotic Hot Solder Dip. This machine is being run by three men who have studied this machine from the inside to the outside. The new Robotic Hot Solder Dip system is helping save ...

July 26, 2017

Circuit Technology Center Announces ISO 9001:2015 Certification

Circuit Technology Center announced today that the company has attained certification in the most recent ISO 9001 standard, ISO 9001:2015. Circuit Technology Center has transitioned from the 2008 to the 2015 standard. Achieving this certification dis...

November 25, 2014

Complimentary Rework and X-ray Workshop Presented by Circuit Technology Center and Nordson Dage

Circuit Technology Center and Nordson Dage will be sponsoring a Rework and X-ray Workshop on December 10th at 10:00 am. This free workshop will take place at Circuit Technology Center's headquarters located at 22 Parkridge Road, Haverhill, Massachuse...

September 9, 2014

A 25X Microscope That Fits Right in Your Pocket From CircuitMedic

The 25X Measuring Microscope Pen from CircuitMedic is a powerful pocket sized microscope with measuring reticle for precision measurements. This pen is ideal for inspecting defects and measuring conductor and pad widths, plated holes, and other tiny...

August 20, 2014

Circuit Technology Center Receives Award from Raytheon

Circuit Technology Center, an innovative specialist in circuit board repair and rework was recognized for their outstanding performance as a supplier to Raytheon Integrated Defense Systems (IDS) at the Supplier Excellence Conference held in Waltham, ...

March 14, 2011

Circuit Technology Center Announces Certification to ISO 9001:2008

Circuit Technology Center is an industry leader in circuit board repair and rework, the company announced today that they are honored to have been awarded the ISO 9001:2008 certification for Quality Management System (QMS). Circuit Technology Center...

March 11, 2010

Maximize Electronics Longevity and Cut Costs with BGA Reballing

For electronics manufacturers, repair shops, and high-reliability industries, BGA reballing is more than just a repair process, it is a strategic way to save time and reduce costs while extending the life of valuable components. By refurbishing the s...