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Guides
Outline
Circuit Board Repair and Rework Guide
Section 2: Coating removal and replacement.
The information within these guides should be helpful to anyone who works with bare circuit boards and circuit board assemblies. These guides are packed with illustrations and videos and follow popular IPC standards.

These guides will help you through the maze of challenges you face when working on modern, high density circuit boards. If your company complies with ISO-9000 or any demanding quality standard, you can refer to these guides as your on-line reference.

Circuit Board Repair and Rework Guide
Section 3: Base board repair.
Guides in sections 1 through 6 detail the proper step-by-step techniques, tools and materials, and cautions needed to reliably repair and modify bare and assembled circuit boards.

Guides in sections 7 through 9 detail the proper step-by-step techniques, tools and materials, and cautions needed to reliably rework assembled circuit boards covering soldering, desoldering and BGA rework procedures.

Circuit Board Repair and Rework Guide
Section 4: Conductor repair.
Each procedure includes a "Conformance Level" indicated as high, medium or low. This Conformance Level indicates how closely the repaired or reworked product will be to the original specifications. The Conformance Level listed for each procedure should be used as a guide only.

Each procedure also includes a "Skill Level" providing a gauge for the requisite experience and skill needed by the operator to obtain a reliable outcome.

Circuit Board Repair and Rework Guide
Section 7, 8 and 9: Soldering, desoldering and BGA rework.
Skill Levels are listed as intermediate, advanced, or expert. The Skill Level recommended should be used as a guide only.

Hundreds of detailed illustrations, as shown below, are included throughout this guidebook.

Visit the Foreword for more information on this guidebook and how it can be used at your company to reduce waste.
Guide Index
1.0 Foreword
2.0 Basic Procedures
2.1 Handling Electronic Assemblies
2.2 Cleaning
2.2.1 Cleaning, Local
2.2.2 Cleaning, Aqueous Batch Process
2.3.1 Coating Removal, Identification of Coating
2.3.2 Coating Removal, Solvent Method
2.3.3 Coating Removal, Peeling Method
2.3.4 Coating Removal, Thermal Method
2.3.5 Coating Removal, Grinding/Scraping Method
2.3.6 Coating Removal, Micro Blasting Method
2.4.1 Coating Replacement, Solder Mask
2.4.2 Coating Replacement, Conformal Coating, Encapsulant
2.4.3 Coating Replacement, Solder Mask, BGA Locations
2.5 Baking and Preheating
2.6.1 Legend/Marking, Stamping Method
2.6.2 Legend Marking, Hand Lettering Method
2.6.3 Legend Marking, Stencil Method
2.7 Epoxy Mixing and Handling
3.0 Base Board Procedures
3.1 Delamination/Blister Repair, Injection Method
3.2 Bow and Twist Repair
3.3.1 Hole Repair, Epoxy Method
3.3.2 Hole Repair, Transplant Method
3.4.1 Key and Slot Repair, Epoxy Method
3.4.2 Key and Slot Repair, Transplant Method
3.5.1 Base Material Repair, Epoxy Method
3.5.2 Base Material Repair, Area Transplant Method
3.5.3 Base Material Repair, Edge Transplant Method
4.0 Conductor Procedures
4.1.1 Lifted Conductor Repair, Epoxy Method
4.1.2 Lifted Conductor Repair, Film Adhesive Method
4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
4.2.3 Conductor Repair, Welding Method
4.2.4 Conductor Repair, Surface Wire Method
4.2.5 Conductor Repair, Through Board Wire Method
4.2.6 Conductor Repair, Inner Layer Method
4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method
4.3.1 Circuit Cut, Surface Circuits
4.3.2 Circuit Cut, Inner Layer Circuits
4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through
4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method
4.4.1 Lifted Land Repair, Epoxy Seal Method
4.4.2 Lifted Land Repair, Film Adhesive Method
4.5.1 Land Repair, Epoxy Method
4.5.2 Land Repair, Film Adhesive Method
4.6.1 Edge Contact Repair, Epoxy Method
4.6.2 Edge Contact Repair, Film Adhesive Method
4.6.3 Edge Contact Repair/Rework, Plating Method
4.7.1 Surface Mount Pad Repair, Epoxy Method
4.7.2 Surface Mount Pad Repair, Film Adhesive Method
4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
4.7.4 Surface Mount, BGA Pad with Integral Via Repair
4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method
5.0 Plated Hole Procedures
5.1 Plated Hole Repair, No Inner Layer Connection
5.2 Plated Hole Repair, Double Wall Method
5.3 Plated Hole Repair, Inner Layer Connection
6.0 Jumper Wire and Component Modification Procedures
6.1 Jumper Wires
6.2.1 Jumper Wires, BGA Components, Circuit Track Method
6.2.2 Jumper Wires, BGA Components, Through Board Method
6.3 Component Modifications and Additions
6.4 Component Lead Cutting and Lifting
7.0 Soldering Procedures
7.1.1 Soldering Basics
7.1.2 Preparation For Soldering And Component Removal
7.1.3 Solder Joint Acceptance Criteria
7.2.1 Soldering Through Hole Components, Point To Point Method
7.2.2 Soldering Through Hole Components, Solder Fountain Method
7.3.1 Soldering Surface Mount Chip Components, Point To Point Method
7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method
7.4.1 Soldering Surface Mount J Lead Components Point To Point Method
7.4.2 Soldering Surface Mount J Lead Components Continuous Flow Method
7.4.3 Soldering Surface Mount J Lead Components Hot Gas Method
7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method
7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method
7.5.3 Soldering Surface Mount Gull Wing Components Hot Gas Method
8.0 Component Rework Procedures
8.1.1 Component Removal, Through Hole Components, Vacuum Method
8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
9.0 BGA Component Rework Procedures
9.1.1 BGA Component Rework Process Flow
9.1.2 BGA Component Rework Inspection
9.2.1 BGA Component Rework Profile Development, Standard Method
9.2.2 BGA Component Rework Profile Development, Smart Track Method
9.3.1 BGA Component Rework
9.4.1 BGA Component Reballing, Fixture Method