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Guides
Outline
Guide
Section 2: Coating removal and replacement.
The information within these guides should be helpful to anyone who works with bare circuit boards and circuit board assemblies. These guides are packed with illustrations and videos and follow popular IPC standards.

These guides will help you through the maze of challenges you face when working on modern, high density circuit boards. If your company complies with ISO-9000 or any demanding quality standard, you can refer to these guides as your on-line reference.

Guide
Section 3: Base board repair.
Guides in sections 1 through 6 detail the proper step-by-step techniques, tools and materials, and cautions needed to reliably repair and modify bare and assembled circuit boards.

Guides in sections 7 through 9 detail the proper step-by-step techniques, tools and materials, and cautions needed to reliably rework assembled circuit boards covering soldering, desoldering and BGA rework procedures.

Guide
Section 4: Conductor repair.
Each procedure includes a "Conformance Level" indicated as high, medium or low. This Conformance Level indicates how closely the repaired or reworked product will be to the original specifications. The Conformance Level listed for each procedure should be used as a guide only.

Each procedure also includes a "Skill Level" providing a gauge for the requisite experience and skill needed by the operator to obtain a reliable outcome.

Guide
Section 7, 8 and 9: Soldering, desoldering and BGA rework.
Skill Levels are listed as intermediate, advanced, or expert. The Skill Level recommended should be used as a guide only.

Hundreds of detailed illustrations, as shown below, are included throughout this guidebook.

Visit the Foreword for more information on this guidebook and how it can be used at your company to reduce waste.

Guide Index


1.0 Foreword
Introduction to our comprehensive circuit board repair and rework guidbook.
2.0 Basic Procedures
List of procedures covering handling, cleaning, coating removal, coating replacement, solder mask repair, baking, preheating, legend, marking, and epoxy mixing.
2.1 Handling Electronic Assemblies
Procedure covering including electrostatic discharge (ESD),
electrical overstress (EOS), ESD/EOS safe work areas and handling and storage methods.
2.2 Cleaning
Procedure covers local cleaning and cleaning using an aqueous batch process for circuit boards.
2.2.1 Cleaning, Local
Procedure covers local cleaning for circuit boards.
2.2.2 Cleaning, Aqueous Batch Process
Procedure covers cleaning using an aqueous batch process for circuit boards.
2.3.1 Coating Removal, Identification of Coating
This procedure covers the techniques for identifying various coatings so that the appropriate coating removal method can be selected.
2.3.2 Coating Removal, Solvent Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.3 Coating Removal, Peeling Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.4 Coating Removal, Thermal Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.5 Coating Removal, Grinding/Scraping Method
Procedure covers the methods for removal of coatings on circuit boards.
2.3.6 Coating Removal, Micro Blasting Method
Procedure covers the methods for removal of coatings on circuit boards.
2.4.1 Coating Replacement, Solder Mask
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
2.4.2 Coating Replacement, Conformal Coating, Encapsulant
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
2.4.3 Coating Replacement, Solder Mask, BGA Locations
Procedure covers the methods for replacement of coatings and solder mask on circuit boards.
2.5 Baking and Preheating
Procedure covers baking and heating of circuit boards.
2.6.1 Legend/Marking, Stamping Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
2.6.2 Legend Marking, Hand Lettering Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
2.6.3 Legend Marking, Stencil Method
Procedure covers the methods for repair and replacement of legend and markings on circuit boards.
2.7 Epoxy Mixing and Handling
Procedures covering method for epoxy mixing for work on circuit boards.
3.0 Base Board Procedures
List of procedures covering delamination and blister repair, bow and twist repair, repair of non-plated holes and slots and base board repair on circuit boards.
3.1 Delamination/Blister Repair, Injection Method
Procedures covering delamination and blister repair on circuit boards.
3.2 Bow and Twist Repair
Procedures covering bow and twist repair on circuit boards.
3.3.1 Hole Repair, Epoxy Method
Procedures covers repair of non-plated holes on circuit boards.
3.3.2 Hole Repair, Transplant Method
Procedures covers repair of non-plated holes on circuit boards.
3.4.1 Key and Slot Repair, Epoxy Method
Procedure covers repair of slots on circuit boards.
3.4.2 Key and Slot Repair, Transplant Method
Procedure covers repair of slots on circuit boards.
3.5.1 Base Material Repair, Epoxy Method
Procedure covers repair of damaged base board on circuit boards.
3.5.2 Base Material Repair, Area Transplant Method
Procedure covers repair of damaged base board on circuit boards.
3.5.3 Base Material Repair, Edge Transplant Method
Procedure covers repair of damaged base board on circuit boards.
4.0 Conductor Procedures
List of procedures to repair lifted and damaged conductors, circuits, lands, surface mount pads, gold edge contacts, BGA pads, cut surface and internal circuits and conductors, and rework and modify plated holes.
4.1.1 Lifted Conductor Repair, Epoxy Method
Procedure to repair lifted conductors and circuits.
4.1.2 Lifted Conductor Repair, Film Adhesive Method
Procedure to repair lifted conductors and circuits.
4.2.1 Conductor Repair, Foil Jumper, Epoxy Method
Procedure to repair damaged conductors and circuits.
4.2.2 Conductor Repair, Foil Jumper, Film Adhesive Method
Procedure to repair damaged conductors and circuits.
4.2.3 Conductor Repair, Welding Method
Procedure to repair damaged conductors and circuits.
4.2.4 Conductor Repair, Surface Wire Method
Procedure to repair damaged conductors and circuits.
4.2.5 Conductor Repair, Through Board Wire Method
Procedure to repair damaged conductors and circuits.
4.2.6 Conductor Repair, Inner Layer Method
Procedure to repair damaged conductors and circuits.
4.2.7 Conductor Repair, Surface Plane, Film Adhesive Method
Procedure to repair damaged conductors and circuits.
4.3.1 Circuit Cut, Surface Circuits
Procedure to cut conductors and circuits.
4.3.2 Circuit Cut, Inner Layer Circuits
Procedure to cut conductors and circuits.
4.3.3 Deleting Inner Layer Connection at a Plated Hole, Drill Through
Procedure to cut conductors and circuits.
4.3.4 Deleting Inner Layer Connection at a Plated Hole, Spoke Cut Method
Procedure to cut conductors and circuits.
4.4.1 Lifted Land Repair, Epoxy Seal Method
Procedure to repair lifted and damaged lands.
4.4.2 Lifted Land Repair, Film Adhesive Method
Procedure to repair lifted and damaged lands.
4.5.1 Land Repair, Epoxy Method
Procedure to repair lifted and damaged lands.
4.5.2 Land Repair, Film Adhesive Method
Procedure to repair lifted and damaged lands.
4.6.1 Edge Contact Repair, Epoxy Method
Procedure to repair lifted and damaged gold edge contacts.
4.6.2 Edge Contact Repair, Film Adhesive Method
Procedure to repair lifted and damaged gold edge contacts.
4.6.3 Edge Contact Repair/Rework, Plating Method
Procedure to repair and replate scratched, damaged and solder contaminated gold edge contacts.
4.7.1 Surface Mount Pad Repair, Epoxy Method
Procedure to repair damaged and lifted surface mount pads.
4.7.2 Surface Mount Pad Repair, Film Adhesive Method
Procedure to repair damaged and lifted surface mount pads.
4.7.3 Surface Mount, BGA Pad Repair, Film Adhesive Method
Procedure to repair damaged and lifted surface mount and BGA pads.
4.7.4 Surface Mount, BGA Pad with Integral Via Repair
Procedure to repair damaged and lifted surface mount and BGA pads.
4.7.5 Surface Mount, BGA Pad with Integral Via Repair Circuit Extension Method
Procedure to repair damaged and lifted surface mount and BGA pads.
5.0 Plated Hole Procedures
List of procedures to repair damaged plated holes on circuit boards.
5.1 Plated Hole Repair, No Inner Layer Connection
Procedure to repair damaged plated holes on circuit boards.
5.2 Plated Hole Repair, Double Wall Method
Procedure to repair damaged plated holes on circuit boards.
5.3 Plated Hole Repair, Inner Layer Connection
Procedure to repair damaged plated holes on circuit boards.
6.0 Jumper Wire and Component Modification Procedures
List of procedures covering jumper wires, modification procedures, engineering changes, and component lead cutting and lifting.
6.1 Jumper Wires
Procedure covering jumper wires on circuit boards.
6.2.1 Jumper Wires, BGA Components, Circuit Track Method
Procedure covering jumper wires on circuit boards.
6.2.2 Jumper Wires, BGA Components, Through Board Method
Procedure covering jumper wires on circuit boards.
6.3 Component Modifications and Additions
Procedure covering component modification and additions on circuit boards.
6.4 Component Lead Cutting and Lifting
Procedure covering component lead cutting and lifting on circuit boards.
7.0 Soldering Procedures
List of procedures including soldering basics, preparation for soldering, solder joint acceptance criteria, soldering of through hole components, surface mount chip components, J lead components, and gull wing components.
7.1.1 Soldering Basics
Procedure covers the basic concepts for high quality soldering.
7.1.2 Preparation For Soldering And Component Removal
Procedure covers preparation for soldering.
7.1.3 Solder Joint Acceptance Criteria
Page covers solder joint acceptance criteria.
7.2.1 Soldering Through Hole Components, Point To Point Method
Procedure covers soldering of through hole components.
7.2.2 Soldering Through Hole Components, Solder Fountain Method
Procedure covers soldering of through hole components.
7.3.1 Soldering Surface Mount Chip Components, Point To Point Method
Procedure covers soldering of surface mount chip components.
7.3.2 Soldering Surface Mount Chip Components, Hot Gas Method
Procedure covers soldering of surface mount chip components.
7.4.1 Soldering Surface Mount J Lead Components Point To Point Method
Procedure covers soldering of surface mount J lead components.
7.4.2 Soldering Surface Mount J Lead Components Continuous Flow Method
Procedure covers soldering of surface mount J lead components.
7.4.3 Soldering Surface Mount J Lead Components Hot Gas Method
Procedure covers soldering of surface mount J lead components.
7.5.1 Soldering Surface Mount Gull Wing Components, Point To Point Method
Procedure covers soldering of surface mount gull wing components.
7.5.2 Soldering Surface Mount Gull Wing Components, Continuous Flow Method
Procedure covers soldering of surface mount gull wing components.
7.5.3 Soldering Surface Mount Gull Wing Components Hot Gas Method
Procedure covers soldering of surface mount gull wing components.
8.0 Component Rework Procedures
List of component removal and rewok procedures including removal of through hole components, removal of chip components, removal of J lead components and removal of gull wing components.
8.1.1 Component Removal, Through Hole Components, Vacuum Method
Procedure covers removal of through hole components on assembled circuit boards.
8.1.2 Component Removal, Through Hole Components, Solder Fountain Method
Procedure covers removal of through hole components on assembled circuit boards.
8.2.1 Component Removal, Surface Mount Chip Components, Forked Tip Method
Procedure covers removal of surface mount chip components on assembled circuit boards.
8.2.2 Component Removal, Surface Mount Chip Components, Hot Tweezer Method
Procedure covers removal of surface mount chip components on assembled circuit boards.
8.3.1 Component Removal, Surface Mount J Lead Components, Conduction Method
Procedure covers removal of surface mount J lead components on assembled circuit boards.
8.3.2 Component Removal, Surface Mount J Lead Components, Hot Gas/Air Method
Procedure covers removal of surface mount J lead components on assembled circuit boards.
8.4.1 Component Removal, Surface Mount Gull Wing Components, Conduction Method
Procedure covers removal of surface mount gull wing components on assembled circuit boards.
8.4.2 Component Removal, Surface Mount Gull Wing Components, Hot Gas/Air Method
Procedure covers removal of surface mount gull wing components on assembled circuit boards.
9.0 BGA Component Rework Procedures
List of procedures covering BGA component rework on assembled circuit boards.
9.1.1 BGA Component Rework Process Flow
Page covers BGA component rework process flow instructions.
9.1.2 BGA Component Rework Inspection
Page covers BGA component rework inspection instructions.
9.2.1 BGA Component Rework Profile Development, Standard Method
Procedure covers steps involved in BGA component rework on assembled circuit boards.
9.2.2 BGA Component Rework Profile Development, Smart Track Method
Procedure covers steps involved in BGA component rework on assembled circuit boards.
9.3.1 BGA Component Rework
Procedure covers steps involved in BGA component rework on assembled circuit boards.
9.4.1 BGA Component Reballing, Fixture Method
Procedure covers steps involved in BGA component rework on assembled circuit boards.
Customer Comments
"We had never considered sending our rework projects until recently. The cost savings since we started using Circuit Technology Center has been significant. I hope we never have such a massive rework project again, but if we, do you'll be the first to get a call"
N.C. Fort Wayne, IN USA
The Toughest Component Rework?
The Toughest Component Rework?
Rework of surface mount and through hole components can be a challenge. Our techs are ready to tackle your toughest rework projects.
Learn more ...
Challenging Surface Mount Pad Repair
Challenging Surface Mount Pad Repair
Surface mount and BGA pad repair are routine operations at Circuit Technology Center. Learn how it's done with absolute precision and reliably.
Learn more ...
BGA Component Rework Simplified
BGA Component Rework Simplified
When you have tough BGA rework, where do you turn to? Discover the nation's #1 contractor for outsourced BGA rework, repair and reballing.
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Can You Repair a Broken Corner?
Can You Repair a Broken Corner?
What happens to an assembled circuit board with a broken corner? Can it be repaired reliably? It can if you have the training and the experience.
Learn more ...
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